Events

As uOLED and uLED technologies transition from research to high-volume manufacturing, system performance is increasingly constrained by process variability rather than design intent. Electrical, thermal, and mechanical decisions made during manufacturing directly translate into optical non-uniformity, efficiency loss, and reliability challenges. Understanding these process-to-performance linkages is critical for building scalable, high-performance emissive display systems. Virtual: https://events.vtools.ieee.org/m/533601

IEEE Event Agenda - Tuesday May 12, 2026 🔹 5:00 PM – 5:30 PM Registration, Refreshments, Food & Networking (Meet & Greet) Featured Speakers & Sessions 🔹 5:30 PM – 6:15 PM Topic 1: Industry Talk – Standardizing Automotive Firmware for SDVs Experts from Mercedes-Benz, Arm, and Athos Silicon will discuss the urgent need for a standardized, secure, and vendor-agnostic firmware foundation. Key focus areas: - Overcoming fragmented firmware ecosystems - UEFI as a scalable automotive standard - Enabling functional safety, cybersecurity, and interoperability - Supporting chiplet-based and next-gen ADAS architectures Speakers: - François Piednoël – (https://www.linkedin.com/in/francoispiednoel/) - Sachin Athanikar – (https://www.linkedin.com/in/sachin-athanikar-18ba5914/) - Dong Wei (https://www.linkedin.com/in/dongweimba/) 🔹 6:15 PM – 6:45 PM Topic 2: Academic Keynote – Safe Embodied AI: From Theory to Deployment Prof. Ding Zhao (Carnegie Mellon University) Topics include: - Rare-event safety in autonomous systems - Safe reinforcement and imitation learning - Generalizable and adaptive AI safety - Future of trustworthy embodied AI at scale Speaker: - Ding Zhao – (https://www.linkedin.com/in/ding-zhao-01130730/) 🔹 6:45 PM – 7:15 PM Topic 3: Industry Talk – Static Safety Is Dead: Continuous Risk & Compliance for SDVs Akshay Chalana (CEO & Co-founder, Saphira AI) Modern vehicles evolve continuously through software updates, AI-driven functionality, and increasing connectivity—yet safety and cybersecurity practices remain largely static. This talk explores: - What breaks when traditional safety assumptions no longer hold - Real-world ADAS/autonomy failure propagation: dataset bias, requirement drift, and system boundary ambiguity - Cross-domain challenges between safety and cybersecurity - A new model for continuous, system-aware risk assessment and compliance - Treating compliance artifacts as live infrastructure integrated into development pipelines This session provides a practical path to maintaining certification-grade rigor while operating at software velocity. Speaker: - Akshay Chalana – (https://www.linkedin.com/in/akshaychalana/) 🔹 7:15 PM – 7:30 PM Q&A and open discussion - Aditi Ramadwar About This Technical Forum This technical forum brings together OEMs, Tier-1 suppliers, semiconductor leaders, researchers, and innovators to address the challenge of fragmentation and define a unified, future-ready mobility stack. Who Should Attend: - Automotive engineers and architects - Safety and cybersecurity specialists - Semiconductor and embedded systems professionals - Researchers in autonomous vehicles and AI safety - Technical decision-makers from OEMs and suppliers - Students in Automotive, Compute, Mechanical & Electrical Engineering We would be delighted if you could join us and participate in shaping the future of intelligent transportation. Speaker(s): Francois, Wei , Sachin, Zhao, Akshay In-Person at: SEMI Headquarters, 673 S Milpitas Blvd, Milpitas, California, United States, 95035, Virtual: https://events.vtools.ieee.org/m/551666

It may surprise you that the world’s first hospital‑wide medical information system MIS-I (pronounced "MIS One") was pioneered in Silicon Valley by defense contractor Lockheed Missiles and Space Company in partnership with El Camino Hospital. This accomplishment is being recognized with the dedication of an IEEE Milestone plaque at El Camino Hospital on Thursday, May 14th. From one hospital in 1974 to two hundred in the late1990s and still installed at a few installations as late as 2020, MIS-I proved what a true systems‑engineering approach could accomplish in healthcare. It let physicians and staff across all departments access patient data and enter work orders electronically, eliminating handwritten versions and thereby reducing costs, improving safety, and laying the foundation of modern medical informatics. MIS-I and its successive embodiments were treated the way Lockheed treated spacecraft: as an integrated system. Working side‑by‑side with the hospital’s clinical staff, teams designed and configured each system in a way no competitor matched then and perhaps even now. That collaboration led Lockheed to a number of inventions, including: - A systems architecture that enabled near instantaneous response using 1970s IBM mainframe computers. - The light-pen controlled Video Matrix Terminal, a practical solution to the user‑interface problems of the era when staff couldn’t type fast enough, and the mouse was not available as a tool. - Matrix Programming (also known as Matrix Coding), a language that allowed screens to be created for clinical use without reprogramming the system. [] (https://events.vtools.ieee.org/vtools_ui/media/display/4fcf27c6-0748-4ee1-b6e2-ba5072afd995) [] The program includes a slide show and a video on the history of MIS‑I at El Camino Hospital, along with an interview of Mel Hodge by Deb Muro, CIO of El Camino Health. Mel drove the development of MIS‑I at Lockheed and continued on as the leader of Technicon Medical Information Systems Company. Executives from El Camino Health, IEEE, and Lockheed Martin will speak about the Milestone and the role MIS‑I played in the evolution of hospital information systems. The event will conclude with the dedication of the Milestone plaque. Virtual Attendance Suggested URL will be provided to registered attendees prior to start of event Limited In-Person Seating Available Please select In-Person only if you truly plan to attend Allow ample time for parking. Limited valet parking available at the hospital main entrance. Co-sponsored by: Silicon Valley Technology History Committee Agenda: Virtual Attendees Start Time Virtual Event 4:00 PM Live stream starts, includes historic slide show 4:15 PM Live stream of Program begins 5:30 PM Virtual event ends In-Person Attendees Start Time Live Event 3:45 PM Arrival and Historic Photo Slideshow 4:15 PM Program begins 5:30 PM Reception with Refreshments 6:30 PM Event ends El Camino Hospital, 2500 Grant Road, Mountain View, California, United States, 94040, Virtual: https://events.vtools.ieee.org/m/554746

Abstract: Active Magnetic Bearings (AMBs) are actuators that offer near-frictionless operation of spinning rotors. As is often the case with actuators used with feedback, magnetic bearings are driven with a high gain inner loop to linearize their input-output response for the stabilizing rotor position outer loop control development. The primary benefit of the high gain actuator is that the need for the outer loop to have an internal model of the magnetic bearings is mitigated. However, driving the magnetic bearings with high gain presents issues including increased noise, reduced stability margin, and sensitivity to rotor imbalance, motivating the inclusion of an internal model of the magnetic bearings. H_inf synthesis will be employed to demonstrate potential benefits of a low gain amplifier. And since magnetic bearings show temperature sensitivity, mu-synthesis will be leveraged to show that the benefits of a low gain amplifier can still be realized despite significant process noise and strict requirements. Models of AMB rotor systems will be shown to demonstrate their inherent issues and how a holistic control approach can solve them. Speaker(s): Jordan McCrone, Agenda: 6:00 - 6:30 - Networking and light dinner (for in person attendees) 6:30 - 7:30 - Talk and Q & A 7:30 - 8:00 - Wrap up and Networking Room: 116, Bldg: Bergin Hall, Santa Clara University, 500 El Camino Real, Santa Clara, California, United States, 95053, Virtual: https://events.vtools.ieee.org/m/558058

Continuation of Speaker Series at Stanford IEEE. Stanford, California, United States, 94305

[] (We anticipate closing registration in late April due to limited facility space; we apologize in advance if we cannot register you.) The 2026 Build-up Substrate Symposium (BUSS) convenes global leaders in semiconductor packaging, substrate technology, and AI-driven systems. Under the theme “Next-Gen Substrates: Accelerating Innovation in the AI Era,” the symposium explores how advanced substrates are enabling transformative breakthroughs in chiplet integration, heterogeneous systems, and Co-Packaged Optics (CPO). As AI, HPC, and edge computing drive unprecedented performance demands, next-generation substrates are emerging as the foundation for scalable, high-performance, and energy-efficient solutions. Chiplets and CPO are rapidly gaining traction as a critical enabler of high-bandwidth, low-latency interconnects, further elevating the role of substrates in next-gen architectures. BUSS 2026 showcases innovation across the entire ecosystem—from materials to manufacturing and integration —- highlighting how substrate advancements are powering the future of semiconductor technologies, including the convergence of optics and electronics. SEMI World Headquarters, Milpitas, California, United States

We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced with 3D heterogeneous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based in Asia, leaving a desert in the US. Volume build-up substrates used by major IDMs are manufactured in Asian countries including Taiwan, Japan and China. However, there are multiple activities starting up in the US, and this is why a gathering of the US players is important. This symposium is geared for all those involved in the supply chain of build-up substrates in the US, as well as users. As the US Congress debates H.R. 3249, the Protecting Circuit Boards and Substrates (PCBS) Act, this Symposium is an opportunity for all build-up substrate players to meet, network and cohesively work with funding agencies who will be invited to this symposium to focus on onshoring build-up substrate production and utilization. ***CANCELED*** location to be announced, Milpitas, California, United States, Virtual: https://events.vtools.ieee.org/m/544352

Speaker(s): Sudipto Chakraborty, Room: 4021, Bldg: Sobrato Campus for Discovery and Innovation, Santa Clara University, 500 El Camino Real, Santa Clara, California, United States, 95054, Virtual: https://events.vtools.ieee.org/m/557263

Abstract In high-volume manufacturing, failures in advanced electronic packaging are an unavoidable reality. Consequently, effective failure analysis is vital for enhancing product quality, reliability, and safety. This multidisciplinary task requires the integration of fundamental material science with technological expertise in manufacturing processes and product operation. As packages incorporate increasingly diverse materials and complex geometries, the interactions between components become more intricate. To address this, a systematic, data-driven approach is essential for identifying root causes. This lecture outlines strategies for postulating and verifying failures by linking material properties and characterization techniques to specific failure modes. The session concludes by addressing the industry's most pressing technical challenges. Outline - Foundations of Failure Analysis: Global perspectives, packaging challenges, and the "Octagonal Relationship" of engineering materials. - Mechanisms of Failure: Exploring electrical, thermal, mechanical, chemical, and optical properties in advanced packaging. - Strategic Problem Solving: Implementing the 3C Technique (Create, Challenge, and Confirm) to navigate modern analysis hurdles. Co-sponsored by: Benson Chan Speaker(s): KY Cheong, Agenda: See LOCATION tab for WebEx info Room: Symposium Hall, Bldg: Center of Excellence Building, Binghamton University, 85 Murray Hill Road, Vestal, New York, United States, 13850, Virtual: https://events.vtools.ieee.org/m/557425

[] The IEEE Blockchain Forum is returning for the fourth time as part of (https://www.torontotechweek.com/). The goal of this compact one-day event is to congregate BUIDLers, researchers, academics, and engineers building blockchain protocols, infrastructure, and decentralized software applications. Expect deep thought leadership, executive talks and panels, and academic presentations. We're talking about long-term engineering trends and innovation. You won't find marketing narratives, token launches, or promotions. Note: (https://events.vtools.ieee.org/m/469545) counted with 200 participants and speakers from JP Morgan, the Bank of Canada, Mastercard, the Ethereum Enterprise Alliance, EY, Starknet, among others. Co-sponsored by: Government of Ontario, Invest Hong Kong (Canada), Moody's Ratings, Compass360 Consulting and Tetra Digital Group Agenda: First wave of speaker announcement Room 1: Seminar Room - for the Thought Leaders On the wake of Bill C-15 and the rapid digitisation of Canada's financial system, Canadian innovation leaders will give us a glimpse of what's to come this year and next. 9 am – Registration 9:30 am - Welcome and introduction - Conference Chair Marc Lijour, Secretary of the IEEE Blockchain Technical Community 9:40 am - Opening Keynote by Alex McDougall, CEO of The FUTR Corporation: The Missing Layer: Why Agentic Commerce Needs a Consumer Data Protocol 10 am - Short Keynote by Sheereen Khan, Founder and CEO of Regulativity: An update on the Canadian regulatory landscape 10:10 am - Panel #1 - Stablecoins: A New Era of Payments in Canada - Felipe Priuli, Program Director for CAD Digital (CADD) - Kesem Frank, CEO of Canada Stablecorp (QCAD) - Kevin Zhang, Founder and CEO of LOON 11 am - Short Keynote by Hilary Carter, SVP Research at The Linux Foundation: What's the Role of Open Source for Canadian Sovereignty? 11:10 am - Panel #2 - Sovereignty by Design - Ali Abou Daya, CEO of Transactix Financial Inc. - Thomas You, Associate Partner at Maverix Private Equity - Gaëlle Martin-Cocher, IEEE Canada === NOON: LUNCH BREAK (food will be served in the Boardroom) === 1 pm - Short Keynote by Christopher Chen, Head of InvestHK Canada: Opportunities within the Hong Kong Fintech/Web3 eco-system 1:10 pm - Panel #3 - How does Canada compete on the global stage? - Rajeev Bamra, Global Head of Strategy, Digital Economy at Moody's Ratings - Stuart Davis, President of Surpass Insights Inc. - Torstein Braaten, Chief Compliance at Stablecorp 2 pm - Short Keynote by Bernice Cheung, VP, Financial Services & Cultural Markets Research at Environics Research Group: The State of FinTech Adoption and the rise of Self-Driving Money 2:10 pm - Panel #4 - Gaining Momentum from Innovation to Adoption - Nisrine, Innovation Lead at Interac - Eric Richmond, General Counsel & Head of Business Development at Shakepay - Adam Cai, CEO at Virgo Group == SNACK BREAK == 3:30 pm - Short Keynote by Eyal Sivan, Principal Consultant / Podcast Host at Mr. Open Banking: Open Banking and AI - A Perfect Match 3:40 pm - Panel #5 - The New Frontier of Trust in Agentic AI & Blockchain - Michelle Beyo, CEO of FINAVATOR - Carlos Andres Delgado, Fintech, AI & Banking Expert - Diana Oreto, Blockchain & Digital Assets Expert 4:30 pm - Neworking Room 2: Main Theatre - for The Engineers Building the next generation of payments and Agentic AI Anil Nadiminti - When AI Agents Pay: Building x402 Apps for Agentic AI on AWS James Holler - Compliance by Design: Why Blockchain Systems Must Integrate Regulatory Frameworks from Day One Ken Timsit - Agentic Commerce and Payments Lawrence Ley - Agentic AI & Blockchain: The Autonomous Future of Decentralized Intelligence Rayan Sekhraoui - Sovereign Infrastructure for Web3 — Why Decentralized Apps Need Independent Cloud Simon Kubbinga - Solana, Superteam, and Agentic Commerce Vikas Malhotra - Building safer environments with control, decentralization and distribution === 12:30 pm LUNCH BREAK (food will be served in the Boardroom) === Academic Talks Federico Gatta - Deviations from Tradition: Stylized Facts in the Era of DeFi Ignacy Nieweglowski - PoliFi Tokens and the Trump Effect Dr. Jia Kan - Stop Building Faster Chains: Start Building Blockchain Operating Systems Dr. Marina Flat - AI Governance in Distributed Ecosystems: Accountability by Design Ngozi Nora Agwu - Beyond Hype: Governance Barriers to Blockchain-Enabled Infrastructure Revanth Reddy Airre - From Reasoning to Settlement: A Five-Layer Architecture for Agent Payments on the Decentralized Network Srisht Fateh Singh - Modeling Loss-Versus-Rebalancing in Automated Market Makers via Continuous-Installment Options Emerging Ventures Shashank Motepalli, Founder of Ekai Labs: Auditable Context Handoff in the Agent-to-Agent Economy Tity Lyngdoh, Founder of Dolphinze: From Global Workforce to Global Payment Rails: Rebuilding Contractor Payments Infrastructure Vedant Harlalka, CEO and Co-Founder of Auditorium AI: Building Early Stage Startups in Canada - Blockchain, Data and Crypto More speakers to be announced soon. Stay tuned! Many thanks to our sponsors: the Government of Ontario (sponsoring the location), as well as Invest Hong Kong (Canada), Moody's Ratings, Compass360 Consulting and Tetra Digital Group! Ontario Investment and Trade Centre, 250 Yonge Street, 35th Floor, Toronto, Ontario, Canada, M5B 2L7