Events
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Artificial Intelligence is rapidly progressing from systems that generate responses to intelligent agents capable of reasoning, planning, using tools, maintaining context, and executing multi-step tasks. As organizations move toward agentic AI, the opportunity is no longer limited to helping employees find information—it is increasingly about enabling AI systems to participate in and automate real business processes. Following our August session on Connecting AI to Enterprise Data using Model Context Protocol (MCP), the IEEE Orange County Computer Society GET-AI Series continues in September with a practical, demo-driven exploration of AI Agents and Autonomous Operations. This double-feature session begins with the foundations of agentic AI—what makes an AI system an agent, how agents reason and plan, how they use tools, memory, and context, and how to build a simple agent capable of completing a multi-step task. The second session builds on those concepts to explore how autonomous and multi-agent systems can orchestrate complex enterprise workflows while maintaining security, governance, observability, human oversight, and operational reliability. By combining foundational concepts with architecture patterns and live demonstrations, the September session will help attendees understand how organizations can progress from AI assistance to intelligent, governed autonomous operations. --------------------------------------------------------------- [] Session 1: AI Agents 101: Build Your First Intelligent Agent 45 minutes Through practical explanations and a live demonstration, this session introduces the fundamentals of Agentic AI and explains how AI agents differ from traditional chatbots and standalone LLM applications. Attendees will explore the core building blocks of an AI agent, including reasoning, planning, memory, context, tools, and actions. The session will then demonstrate how these components work together by building a simple agent capable of interpreting a goal, selecting appropriate tools, executing multiple steps, and returning a meaningful result. Topics Include - What Is an AI Agent? From Assistants to Agentic AI - Core Agent Components: Reasoning, Planning, Memory & Actions - Tools, Function Calling & Context Management - Human-in-the-Loop Controls and Common Agent Design Patterns - Build and Demonstrate a Simple Multi-Step AI Agent 👉 Takeaway Understand how AI agents reason, plan, use tools, and take actions—and learn how to build a basic intelligent agent capable of executing a multi-step task. --------------------------------------------------------------- Session 2: Autonomous Enterprise AI: Orchestrating Agents, Tools & Business Workflows Building on the agent foundations introduced in Session 1, this session explores what it takes to move from a single AI agent to reliable, governed autonomous enterprise operations. Attendees will examine architecture patterns for orchestrating agents across applications, APIs, enterprise data, and business processes. The session will explore when to use a single agent versus multiple specialized agents, how agents collaborate and delegate tasks, and how organizations can maintain control through approvals, identity, policy, observability, evaluation, and operational guardrails. The session will also examine the production challenges that arise when agents begin taking actions—including incorrect tool selection, uncontrolled loops, unreliable outputs, excessive autonomy, and failure recovery—and practical strategies for addressing them. A live demonstration can showcase an end-to-end autonomous workflow in which an agent receives a business objective, gathers context, selects tools, performs multiple steps, requests approval when appropriate, and completes the workflow. Topics Include - From AI Agents to Autonomous Operations - Enterprise Agent Architecture: Single-Agent & Multi-Agent Systems - Agent Orchestration, Delegation & Enterprise Tool Integration - Governance, Human Oversight, Observability & Failure Recovery - Production-Ready Agentic Systems with Live End-to-End Demonstration 👉 Takeaway Learn how to design secure, observable, and governed agentic systems that coordinate tools, data, and business processes to enable reliable autonomous enterprise operations. --------------------------------------------------------------- About the Organizer Pradyumna Kodgi Principal Product Manager | Oracle Health & AI IEEE Senior Member | Vice Chair, IEEE EMBS – Orange County Member, IEEE AI Agentic Systems & AI Policy Committees 📍 California, USA 📧 [email protected] 🔗 linkedin.com/in/pkodgi Co-sponsored by: Pradyumna Kodgi Speaker(s): Brij, Karthik Agenda: September Session Agenda Following the same format as August: 4:30 PM – 5:00 PM — Registration, Check-In & Networking 5:00 PM – 5:15 PM — Welcome, Introductions & Opening Remarks Google Meet opens at 5:00 PM. Virtual attendees may join at this time. 5:15 PM – 6:00 PM — Session 1: AI Agents 101 — Build Your First Intelligent Agent 6:00 PM – 6:15 PM — Dinner & Networking 6:15 PM – 7:00 PM — Session 2: Autonomous Enterprise AI — Orchestrating Agents, Tools & Business Workflows Room: Emerald Cove Conference Room, Bldg: Beall Applied Innovation, 5270 California Ave, 2nd Floor , IRVINE, California, United States, 92617, Virtual: https://events.vtools.ieee.org/m/575018 |
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Large language models (LLMs) and Generative AI (GenAI) are at the forefront of frontier AI research and technology. With their rapidly increasing popularity and availability, challenges and concerns about their misuse and safety risks are becoming more prominent than ever. In this talk, we introduce a unified computational framework for evaluating and improving a wide range of safety challenges in generative AI. Specifically, we will show new tools and insights to explore and mitigate the safety and robustness risks associated with state-of-the-art LLMs and GenAI models, including (i) safety risks in fine-tuning LLMs, (ii) LLM red-teaming and jailbreak mitigation, (iii) prompt engineering for safety debugging, and (iv) robust detection of AI-generated content. Speaker(s): Pin-Yu Chen, Agenda: - 5:30 PM – 6:00 PM: Networking (Free pizza & drinks) - 6:00 PM – 7:30 PM: Presentation, Q&A Room: Bergin Hall Room 116, Bldg: SCDI, 500 El Camino Real, Santa Clara, California, United States, 95053 |
2 events,Join us for the 2nd Annual IEEE Power & Energy (PES) Resiliency Summit on Achieving a More Reliable and Resilient Energy Future, taking place 6-8 October 2026 at the Hilton San Francisco Union Square in San Francisco, CA. Registration and full details are at: (https://ieee-pes.org/events/2026-ieee-power-energy-society-pes-resiliency-summit/) Hosted by PG&E, this year's summit convenes utility professionals, solution providers, and industry leaders to explore practical solutions for strengthening the reliability and resilience of our electric power grid. As we navigate an era of increasing energy demand and climate challenges, this event is your opportunity to engage with the latest strategies, technologies, and policy perspectives shaping the future of energy delivery. View videos from last year's event. (https://ieeetv.ieee.org/event/2025-ieee-power-energy-society-pes-summit) Why Attend? - Expert Insights: Hear from industry leaders on critical topics, including AI and data center impacts on the grid, wildfire mitigation, extreme weather response, and workforce development. - Practical Solutions: Gain actionable best practices that you can implement in your own systems to improve reliability performance and outage response. - Networking Opportunities: Connect with top decision-makers from leading organizations in energy, technology, and government. - Collaborative Future: Join a vibrant community of professionals dedicated to achieving a more reliable and resilient energy future. - 86% of the participants from the 2025 event indicated that they would attend this event in the future. Event Highlights: - Keynote Speakers: Hear insights from PG&E leadership and other top-tier industry executives. - Expert Panels: A single-track program covering the most urgent challenges facing our grid today. - Networking: Engage with peers during receptions, lunch breaks, and display tables. See the event website for latest schedule and speaker names and topics. Our Bay Area PES and IAS chapters are co-hosting this event to publicize it to our Bay Area members. Additionally, our SF/OEB PES, SF YP, and SF WIE are hosting a post-Summit Networking event with separate registration. Please check it out, register early for limited spots and join us! (https://events.vtools.ieee.org/m/572258) Co-sponsored by: Pacific Gas & Electric Agenda: See Registration links for Resiliency Summit & Post Summit Networking Agendas: (https://ieee-pes.org/events/2026-ieee-power-energy-society-pes-resiliency-summit/) (https://events.vtools.ieee.org/m/572258) San Francisco, California, United States
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Join us to hear from Arun Anbumani, an IEEE Senior Member and Principal Engineer at Oracle Cloud Infrastructure! Arun specializes in large-scale cloud infrastructure, distributed systems, infrastructure provisioning, and platform reliability. We will spend time learning about Arun's real experience with hyperscalar infrastructure, and it's implication for the future, followed by Q&A and virtual networking. See you there! Speaker(s): Arun Agenda: 6:30 - 7:15 PM : Arun Introduction, General Presentation 7:15 - end : Q&A, virtual networking, etc. Virtual: https://events.vtools.ieee.org/m/579294 |
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IEEE SCV WIE AI Summit 2026 [] In an era where AI technologies are rapidly transforming industries and redefining possibilities, it is crucial to explore both the innovations driving this change and the responsibilities that come with it. Today, we will delve into a diverse array of topics that highlight the multifaceted nature of AI and its profound impact on our lives. Our sessions will cover the latest developments in Large Language Models and Foundation Models, exploring efficient fine-tuning, multilingual adaptation, and the role of LLMs as knowledge bases. We will also examine the evolution of AI agents, focusing on autonomous task completion, multi-agent collaboration, and the integration of external knowledge for robust decision-making. In the realm of Vision and Multimodality, we will explore the integration of text, image, and video understanding, as well as advanced techniques like zero-shot learning and self-supervised learning. Our discussions on MLOps for LLMs will provide insights into best practices for training, deploying, and evaluating large models. We will also address the critical areas of Knowledge-Grounded Reasoning, On-Device Learning, and the ethical dimensions of AI, including bias mitigation, privacy preservation, and the detection of misinformation. Talk tracks are broadly classified but not limited to, 1. Large Language Models (LLMs) & Foundation Models 2. AI Agents 3. Sustainable Hardware for AI 4. Edge to Cloud Orchestration 5. Knowledge-Grounded & Reasoning 6. On-Device Learning for LLMs and Multi-Modal AI 7. Ethics, Bias & Fairness 8. Women Leading the AI Revolution Speaker(s): Neeraja, Mayuri Kulkarni, Niruta Talwekar, Arpita, Negin Heidari Agenda: - 9:30 AM - 10: 00 AM: Registrations - 10:00 AM – 10:10 AM: Welcome Keynote by IEEE WiE + WIN (Shweta, Jerri, Shalini) - 10:10 AM – 10:30 AM: Keynote by Cindy Stottard (CIO, Intel) - 10:30 AM – 10:50 AM: Agentic AI: Agentic Netops – Mayuri Kulkarni (Palo Alto Networks) - 10:50 AM – 11:10 AM: Ethics, Bias & Fairness: Can You Trust a Panel of LLM Judges? – Niruta Talwekar (Meta) - 11:10 AM – 11:30 AM: Emerging Topics: Society for Social Implications of Technology 2026 – Maureen W Vavra (The StrataFusion Group) - 11:30 AM – 11:50 AM: LLM: Rewiring Developer Muscle Memory – Neeraja Amilineni (Workday) - 11:50 AM – 12:00 PM: Transition & Buffer - 12:00 PM – 1:00 PM: Lunch & Networking - 1:00 PM – 1:45 PM: Panel (Leadership): From AI Adoption to AI Leadership - Moderator: Shruthika Iyengar (Intel) - Panelists: Nalini Garg (Deloitte), Rajshree Chabukswar (Intel), Vyoma Gajjar (ServiceNow), Hazel Stobier (Qualcomm) - 1:45 PM – 2:00 PM: Transition - 2:00 PM – 2:30 PM: Lightning Talks: Voices Shaping the Future of AI (5 mins each) - From Silicon to AI – Shalini Lakshmana (Intel) - The Improbable: What Are "You" Optimizing For? – Özlem Coday (Intel) - Beyond the Model: BioPharma's Next Breakthrough – Beenish Zia (Intel) - Workplace Productivity & Agentic AI – Margaret Laffan (Intel) - The Future of Customer Support – Swati Chopra (Intel) - When AI Leaves the Chat – Basak Caprak (Intel) - 2:30 PM – 2:35 PM: Transition - 2:35 PM – 2:55 PM: LLM: Beyond the Next Token: Evolution to World Action Models – Negin Heidari (SF Motors) - 2:55 PM – 3:15 PM: Knowledge Grounded AI: How Faithful Is LLM Reasoning? – Arpita Vasant Shah (Microsoft) - 3:15 PM – 3:25 PM: Closing Remarks Intel SC9, 2250 Mission College Blvd, Santa Clara, California, United States, 95054
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Join four EMC Young Professionals Ambassadors from industry and academia for an evening of talks, a live panel discussion, and audience Q&A — covering career paths in EMC, measurement science, consumer-device reliability, and grounding fundamentals. Open to students, young professionals, and anyone curious about how EMC shapes the technology we use every day. Speaker(s): Madhavi Dhara, Simone Negri, Niamat Hussain, Gaurav Mahajan Agenda: AGENDA 17:00 – 17:10: Welcome & Introduction – Dr.-Ing. Mathias Magdowski (Chair for Electromagnetic Compatibility, Otto von Guericke University Magdeburg, Germany) 17:10 – 17:25: Madhavi Dhara (Robert Bosch GmbH, Germany) – Designing a High-Impact Career in EMC 17:25 – 17:40: Simone Negri (Politecnico di Milano, Italy) – Non-Intrusive Characterization Methods for Multiport Electrical Devices 17:40 – 17:55: Niamat Hussain (University of Glasgow, UK) – From Drop-Damage to Radiation Risk: Rethinking Smartphone Case Engineering 17:55 – 18:10: Gaurav Mahajan (Apple Inc., USA) – Grounds for Grounding 18:10 – 18:40: Panel Discussion 18:40 – 18:55: Audience Q&A / Chat Box Questions 18:55 – 19:00: Closing Remarks Virtual: https://events.vtools.ieee.org/m/575899
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Join Stanford IEEE and the IEEE MTT-S chapter for a hands-on industry talk with Teledyne LeCroy: a lecture from their engineers, followed by 4-5 live oscilloscope and test-equipment demo stations you can rotate through. Wednesday, October 7, 5-7 PM in Packard 204. Pizza provided. Open to all Stanford students, freshmen through PhD. Details and RSVP: https://luma.com/2b6u2wgk Room: 204, Bldg: Packard Electrical Engineering Building, 350 Jane Stanford Way, Stanford, California, United States, 94305 |
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Our IEEE PES San Francisco / Oakland East Bay (SF/OEB) Chapter invites you to join our post IEEE PES Resiliency Summit Networking session (at the Hilton Union Square) and a delicious 5-course Moroccan dinner & show at Marrakech Restaurant right afterwards. (The restaurant will not be open to the public and registration will be required.) See https://ieee-pes.org/events/2026-ieee-power-energy-society-pes-resiliency-summit/ for more info and separate registration for the Summit. Our Networking, Dinner & Show will be co-hosted by our IEEE San Francisco Young Professionals (YP) & Women in Engineering (WiE) affinity groups. Additionally, this event is cosponsored by the IEEE PES Resiliency Summit, IEEE PES Region 6 YP, IEEE PES Women in Power (WiP) and IEEE San Francisco Section. All are welcome but registrations will be limited to seating capacity. Networking at Hilton Union Square 4-5pm Moderated Panel: PES Industry Leaders to share about their careers, challenges and excitement for the next generation of engineers. 5-6pm Speed Networking: PES Industry Leaders will move from tables of 6-8 attendees every 10 minutes. Move from Hilton Union Square a 1/2 block to Marrakech Restaurant 6:30-7:30pm Five Course Moroccan Dinner at Marrakech Restaurant with informal networking 7:30-10pm Georges Lammam Ensemble & Show with the premier Arabic band including violinist & singer Georges Lammam, keyboardist Khader Keileh, Susu Pampanin on tabla & Amina Goodyear on additional percussion. The show will also include two local SF bellydancers Jordone & Maya and open floor dancing! Important Note: You do not need to attend the Resiliency Summit to register and attend the Networking events 10/8 4-6pm at the Hilton and 6:30-10pm at Marrakech Restaurant. You can register and attend: 1) the Summit (separate IEEE PES registration at link above); 2) our 10/8 late afternoon/evening local networking event, or 3) both. We do require separate paid registrations through this vTools link for our networking event as our IEEE PES SF/OEB Chapter has booked the entire restaurant and entertainment. Our IEEE SF Section has kindly committed to supporting our networking event for 1/3 the costs, but we still need your support to cover our IEEE SF/OEB PES Chapter costs. Co-sponsored by: IEEE PES Resiliency Summit & Region 6 Young Professionals (YP) & Women in Power (WiP) San Francisco, California, United States
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Drawn from launch-readiness work in medical device product development, this talk covers how to hold scope when capable teams push to expand it, how to surface trade-offs so groups reach decisions themselves, and how to escalate without damaging the relationships you depend on. Speaker(s): Isha Sharma, Room: 108, Bldg: Alameda Hall, Santa Clara University, Santa Clara, California, United States, Virtual: https://events.vtools.ieee.org/m/581151 |
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[]This talk will cover the status of fiber optic transceiver co-packaging efforts, both VCSEL- and SiPh-based, where they fit into the Ethernet switch market and the evolving Computer IO market, and how these technologies are advancing HPC (High Performance Computing), Data Center, and AI applications. The emphasis will be on new requirements and challenges driven by AI systems. Speaker(s): Dan Kuchta, Virtual: https://events.vtools.ieee.org/m/568144
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Session 3: (https://ieee-climatechain-hack.devpost.com/) Join us for Session 3 of the Learning & Training Series for the IEEE Global ClimateChain Hackathon 2026, a global initiative bringing together students, researchers, developers, industry professionals, and innovators to explore how Artificial Intelligence, Blockchain, and emerging technologies can support climate action and sustainability. This session will focus on Ethics, Responsibility & Good Practices for Climate Innovation, exploring how ethical principles and responsible innovation can guide the development of technology-driven solutions for climate challenges. Participants will examine important considerations including responsible AI, data privacy and governance, transparency, accountability, bias, inclusivity, security, environmental impact, sustainability, and trust when applying AI, blockchain, and other emerging technologies. The session will also translate these principles into practical good practices for designing climate solutions, helping participants consider sustainability, scalability, measurable impact, stakeholder needs, and long-term value. Participants will gain practical perspectives to help them develop ClimateChain Hackathon projects that are ethical, responsible, trustworthy, sustainable, and capable of delivering meaningful climate impact. [] Co-sponsored by: Pradyumna Kodgi Speaker(s): Reventh Agenda: Agenda – Session 3: Ethics, Responsibility & Good Practices for Climate Innovation 20:00 – 20:10 | Introduction & Responsible Climate Innovation Context Overview of why ethics, responsibility, and good practices matter when designing technology-driven climate solutions. 20:10 – 20:30 | Ethics & Responsible Innovation for Climate Technology Responsible AI, transparency, accountability, data privacy and governance, bias, inclusivity, and ethical considerations when applying AI, blockchain, and emerging technologies to climate challenges. 20:30 – 20:50 | Good Practices for Designing Climate Solutions Practical guidance on sustainability, scalability, measurable impact, security, stakeholder needs, long-term value, and building trustworthy climate solutions. 20:50 – 21:00 | Q&A, Discussion & Closing Virtual: https://events.vtools.ieee.org/m/574108 |
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4 events,Part of the 11th ACM/IEEE Symposium on Edge Computing (SEC 2026) Location: Santa Clara University | Date: Oct 13-15, 2026 Overview The future of the Edge is not just decentralized—it must be sustainable. As AI models grow in complexity, the environmental and energetic costs of deploying them on edge devices have become a critical bottleneck. The Minimalist Edge AI Challenge invites student teams to tackle the "AI Bloat" head-on. This one-day competition challenges you to take state-of-the-art "heavy" models and transform them into lean, green, high-performance machines capable of running on constrained, eco-friendly hardware. Can you maintain intelligence while slashing the carbon footprint? Join our Discord group for latest updates (https://discord.gg/V29ZXCTFR5). --------------------------------------------------------------- The Challenge Participating teams will be tasked with deploying a complex AI workload (e.g., real-time multi-object tracking or environmental anomaly detection) onto provided low-power hardware (Qualcomm Arduino UNO Q). Your mission is to optimize for the "Green Trifecta": - Model Accuracy: Maintain high predictive performance and reliability while operating under strict resource constraints. - Model Compression: Use pruning, quantization, and distillation to shrink the model footprint. - Resource Efficiency: Minimize peak RAM and CPU utilization to ensure smooth execution on minimalist hardware. - Energy Parsimony: Achieve the lowest possible Joules-per-inference to maximize battery life and sustainability. --------------------------------------------------------------- Why Participate? - Showcase Your Skills: Pitch your solution to a jury of world-leading edge computing experts from academia and industry. - Build Your Career & Network: Pitch your solution to a premier jury of world-leading edge computing experts and recruiters from academia and industry giants like Qualcomm. - Engineer for Planet Earth: Move past theoretical AI. Help define the actual benchmarks for "Green AI" and create real-world impact by building hyper-efficient, eco-friendly edge computing models. - Cash Prizes: The top three teams from each track will receive cash rewards: - 1st Place: $1,000 - 2nd Place: $750 - 3rd Place: $500 - Participant Perks: All competition participants will receive IEEE Computer Society swag and a free IEEE Computer Society Student Membership (Note: Requires an active IEEE Student Membership). --------------------------------------------------------------- Eligibility & Team Composition - Open to all undergraduate and graduate students registered at a recognized university. - Teams should consist of 2 to 4 members. - Recommended Skill Set: * Proficiency in Python (PyTorch/TensorFlow) and/or C++/Rust. - Experience with model optimization techniques (Pruning, Quantization). - Knowledge of Linux systems and resource profiling. - A passion for sustainable engineering. --------------------------------------------------------------- Important Dates ● Team Registration Deadline: Sept. 6th, 2026 ● Competition Day: Oct. 13-16 (Co-located with SEC 2026) Co-sponsored by: QualComm 500 El Camino Real, Santa Clara, California, United States, 95053 ACM/IEEE SEC 2026 and the 14th IEEE International Conference on Cloud Engineering (IC2E 2026) will be held together at Santa Clara University. Attendees may participate in technical sessions from either conference, and both communities will come together for a joint poster and demo session. SEC is a forum for top researchers, engineers, students, entrepreneurs, and government officials come together under one roof to discuss the opportunities and challenges that arise from rethinking cloud computing architectures and embracing edge computing. SEC takes a broad view of edge computing and solicits contributions from many fields of systems practice that embrace any aspect of edge computing. Bldg: Benson Memorial Center, 820 Alviso St, , Santa Clara University, Santa Clara , California, United States, 95050
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Stanford IEEE is hosting a live on-campus taping of "A Bit Personal," the Global Semiconductor Alliance's podcast. GSA CEO Jodi Shelton sits down with John Hennessy, Stanford President Emeritus and Chairman of Alphabet, to talk about his career in computer architecture, leading Stanford, and the future of the semiconductor industry. Tuesday, October 13, 12-1 PM. Free and open to Stanford students, staff, and faculty. Details and RSVP: https://luma.com/x4vhq2eq Co-sponsored by: Global Semiconductor Alliance (GSA) Room: 101X, Bldg: Paul G. Allen Building, 420 Via Palou, Stanford, California, United States, 94305
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This is an online event. Pre-registration is required. Trusted adoption of an AI solution in an enterprise setting has many requirements. Large Language Models (LLMs) can often be constrained by the risks of hallucination bias and limited operational trust and reliability. Overcoming these challenges requires models whose output is fully grounded, auditable, and accurate. In addition, enterprise policy compliancy is critical in highly regulated sectors such as finance, healthcare, legal, insurance, government, and critical infrastructure. This presentation will discuss a solution framework with open-source models that can be systematically adapted using a combination of post-training optimization with advanced and agentic Retrieval-Augmented Generation (RAG) to create a production-ready enterprise LLM architecture. Advanced RAG is able to strengthen factual grounding through hybrid retrieval, metadata filtering, reranking, citation generation, and context optimization. Agentic RAG is able to extend this capability by enabling planner, retriever, verifier, and critic agents to decompose complex tasks, iteratively retrieve evidence, validate sufficiency, re-query when needed, and produce auditable answers suitable for enterprise production use. Speaker(s): Prasad Venkatachar, Virtual: https://events.vtools.ieee.org/m/577393 |
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Materials Science for Quantum Computing Abstract: Quantum technologies have made remarkable advances in recent years, but moving from laboratory demonstrations to useful, large-scale systems remains a formidable engineering challenge. Whether the platform is based on superconducting circuits, semiconductor spins, atoms, ions, or photons, performance and scalability depend critically on materials quality, interfaces, defect control, process uniformity, and integration. Applied Materials is bringing decades of semiconductor manufacturing expertise to these challenges. Its quantum technology program is applying advanced materials engineering, 300-mm wafer processing, precision metrology, integrated photonics, and advanced packaging to improve quantum-device performance and enable larger, more manufacturable systems. Through applying materials engineering, advanced packaging, and next-generation optical materials including metasurfaces, to lower error rates, longer coherence times, and scaling. Applied is also exploring how its capabilities in photonics and materials engineering can support quantum sensing and communications. In this seminar, Dr. Robert Visser, who leads Applied Materials’ quantum technology activities, will discuss how technologies developed to manufacture billions of highly controlled classical devices may help overcome the materials, fabrication, and integration barriers now limiting practical quantum systems. Speaker: Robert J. Visser Vice President of Engineering Technology, Office of the CTO Applied Materials AGENDA: Thursday October 15, 2026 11:30 AM: Networking, Pizza & Drinks Noon -- 1 pm: Seminar Please register on Eventbrite before 9:30 AM on Thursday October 15, 2026 $4 IEEE members $6 non IEEE members (discounts for unemployed and students ) Bldg: ==> Use corner entrance: Kifer Road / San Lucar Court ==> Do not enter at main entrance on Kifer Road, EAG Labs, 810 Kifer Road, Sunnyvale, California, California, United States, 95051 |
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[]This no-cost workshop brings together five industry experts (plus an optional lab tour) to discuss the latest 2.5D/3D/3.5D semiconductor packaging solutions for HPC and AI. It highlights the growing challenges of fault isolation (FI) and failure analysis (FA) in dense interconnects such as hybrid bonding and micro bump arrays, reviews new thermal management options (metallic TIMs, low-temp solders), showcases advanced non-destructive inspection tools (computed laminography and high resolution CT), and introduces cutting edge microscopy techniques (SAM and PiFM) for defect characterization, while outlining emerging FI-FA workflows and tool roadmaps for reliable, scalable AI and data center hardware. Attendees will gain insight into current industry troubleshooting workflows and a forward-looking roadmap of the tools and techniques being developed to address advanced packaging failures. Additionally, the optional lab tour can help the attendees understand the tools and techniques discussed in the lectures. Four guided training talks with small-group interaction: 9:00: Advanced Packaging for AI – Challenges and Roadmaps in Fault Isolation and Failure Analysis 9:30: Metal TIM and Low-Temp Solder Paste for HPC and AI Industry Challenges 10:00: Failure Analysis of Electronic Components for AI and Data Center Infrastructure 10:30: High-Resolution 3D X-Ray Inspection for Advanced Packaging Integration 11:00: Scanning Acoustic Microscopy (SAM) and Photo-induced Force Microscopy (PiFM) for Defect Identification and Characterization in AI Hardware 11:30: lunch, social/networking, and optional lab tours Speaker(s): Yan Li, David Hu, Audrey Chamoire , Jeff Gelb, Austin Barnes Covalent Corp., 925 Thompson Place, Sunnyvale, California, United States, 94085, Virtual: https://events.vtools.ieee.org/m/575155 |
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For a century, the grid's stability came for free from the heavy spinning mass of conventional generators. As solar, wind, and battery storage take over, that built-in inertia is disappearing, and the grid has to find new ways to stay steady. Join Stanford IEEE's Power & Energy Society for an interactive session on grid inertia in an inverter-based world. We'll cover why inertia matters, what inverter-based resources can and can't do to replace it, and how reactive power support fits in. Along the way, we'll walk through real-world case studies of events on the grid and see what they can teach us. Expect live demos, open discussion, and plenty of questions. Open to all majors. No power systems background required. Details and RSVP: https://luma.com/izp8abza Room: 299, Bldg: Y2E2 (Jerry Yang and Akiko Yamazaki Environment and Energy Building), 473 Via Ortega, Stanford, California, United States, 94305 |
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The Stanford IEEE and its internal sub-chapter the Power and Energy Society will be hosting an informative presentation on Palo Alto Utility's Grid Modernization efforts. Specific location on campus TBA. Details and RSVP: https://luma.com/v5gz9zz9 Bldg: Stanford University (room TBA), 450 Jane Stanford Way, Stanford, California, United States, 94305 |
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Abstract: A recent report by the US Department of Energy defines the area of scientific machine learning as “a core component of artificial intelligence (AI) and a computational technology that can be trained, with scientific data, to augment or automate human skills”, which has “the potential to transform science and energy research”. In this presentation, we discuss the potential of scientific machine learning methods to problems in computational electromagnetics starting from standard electromagnetic structure analysis and multi-physics modeling in the time-domain, employing unsupervised, supervised and reinforcement learning. An unsupervised learning strategy is based on a modified Physics-Informed Neural Network (PINN). PINNs directly integrate physical laws into their loss function, so that the training process does not rely on the generation of training ground truth data from simulations. We introduce a physics-informed deep- operator-network (PI-DON) for Maxwell’s equations. We show applications of the PI-DON to the analysis, design and uncertainty quantification study of finite and defect periodic structures, including frequency selective surfaces and metasurfaces. Moreover, we demonstrate the impact of machine learning on the computational modeling of radiowave propagation scenarios and reconfigurable intelligent surfaces, using supervised learning. We build convolutional neural network models that can process the geometry of indoor environments, along with physics-inspired parameters, to rapidly estimate received signal strength (RSS) maps. Emphasis is placed on the generalizability of these models, which is their ability to "learn" the physics of radiowave propagation and produce accurate modeling predictions in new geometries well beyond those included in their training set. Finally, the use of reinforcement learning for the optimization of reconfigurable intelligent surfaces will be discussed. Speaker(s): Costas Room: 204, Bldg: David Packard Electrical Engineering Building, 350 JANE STANFORD WAY, STANFORD, California, United States, 94305
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Stanford IEEE hosts a fireside chat with Shang-Yi Chiang, former co-COO of TSMC and one of the most influential figures in modern semiconductor process technology. The conversation will cover the evolution of process technology, the future of the foundry industry, and advanced packaging, followed by open audience Q&A. Thursday, October 29, 5-6 PM. Free and open to Stanford students, staff, and faculty. Details and RSVP: https://luma.com/gft0fwna Room: 101, Bldg: Packard Electrical Engineering Building, 350 Jane Stanford Way, Stanford, California, United States, 94305 |
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Abstract: A recent report by the US Department of Energy defines the area of scientific machine learning as “a core component of artificial intelligence (AI) and a computational technology that can be trained, with scientific data, to augment or automate human skills”, which has “the potential to transform science and energy research”. In this presentation, we discuss the potential of scientific machine learning methods to problems in computational electromagnetics starting from standard electromagnetic structure analysis and multi-physics modeling in the time-domain, employing an unsupervised learning strategy based on Physics-Informed Neural Networks (PINN). PINNs directly integrate physical laws into their loss function, so that the training process does not rely on the generation of training ground truth data from simulations. We demonstrate the unconditionally stable solution of coupled electromagnetic-thermal problems based on PINNs and introduce a physics-informed deep-operator-network (PI-DON) for the unconditionally stable solution of Maxwell’s equations. We show applications of the PI-DON to the analysis, design and uncertainty quantification study of finite and defect periodic structures, including frequency selective surfaces and metasurfaces, demonstrating significant computational efficiency gains with respect to the conventional finite-difference time-domain technique (FDTD), including training time of the neural network. Moreover, we demonstrate the impact of machine learning on the computational modeling of radiowave propagation scenarios. We build convolutional neural network models that can process the geometry of indoor environments, along with physics-inspired parameters, to rapidly estimate received signal strength (RSS) maps. Emphasis is placed on the generalizability of these models, which is their ability to "learn" the physics of radiowave propagation and produce accurate modeling predictions in new geometries well beyond those included in their training set. Speaker(s): Costas Sarris Virtual: https://events.vtools.ieee.org/m/583371 |
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