High-volume, rapid fabrication of three-dimensional (3D) nano-architected materials and devices is key to deploying next-generation nanotechnologies to solve real-world challenges. Due to the field-of-view limitations of conventional optics, existing 3D nanofabrication techniques face fundamental challenges in throughput, proximity error, and stitching defects on the path to scaling. At LLNL, we have developed a scalable 3D nanofabrication platform that utilizes a metalens-generated focal spots array to massively parallelize two-photon lithography (TPL). Our current system uses over 100,000 high-contrast metalenses to enable the rapid parallel production of complex nanostructures with nanoscale resolution (up to 110 nm) over a 12-cm^2 write field. By programmatically patterning the focal spot array using a spatial light modulator, we further devise an adaptive parallel printing strategy for precise grayscale linewidth modulation and high-throughput production of semi-periodic and fully aperiodic 3D geometries. In this talk, I will share the details of this platform technology that received the R&D 100 Award in 2025. This work represents a paradigm shift for 3D nanolithography from lab-scale prototyping towards wafer-scale production, empowering TPL to be widely adopted at volume in microelectronics, quantum technology, biomedicine, and other fields. I look forward to engaging with the IEEE community to discover suitable use cases in the microelectronics industry, especially for advanced packaging. Speaker(s): Xiaoxing Xia Agenda: 11:30am: Networking & Pizza Noon-1PM: Seminar Bldg: EAG Laboratories, 810 Kifer Road, Sunnyvale, California, United States, 94086

Next Generation Two-photon 3D Printing Technologies [] Abstract: Utilizing a suite of additive manufacturing technologies for applications in responsive and architected materials, energy storage, carbon recycling, microfluidics, quantum computing, and inertial confinement fusion [] []Speaker: Dr. Xiaoxing Xia Staff Scientist Lawrence Livermore National Lab Xiaoxing Xia is a staff scientist at the Lawrence Livermore National Laboratory, California, USA. He leads projects in developing next generation two-photon 3D printing technologies to achieve higher throughput, finer resolution, and multi-materials printing capability. His team utilizes a suite of additive manufacturing technologies for applications in responsive and architected materials, energy storage, carbon recycling, microfluidics, quantum computing, and inertial confinement fusion. He received his PhD in Materials Science from California Institute of Technology and BA in Physics from University of Chicago. AGENDA: Thursday October 16, 2025 11:30 AM: Networking, Pizza & Drinks Noon -- 1 pm: Seminar Please register on Eventbrite before 9:30 AM on Thursday October 16, 2025 $4 IEEE members $6 non IEEE members (discounts for unemployed and students ) See examplesAdd Co-sponsored by: 636940-Santa Clara Valley Section Chapter,EMB18 Bldg: ==> Use corner entrance: Kifer Road / San Lucar Court ==> Do not enter at main entrance on Kifer Road, EAG Labs, 810 Kifer Road, Sunnyvale, California, California, United States, 95051

AI-Enhanced RF/Mixed-Signal Circuits for Reliable Operations IEEE SSCS Distinguished Lecturer Prof. Vanessa Chen Abstract: AI-driven design and optimization are revolutionizing RF and mixed-signal circuits for operation in extreme environments, including high radiation and wide temperature ranges. This talk explores the use of reinforcement learning (RL) and generative models to improve circuit robustness and adaptability. RL-based self-healing techniques leverage embedded electromagnetic sensors for real-time monitoring and dynamic fault recovery, while generative models accelerate design space exploration, enabling resilient and efficient circuit topologies. The presentation will highlight AI-enhanced designs such as adaptive power amplifiers, PMICs, and multispectral sensors that enhance performance and reliability in harsh environments. Speaker biography: Vanessa Chen earned her Ph.D. in electrical and computer engineering from Carnegie Mellon University in 2013. Before joining Carnegie Mellon University, she was affiliated with The Ohio State University. During her doctoral studies at Carnegie Mellon from 2010 to 2013, she conducted research on algorithm-assisted approaches for improving energy efficiency and ultra-high-speed ADCs with on-chip real-time calibration, and interned at IBM T. J. Watson Research Center in 2012. Prior to academia, she held positions as a circuit designer at Qualcomm in San Diego and Realtek, Hsinchu, Taiwan, focusing on self-healing RF/Mixed-signal circuits. Her research focuses on AI-enhanced circuits and systems, which include intelligent sensory interfaces, RF/mixed-signal hardware security, and ubiquitous sensing and computing systems. Dr. Chen has received the NSF CAREER Award in 2019. She has been involved in various technical program committees, including ISSCC, VLSI, CICC, A-SSCC, and DAC. She also has served as an Associate Editor for several IEEE journals, including TCAS-I, TBioCAS, and OJCAS. Additionally, she has contributed as a Guest Editor for TCAS-II and ACM JETC. She is currently an IEEE SSCS Distinguished Lecturer in 2025/2026. Please register to allow for proper planning. Agenda: 5:30pm: Networking 6:00pm: Talk 7:00pm: Event ends Room: 101/101A EE, Bldg: Packard , 350 JANE STANFORD WAY, STANFORD, California, United States

Join us for an essential dual perspective on the future of AI systems. As organizations race to deploy generative and agentic AI, two critical challenges emerge: 1️⃣ Scaling AI solutions from prototype to enterprise impact 2️⃣ Securing autonomous systems against emerging threats This event brings together leading industry experts to address both sides of this equation. 🎤 Talk 1 The Last Mile of Generative AI: Turning Ideas into Impact at Enterprise Scale Speaker: Mrinal Karvir, Engineering Leader 🎤 Talk 2 Securing Agentic AI: From Security Risks to Practical Defenses for Autonomous Systems Speaker: Dewank Pant, Engineer and Researcher Co-sponsored by: Vishnu S. Pendyala, San Jose State University Speaker(s): Dewank, Mrinal, Dr. Vishnu S Pendyala Room: MLK Room 225, Dr. Martin Luther King, Jr. Library (SJSU), 150 E San Fernando St San Jose, California 95112, San Jose, California, United States, Virtual: https://events.vtools.ieee.org/m/501651

[]For over three decades, Sn-based material solder joints have remained the silent workhorses of electronic packaging. Since the transition from eutectic Sn-Pb to SAC305 alloy systems, these interconnects have sustained the fast-moving pace of system- and device-level integration with sufficient mechanical, thermal, and electrical reliability. While the semiconductor industry has undergone unprecedented transformation toward higher performance systems, the SAC305 alloy solder joints have quietly absorbed stress, ensured functionality, and maintained manufacturability across generations of products. However, the emergence of high-performance computing (HPC) and AI-driven network systems places unprecedented demands on these long-serving SAC305 interconnects. Are we asking too much from the long pasting current solder material and technology that has already given so much? This seminar revisits the fundamentals of solder joint evolution, exploring why it has been so effective for thirty years and the inherent limitations now emerging. The general thermo-mechanical and electrical performance degradation mechanism will be reviewed, and compared with the new material systems such as low melting temperature alloy systems. The lessons between these different degradation mechanisms and further demand and new boundary conditions will provide a view of what solder challenges in the AI era might look like. We will discuss whether the era of traditional solder joints is approaching its boundary of service, and what emerging roles solder might play. Looking forward, we will consider how interconnects must adapt or be reimagined to meet the challenges of the next generation of AI and High-Performance computing systems. Speaker(s): Tae-Kyu Lee, Virtual: https://events.vtools.ieee.org/m/501073

Title: Brain Machine Interface: Challenges and Opportunities Date/Time: (PST)- 12:00pm to 1:00pm Thu, Oct 23 2025 Abstract: Brain Machine interfaces have the potential to revolutionize therapy for neurological diseases, because they target the nervous system with high spatiotemporal resolution as opposed to alternative therapies. Next-generation brain machine interfaces will benefit from an implantable neural recording IC with a dense, high channel count recording array that can be directly matched to a micro-electrode array (MEA) at the pitch of neurons (≈30 µm) to effectively capture spatiotemporal patterns of neural activity at single-cell resolution. These devices must support simultaneous recording from multiple thousands of neurons within the form factor and power budget of a fully implanted device. Hence, there is a requirement for an architectural paradigm shift to meet the design targets. In this talk, we will delve into specific challenges and approaches to achieve intended targets. Speaker Bio: Dante G. Muratore received a B.Sc. and an M.Sc. degree in Electrical Engineering from Politecnico of Turin, Italy in 2012 and 2013, respectively. He received a Ph.D. degree in Microelectronics from the University of Pavia, Italy in 2017 in the Integrated Microsystems Lab. From 2015 to 2016, he was a Visiting Scholar at Microsystems Technology labs at the Massachusetts Institute of Technology, USA. From 2016 to 2020, he was a Postdoctoral Fellow at Stanford University, USA. He is the recipient of the Wu Tsai Neurosciences Institute Interdisciplinary Scholar Award. Since 2020, he is an assistant professor in the Bioelectronics Section at Delft University of Technology, Netherlands, where he leads the Smart Brain Interfaces group. His research focuses on hardware design for brain-machine interfaces, bioelectronics and machine learning. https://microelectronics.tudelft.nl/People/bio.php?id=690 (https://ieeemeetings.webex.com/ieeemeetings/j.php?MTID=m3d5beb80b9d84d4efbce27fdda8cc485) https://ieeemeetings.webex.com/ieeemeetings/j.php?MTID=m3d5beb80b9d84d4efbce27fdda8cc485 Meeting number: 2535 991 4718 Meeting password: rQJZd3KZc32 Join from a video system or application Dial [email protected] You can also dial 173.243.2.68 and enter your meeting number. To dial from an IEEE Video Conference System: *1 2535 991 4718 Tap to join from a mobile device (attendees only) (tel:%2B1-415-655-0002,,*01*25359914718%23%23*01*) United States Toll (tel:1-855-282-6330,,*01*25359914718%23%23*01*) United States Toll Free Virtual: https://events.vtools.ieee.org/m/490922

[] CYBERSECURITY AWARENESS MONTH Cybersecurity Starts with You: Protect, Prevent, Prevail Since 2004, the President of the United States and Congress have declared October to be Cybersecurity Awareness Month. Cyber-attacks on corporations, governmental agencies and individuals are becoming increasingly widespread and regular, as well as more complex. The Virtual Sixth Annual Los Angeles IEEE Coastal Los Angeles Computer Society Cybersecurity Summit-South Bay that brings together government officials, private business executives and cybersecurity experts to discuss the current and emerging threats that exist in today’s sophisticated cyber environment, and the technological advancements being made to countermeasure and manage these risks. (https://www.computer.org/) (https://www.csudh.edu/) https://www.waseda.jp/top/en/(https://www.nubroad.com/)(https://www.isi.edu/) https://www.ucla.edu(https://www.stmarytx.edu/) (https://www.scu.edu/) https://www.linkedin.com/company/immuniweb/ (https://aileap.tech/)https://www.linkedin.com/company/ieee-computer-society-in-san-antonio?lipi=urn%3Ali%3Apage%3Ad_flagship3_messaging_conversation_detail%3B9%2FFvMWdzSWKmSnQdGt1wfQ%3D%3D (https://www.linkedin.com/company/ieee-computer-society-scv-chapter/posts/?feedView=all) Resources for Cyber Security Awareness: Think Before You Click: Your Digital Life Depends on It (https://www.dhs.gov/topic/cybersecurity) (https://www.us-cert.gov/ncas/tips) (https://staysafeonline.org/) (https://www.dhs.gov/national-cyber-security-awareness-month) - (http://www.afcea.org/site/sites/default/files/files/AFC_WhitePaper2015_R3_SPREADS_lowres.pdf) Co-sponsored by: Dr. Mehrdad Sharbaf Agenda: Please Join us virtually for The Sixth Annual Los Angeles IEEE CLAS Computer Society Cybersecurity Summit-South Bay Secure Together: Building a Safer Digital World Welcome Keynote Message Time: 9:00 am Dr. Mehrdad S. Sharbaf, IEEE Coastal Los Angeles Computer Society- Chair, Founder & CEO, Sharbaf and Associates LLC/Adjunct Professor CSUDH (https://www.linkedin.com/in/mehrdad-s-sharbaf-30a23214/) Welcome Keynote Remark Message Distinguished Guest Speaker Professor Hironori Washizaki, Head of Department, Associate Dean, Waseda University, and IEEE Computer Society Elected President 2025, Time 9:15 am (https://www.linkedin.com/in/hironori-washizaki-aa085184/) Distinguished Guest Speaker Dr. Chris Mattmann, Chief Data and Artificial Intelligence Officer, UCLA, Time 9:30 am (https://www.linkedin.com/in/chrismattmann/) Distinguished Guest Speaker Dipti Srivastava, VP/Director Engineering, Nubroad LLC, Time 10:00 am (https://www.linkedin.com/in/diptishrivastav/) Distinguished Guest Speaker Terry Benzel, Managing Director, USC Information Sciences Institute, Former Director, Networking and Cybersecurity Division at USC Information Sciences Institute, IEEE Fellow, Time 10:30 am (https://www.linkedin.com/in/terry-benzel-74818/) Distinguished Guest Speaker Malek Ben Salem, Ph.D., Founder & CEO, AILeap, Time 11:00 am (https://www.linkedin.com/in/malek-ben-salem/) Distinguished Guest Speaker Dr. Cyril Onwubiko, Business Information Security Officer at Barclays | Board Member, IEEE Computer Society Time 11:30am (https://www.linkedin.com/in/cyrilonwubiko/) Distinguished Guest Speaker Dr. Ilia Kolochenko, CEO at ImmuniWeb, Attorney-at-Law, Adjunct Professor of Cyber Law & Cybersecurity, Time 12:00pm (https://www.linkedin.com/in/kolochenko/) Adjourn at 12:30pm Please Join IEEE Computer Society Build your technical skills, discover new opportunities, and connect to a global community of technologists. (https://www.computer.org/membership) Virtual: https://events.vtools.ieee.org/m/497356

Achieving efficient p-type doping in gallium nitride (GaN) and its alloys remains one of the most critical challenges in realizing the full potential of III-nitride semiconductors for high-power electronics, deep-ultraviolet (DUV) optoelectronics, and quantum information technologies. While magnesium is the conventional acceptor dopant, its high ionization energy (≈0.22 eV in GaN and up to 0.6 eV in AlN) limits hole concentrations to below ~1% activation efficiency, constraining device performance. Our recent work explores beryllium as an alternative acceptor in (Al,Ga)N, leveraging metal-organic chemical vapor deposition (MOCVD) to achieve high-quality, low-defect epitaxial growth. Through extensive photoluminescence and time-resolved spectroscopy studies of over fifty MOCVD grown Be-doped GaN samples, we identified the UVLBe ​ band at ~3.38 eV as a signature of a shallow Be-related acceptor with an ionization energy of ~113–114 meV — significantly shallower than Mg in GaN. Complementary theoretical studies support the assignment of this shallow state to the BeGa​ONBeGa​ complex, suggesting a pathway toward achieving p-type conductivity in AlGaN and even AlN alloys. In recent limited MOCVD growth studies on co-doping with oxygen and Be, we have observed preliminary indications that oxygen incorporation can enhance the signature of the shallow Be acceptor, though further work is needed to fully establish the efficacy and stability of this co-doping strategy. These results provide new insight into the nature of Be-related defects in GaN and AlGaN, and they highlight co-doping pathways as a promising route to overcome the long-standing bottleneck of achieving high hole concentrations. When: Friday, November 7th, 2025 – 11:45AM to 1PM (PDT) 11:45AM - 12PM: Intro 12PM-12:45PM: Lecture 12:45PM-12:55PM: Q&A 1PM Adjourn Bio: Dr. F. Shadi Shahedipour-Sandvik is a Professor of Engineering at the State University of New York, where she leads research on wide bandgap III-nitride semiconductor materials and devices for applications in lighting, power electronics, sensing, and quantum information science. Her work spans two decades of innovation and pioneering work in (Al,In) GaN materials and device engineering, with contributions ranging from high-efficiency p-type doping techniques and defect engineering and characterization to novel photocathodes and betavoltaic devices. She has authored nearly 200 publications and delivered invited talks worldwide on growth, characterization, device physics with applications in emitters, power electronics, and detectors. Shahedipour-Sandvik lab has been continuously funded by a variety of sources including NSF, ARL/ARO, DARPA, DOE, ARPA-E, NASA, and by industry. She has advised more than a dozen Ph.D. students, many of whom now hold technical leadership positions in national labs, and industry. She served as Editor-in-Chief of the Journal of Electronic Materials (2015–2024) and has been recognized with the SUNY Excellence in Research Award and the IBM Faculty Award, among other honors. Virtual: https://events.vtools.ieee.org/m/502836

Free Registration (with a Zoom account; you can get one for free if you don't already have it. This requirement is to avoid Zoom bombing. Please sign in using the email address tied to your Zoom account — not necessarily the one you used to register for the event.): https://sjsu.zoom.us/meeting/register/qGy644m7StmKMra3Xs_x2g Synopsis: Please feel free to check out the work and thoughts of Prof. Alice Smith, Ph.D., https://en.wikipedia.org/wiki/Alice_E._Smith, https://www.eng.auburn.edu/~aesmith/ on Google Scholar at https://scholar.google.com/citations?hl=en&user=3WhioLIAAAAJ&view_op=list_works&sortby=pubdate, YouTube https://www.youtube.com/results?search_query=%22alice+smith%22+auburn and generally on the Internet. Then, please feel free to submit your questions - via Twitter by using the hashtag, #ProfSmithAMA and tagging @vishnupendyala - emailing vspendyala(at)hotmail(dot)com with #ProfSmithAMA in the subject - during your registration on Zoom Selected questions will be answered by Prof. Smith during the session. Audience may be able to ask follow-up questions during the session, using the Chat feature. --------------------------------------------------------------- By registering for this event, you agree that IEEE and the organizers are not liable to you for any loss, damage, injury, or any incidental, indirect, special, consequential, or economic loss or damage (including loss of opportunity, exemplary or punitive damages). The event will be recorded and will be made available for public viewing. Co-sponsored by: Vishnu S. Pendyala, SJSU Speaker(s): Dr. Vishnu S. Pendyala, Prof. Alice Smith Virtual: https://events.vtools.ieee.org/m/498694

Rethinking Chip Design to deliver Faster, Smarter, More Compact Solutions [] Abstract: CDimension is rethinking chip design from the ground up, delivering solutions that are faster, smarter, and more compact. We’re moving beyond the limitations of traditional technology. Our foundational innovations in advanced materials and semiconductor integration unlock unprecedented gains in performance, efficiency, and scalability – ranging from 10x to 1,000x times greater than current approaches. Our first milestone: the commercial release of ultra-thin 2D semiconductor materials — a foundational step toward our vision of vertically integrated systems that unify compute, memory, and power. [] Speaker: Dr. Jiadi Zhu CEO CDimension Jiadi Zhu is the CEO and founder of CDimension, a company rethinking chip design to deliver faster, smarter, more compact solutions for the most demanding and complex computing workloads. His vision is to redefine how chips are designed, not just for higher performance, but for fundamentally better structure and efficiency. Jiadi’s technical foundation spans over a decade of work at the frontier of 2D materials, monolithic 3D integration, and device scaling. He earned his Ph.D. in Electrical Engineering from the Massachusetts Institute of Technology and has been recognized across both academia and industry for his originality in device design, novel semiconductor materials, and integration. His research–from MIT to the lab bench of CDimension–has focused on how to break architectural bottlenecks through physics-aware, layout-driven design. Jiadi’s research has been widely cited in the field and published and presented in top-tier journals and conferences, including Nature Nanotechnology and IEEE’s International Electron Devices Meeting. Jiadi’s transition from research into startup leadership has drawn attention from leaders in semiconductors, high-performance computing, and next-generation AI hardware. Today, under Jiadi’s leadership, CDimension is overcoming the limitations of traditional chip architectures and delivering significantly better performance, efficiency, and scalability across modern computing environments. AGENDA: Thursday November 13, 2025 11:30 AM: Networking, Pizza & Drinks Noon -- 1 pm: Seminar Please register on Eventbrite before 9:30 AM on Thursday November 13, 2025 $4 IEEE members $6 non IEEE members (discounts for unemployed and students ) See examplesAdd Co-sponsored by: 636940-Santa Clara Valley Section Chapter,EMB18 Bldg: ==> Use corner entrance: Kifer Road / San Lucar Court ==> Do not enter at main entrance on Kifer Road, EAG Labs, 810 Kifer Road, Sunnyvale, California, California, United States, 95051