[]The rapid rise in power density and complexity of electronic systems has made thermal management a critical challenge for ensuring reliability, performance, and sustainability. Artificial Intelligence (AI) offers transformative opportunities to address this challenge by enabling data-driven modeling, optimization, and predictive control of cooling systems. By integrating AI with experimental and physics-based approaches, adaptive models can be developed to capture transient thermal behaviors, and optimize system-level energy efficiency. This forms the foundation for digital twins, virtual replicas that continuously interact with their physical counterparts to provide system specific real-time monitoring, and data driven decision support. In this talk, I will present recent and ongoing research activities at ES2 Binghamton on AI-enabled thermal management design, with emphasis on cooling solutions for high-power chips in data centers. I will further highlight how these developments serve as a pathway towards creating digital twins, dynamic virtual replicas that integrate real-time data, physics, and AI to enable system-level monitoring, prediction, and optimization. Together, these advancements pave the way for reliable, energy-efficient, and sustainable electronic systems. Speaker(s): Srikanth Rangarajan, Virtual: https://events.vtools.ieee.org/m/504510

[] Requirements on the high-performance compute (HPC) systems from AI workloads necessitates transition to larger package sizes with 2.5D to 3.5D integration and density scaling at every level in the stack. Several competing packaging architectures are emerging to solve the compute and power efficiency challenge presented by AI workloads. Each presents unique lithography challenges such as >100×100 field size, large chip placement deviations, fine lines and tight overlay warped substrates. The conventional lithography tools are incapable of meeting all the requirements to achieve scaling. The talk will preview Applied Materials’ Digital Lithography Technology (DLT) which enables highest resolution at production throughputs while ensuring CD uniformity and overlay accuracy across the entire panel. Speaker(s): Niranjan Khasgiwale, Virtual: https://events.vtools.ieee.org/m/502777

[] Inferencing has become ubiquitous across cloud, regional, edge, and device environments, powering a wide spectrum of AI use cases spanning vision, language, and traditional machine learning applications. In recent years, Large Language Models (LLMs), initially developed for natural language tasks, have expanded to multimodal applications including vision speech, reasoning and planning each demanding distinct service-level objectives (SLOs). Achieving high-performance inferencing for such diverse workloads requires both model-level and system-level optimizations. This talk focuses on system-level optimization techniques that maximize token throughput , achieve user experience metrics and inference service-provider efficiency. We review several recent innovations including KV caching, Paged/Flash/Radix Attention, Speculative Decoding, P/D Disaggregation, KV Routing and Parallelism, and explain how these mechanisms enhance performance by reducing latency, memory footprint, and compute overhead. These techniques are implemented in leading open-source inference frameworks such as vLLM, SGLang, Hugging Face TGI, and NVIDIA’s TensorRT-llm, which form the backbone of large-scale public and private LLM serving platforms. Attendees will gain a practical understanding of the challenges in delivering scalable, low-latency LLM inference, and of the architectural and algorithmic innovations driving next-generation high-performance inference systems. Virtual: https://events.vtools.ieee.org/m/516797

The Product Safety Engineering Society Bay Area Joint Section Chapter (SCV/SF/OEB) invites you to a virtual meetup of professionals interested in product safety and compliance. We will discuss the future of the chapter and plan future events. Agenda: - Business Meeting - Plan future activity of the chapter - New Officer Elections Virtual: https://events.vtools.ieee.org/m/518446

[]Join us for this virtual meeting! This event brings together two focused talks that connect the architecture of AI in Blockchain/Web3 with practical career guidance for professionals entering this fast-growing space. The first talk explores how intelligent systems are designed, evaluated, and governed in blockchain and fintech environments. The second outlines the skills, roles, and pathways for building a successful AI career in the Blockchain ecosystem. Together, they provide a clear view of where the industry is heading and how to prepare for it. Speaker(s): Raj Karan Gunukula , Revanth Reddy Airre Virtual: https://events.vtools.ieee.org/m/520440

[]In 2025, the landscape of digital money is shifting rapidly as the GENIUS Act establishes a federal framework for payment stablecoins while U.S. CBDC efforts pause and other regions move ahead with their own digital currency projects. This event will provide a clear overview of how stablecoins, CBDCs, tokenized deposits, and new payment rails are evolving in the U.S. and globally, and what that means for technology and finance professionals. It will conclude with a session on how volunteering within the IEEE Blockchain Technical Community creates opportunities to build leadership, grow networks across industry and academia, and contribute to impactful work in the blockchain ecosystem. Speaker(s): Marc Lijour, Revanth Airre, Virtual: https://events.vtools.ieee.org/m/521039

This is a hybrid in-person and online event. Pre-registration is required for either. The latter part of 20th century witnessed the rise of the compute utility made up of large-scale data centers housing densely-packed compute, storage and networking equipment. In the cyber age, data centers became modern day factories requiring megawatts of power for the information technology (IT) equipment, much like the process equipment in a factory of the machine age. Electrical energy supplied to the chips and systems in the data centers turned into multi-megawatts of heat energy which in turn required heat removal means. The active heat removal means also required power. While many innovative measures have been used for heat removal and energy management in data centers, there is a substantial gap in application of the fundamentals of engineering when compared to the approaches taken by the contributors of the 19th and early 20th century machine age. As an example, machine age contributors performed exergy (2nd law of thermodynamics) analysis and deemed it necessary to build a hydro-electric plant as part of the design of an Aluminum factory. Indeed, the majority of data centers today rely on the power infrastructure built by our predecessors. Given the inexorable trajectory of data centers strongly driven by AI, and associated demands on available energy, it is time we returned to such fundamentals, particularly given the environmental challenges. This talk will present a holistic approach that traces the energy flow from a power plant to a chip, and from the chip core to the cooling tower. Speaker(s): Chandrakant D. Patel, PE 925 Thompson Place, Sunnyvale, California, United States, 94085, Virtual: https://events.vtools.ieee.org/m/518438

[]Hybrid Bonding has emerged as the technology of choice in the semiconductor industry for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically on the process technology as well as materials and equipment. Design, performance characterization, thermal management and reliability are also important considerations to enable applications in various areas. Join us to learn about this expanding field, and discover how it will affect heterogeneous integration and system design. We expect registrations for our on-site program to be filled by the end of December; we apologize if you are not able to attend in person, but we encourage you to join us via WebEx. SEMI World Headquarters, 673 South Milpitas Blvd, Milpitas, California, United States, Virtual: https://events.vtools.ieee.org/m/495346

This is a hybrid in-person and online event. Pre-registration is required for either. What does it take to engineer a system that must run nonstop for years, without failure, inside the most hostile environment imaginable—the human body? In this talk, Ian Coll McEachern shares lessons from two decades designing Class III medical devices, surgical robotics, and most notably, contributing to the architecture and development of an artificial heart. Instead of focusing on any single invention, this talk reveals the methodology behind navigating extreme technical risk when dozens of tightly coupled subsystems must evolve simultaneously. Ian will walk through a practical framework for managing complexity: identifying unknowns early, building parallel test beds, using simulation to reduce risk before fabrication, and validating assumptions through rapid physical prototyping. Attendees will see how constraints—size, power, fluids, mechanics, biocompatibility, and reliability—become a forcing function for innovation rather than a barrier, and how disciplined iteration beats brute force engineering every single time. While rooted in life-critical medical devices, these principles apply far beyond healthcare. Whether designing robotics, storage hardware, automation systems, or high-reliability consumer products, this presentation will present a field-tested roadmap for tackling daunting engineering challenges, orchestrating cross-domain complexity, and building systems that must not fail. Speaker(s): Ian Coll McEachern 925 Thompson Place, Sunnyvale, California, United States, 94085, Virtual: https://events.vtools.ieee.org/m/518440

Vision for Heterogeneous Integration from Global Perspectives, 2 days, keynote talks, working groups ... 1: Registration is $125 ($100 for IEEE members). PayPal is the credit card payments processor; please do not use your Paypal account during the payment process here. This fee is only to cover the food and beverage service costs at the event. 2: Confirmation of your registration is immediately sent. please check spam for email from: [email protected] 3: STUDENTS: Current or recent graduate students please contact academic liaison Luu Nguyen [email protected] or Hualiang Shi [email protected] with research interest and using institution domain email for registration information. 4: Please park along the sides of the building Speaker(s): , , , Agenda: PLEASE check back for agenda and speaker bios Day 1 - Thursday February 19, 2026 9:30 am – 9:10 am Welcome and Agenda Review 4:35 Friday program preview Day 2 - Friday February 20, 2026 9:00 am – 9:10 am Welcome and Agenda Review 10:20 am – 10:30 am Break 11:40 am – 12:40 am Lunch 12:40 pm – 2:30 pm TWG Collaboration Meeting Team 3 2:30 pm – 2:40 pm Break 2:40 pm – 4:45 pm TWG Collaboration Meeting Team4 4:45 pm – 5:15 pm Conference Wrap up === HIR 2025 FOR REFERENCE ONLY Day 1 - Wednesday February 19, 2025 Forum on AI & Energy Efficiency and Advanced Packaging Metrology 10:30 am – 10:40 am break 10:40 am – 12:10 pm 12:10 pm – 1:10 pm Lunch 1:10 pm – 1:30 pm Welcome & Agenda Review 4:35 Thursday program preview Day 2 - Thursday February 20, 2025 9:00 am – 9:05 am Welcome 9:05 am – 9:30 am HIR Vision 10:40 am – 10:50 am Break 12:00 pm – 1:00 pm Lunch 1:00 pm – 1:10 pm Contribution Recognition – Plaque Presentation 1:10 pm – 3:00 pm TWG Collaboration Meeting Team 1 3:00 pm – 3:05 pm Break 3:05 pm – 5:00 pm TWG Collaboration Meeting Team 2 5:00 pm – 6:00 pm Networking/ Wine Tasting Day 3 - Friday February 21, 2025 9:00 am – 9:10 am Welcome and Agenda Review, EPS SCV Chapter 9:10 am - 9:45 am 9:45 am – 10:20 am 10:20 am – 10:30 am Coffee Break 10:30 am – 11:05 am 11:05 am – 11:40 am 11:40 am – 12:40 am Lunch 12:40 pm – 2:30 pm TWG Collaboration Meeting Team 3 2:30 pm – 2:40 pm Break 2:40 pm – 4:30 pm TWG Collaboration Meeting Team4 4:30 pm – 4:45 pm Conference Wrap up PLATINUM SPONSOR SILVER SPONSOR BRONZE SPONSOR SEMI INTERNATIONAL HEADQUARTERS, 673 S MILPITAS BLVD, MILPITAS, California, United States, 95035