Events for February 26, 2026

Advances in intelligent computing are redefining how we discover therapeutics and engineer regenerative tissues. This talk presents two complementary, algorithm-driven approaches aimed at transforming treatments for neurological and skeletal disorders. First, we introduce a computational peptidomics pipeline that mines genomic data to identify precursor sequences encoding neuroactive peptides, which are key modulators of signal transmission that bind heptahelical receptors. Traditional peptide discovery is slow and serendipitous; our algorithms predict peptide maturation pathways, including post-translational modifications, and pair these predictions with a high-sensitivity assay capable of detecting receptor-generated second messengers such as InsPs and cAMP. This integrated strategy has yielded promising peptide-based drug candidates for Parkinson’s disease and Osteoporosis, now advancing through animal testing. Parallel to this, we present a bioengineering framework for creating biomimetic, biocompatible bone scaffolds. Using uCT images of osteoporotic bone, we design and 3D-print trabecular structures optimized for both mechanical strength and osteoconductivity, addressing limitations of current synthetic scaffolds. These engineered matrices, enhanced by the osteogenic Calcitonin Receptor Fragment Peptide, support robust osteoblast growth and functional bone formation. Together, these innovations illustrate how algorithmic design and intelligent technologies can accelerate next-generation healing, from molecular therapeutics to regenerative tissues. Co-sponsored by: Vishnu S. Pendyala, SJSU Speaker(s): Dr. Vishnu S. Pendyala, Prof. Srinivas Pentyala Virtual: https://events.vtools.ieee.org/m/538191

The semiconductor sector continues to expand rapidly, supported by growing needs in AI, automotive electronics, and consumer devices. As the limits of traditional scaling become increasingly evident with both physically and economically, advanced packaging is taking center stage as a critical driver of higher performance, tighter integration, and further miniaturization. In this context, next-generation packaging platforms such as panel-level packaging (PLP) and glass core substrates are emerging as key technologies shaping the industry's future direction. PLP is gaining industry interest for its potential to reduce manufacturing costs and support ultra-large form-factor package. Nevertheless, its adoption introduces several materials and process challenges, including warpage management, thermal robustness, and process compatibility. To overcome the warpage issue, alternative material like glass core substrate is being explored for its exceptional dimensional stability and favourable electrical characteristics. Despite core cores advantages, the use of glass raises practical concerns in handling, via creation, and integration within existing assembly infrastructures. This presentation will delve into these evolving technology pathways, examining market motivations, supply-chain considerations, and the broader ecosystem shifts surrounding them. It will outline both the opportunities these solutions present and the technical barriers that must be overcome as advanced packaging moves into its next phase of development. Co-sponsored by: Benson Chan Speaker(s): YY Tan, Agenda: See LOCATION tab for WebEx info Virtual: https://events.vtools.ieee.org/m/541765

SCV WIE Feb 2026 ExCom ieeescvwie is inviting you to a scheduled Zoom meeting. Join Zoom Meeting https://us06web.zoom.us/j/87970173125?pwd=jmBrqlVYgnQ5jdmcRcJ1aH7ZQcBRX4.1 Meeting ID: 879 7017 3125 Passcode: 229065 --- One tap mobile +16699006833,,87970173125#,,,,*229065# US (San Jose) +16694449171,,87970173125#,,,,*229065# US Join instructions https://us06web.zoom.us/meetings/87970173125/invitations?signature=8IF6K5pz-R3xdls0sOEWYH9eNDEPHsCtib3HTHLA4KU When Thursday Feb 26, 2026 ⋅ 6pm – 7pm (Pacific Time - Los Angeles) Location https://us06web.zoom.us/j/87970173125?pwd=jmBrqlVYgnQ5jdmcRcJ1aH7ZQcBRX4.1 Agenda: - New member introductions - Past Events - Upcoming Events - Other agenda items Virtual: https://events.vtools.ieee.org/m/540508

Operating rotorcraft in the thin Martian atmosphere presents unique aerodynamic and flight dynamics challenges—first addressed during NASA’s Ingenuity Mars Helicopter mission in 2021. This seminar reviews these challenges for both current and future Mars rotorcraft. Topics include the characteristics of the Martian aerodynamic regime, Earth-based testing approaches, and Ingenuity’s flight dynamics validation on Mars. Future rotorcraft concepts will be significantly larger and more complex than Ingenuity’s coaxial design. Multi-rotor configurations introduce additional modeling difficulties, particularly in accurately capturing rotor wake interactions without resorting to computationally expensive blade-resolved CFD. To address this, the seminar will also discuss the application of the Viscous Vortex Particle Method (VVPM) as a mid-fidelity tool for simulating rotor wakes in Mars rotorcraft. Speaker(s): Tove Agren, Tove Virtual: https://events.vtools.ieee.org/m/536989