Events
Calendar of Events
|
Monday
|
Tuesday
|
Wednesday
|
Thursday
|
Friday
|
Saturday
|
Sunday
|
|---|---|---|---|---|---|---|
|
0 events,
|
0 events,
|
0 events,
|
0 events,
|
0 events,
|
0 events,
|
0 events,
|
|
0 events,
|
0 events,
|
0 events,
|
1 event,
-
[]Join us for an insightful webinar with Francesco Carobolante, founder of IoTissimo® LLC and an EPS Distinguished Lecturer, as he explores the critical challenges and innovative solutions that advanced packaging can provide to address the "Power Wall". With over 30 years of industry experience and a tenure at Intel’s Corporate Strategy Office, Francesco will delve into the Heterogeneous Integration Roadmap (HIR) perspective on scaling high-power AI processors. This session will analyze how signal BW and energy requirements dictate the options available for architecting the package structure, including Vertical Power Delivery, integrated voltage regulators and advanced thermal management techniques. Discover how these architectural shifts are enabling the next generation of data center performance. Speaker(s): Francesco Carobolante, Virtual: https://events.vtools.ieee.org/m/546237 |
0 events,
|
0 events,
|
0 events,
|
|
0 events,
|
1 event,
-
As uOLED and uLED technologies transition from research to high-volume manufacturing, system performance is increasingly constrained by process variability rather than design intent. Electrical, thermal, and mechanical decisions made during manufacturing directly translate into optical non-uniformity, efficiency loss, and reliability challenges. Understanding these process-to-performance linkages is critical for building scalable, high-performance emissive display systems. Virtual: https://events.vtools.ieee.org/m/533601 |
0 events,
|
0 events,
|
0 events,
|
0 events,
|
1 event,Continuation of Speaker Series at Stanford IEEE. Stanford, California, United States, 94305 |
1 event, |
2 events,[] (We anticipate closing registration in late April due to limited facility space; we apologize in advance if we cannot register you.) The 2026 Build-up Substrate Symposium (BUSS) convenes global leaders in semiconductor packaging, substrate technology, and AI-driven systems. Under the theme “Next-Gen Substrates: Accelerating Innovation in the AI Era,” the symposium explores how advanced substrates are enabling transformative breakthroughs in chiplet integration, heterogeneous systems, and Co-Packaged Optics (CPO). As AI, HPC, and edge computing drive unprecedented performance demands, next-generation substrates are emerging as the foundation for scalable, high-performance, and energy-efficient solutions. Chiplets and CPO are rapidly gaining traction as a critical enabler of high-bandwidth, low-latency interconnects, further elevating the role of substrates in next-gen architectures. BUSS 2026 showcases innovation across the entire ecosystem—from materials to manufacturing and integration —- highlighting how substrate advancements are powering the future of semiconductor technologies, including the convergence of optics and electronics. SEMI World Headquarters, Milpitas, California, United States We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced with 3D heterogeneous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based in Asia, leaving a desert in the US. Volume build-up substrates used by major IDMs are manufactured in Asian countries including Taiwan, Japan and China. However, there are multiple activities starting up in the US, and this is why a gathering of the US players is important. This symposium is geared for all those involved in the supply chain of build-up substrates in the US, as well as users. As the US Congress debates H.R. 3249, the Protecting Circuit Boards and Substrates (PCBS) Act, this Symposium is an opportunity for all build-up substrate players to meet, network and cohesively work with funding agencies who will be invited to this symposium to focus on onshoring build-up substrate production and utilization. ***CANCELED*** location to be announced, Milpitas, California, United States, Virtual: https://events.vtools.ieee.org/m/544352 |
0 events,
|
0 events,
|
0 events,
|
0 events,
|
|
1 event,
-
The IEEE Blockchain Forum is returning for the fourth time as part of (https://www.torontotechweek.com/). The goal of this compact one-day event is to congregate BUIDLers, researchers, academics, and engineers building blockchain protocols, infrastructure, and decentralized software applications. Note: (https://events.vtools.ieee.org/m/469545) counted with 200 participants and speakers from JP Morgan, the Bank of Canada, Mastercard, the Ethereum Enterprise Alliance, EY, Starknet, among others. [] Co-sponsored by: Toronto Tech Week and the Government of Ontario Speaker(s): Lawrence Ley, Ken Timsit, Manuel Badel, Srisht Fateh Singh, Revanth Reddy Airre, Ngozi Nora Agwu, Douglas Heintzman, Nisrine Labcir, Griff Green, Thomas You Agenda: Morning - Keynotes - Thought leadership talks from industry leaders - In-depth panels Lunch will be provided Afternoon - Technical talks - Workshops - Startups pitches and demos Ontario Investment and Trade Centre, 250 Yonge Street, 35th Floor, Toronto, Ontario, Canada, M5B 2L7 |
0 events,
|
0 events,
|
0 events,
|
0 events,
|
0 events,
|
0 events,
|