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[]In 2025, the landscape of digital money is shifting rapidly as the GENIUS Act establishes a federal framework for payment stablecoins while U.S. CBDC efforts pause and other regions move ahead with their own digital currency projects. This event will provide a clear overview of how stablecoins, CBDCs, tokenized deposits, and new payment rails are evolving in the U.S. and globally, and what that means for technology and finance professionals. It will conclude with a session on how volunteering within the IEEE Blockchain Technical Community creates opportunities to build leadership, grow networks across industry and academia, and contribute to impactful work in the blockchain ecosystem. Speaker(s): Marc Lijour, Revanth Airre, Virtual: https://events.vtools.ieee.org/m/521039 |
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This is a hybrid in-person and online event. Pre-registration is required for either. The latter part of 20th century witnessed the rise of the compute utility made up of large-scale data centers housing densely-packed compute, storage and networking equipment. In the cyber age, data centers became modern day factories requiring megawatts of power for the information technology (IT) equipment, much like the process equipment in a factory of the machine age. Electrical energy supplied to the chips and systems in the data centers turned into multi-megawatts of heat energy which in turn required heat removal means. The active heat removal means also required power. While many innovative measures have been used for heat removal and energy management in data centers, there is a substantial gap in application of the fundamentals of engineering when compared to the approaches taken by the contributors of the 19th and early 20th century machine age. As an example, machine age contributors performed exergy (2nd law of thermodynamics) analysis and deemed it necessary to build a hydro-electric plant as part of the design of an Aluminum factory. Indeed, the majority of data centers today rely on the power infrastructure built by our predecessors. Given the inexorable trajectory of data centers strongly driven by AI, and associated demands on available energy, it is time we returned to such fundamentals, particularly given the environmental challenges. This talk will present a holistic approach that traces the energy flow from a power plant to a chip, and from the chip core to the cooling tower. Speaker(s): Chandrakant D. Patel, PE 925 Thompson Place, Sunnyvale, California, United States, 94085, Virtual: https://events.vtools.ieee.org/m/518438 |
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[]Hybrid Bonding has emerged as the technology of choice in the semiconductor industry for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically on the process technology as well as materials and equipment. Design, performance characterization, thermal management and reliability are also important considerations to enable applications in various areas. Join us to learn about this expanding field, and discover how it will affect heterogeneous integration and system design. We expect registrations for our on-site program to be filled by the end of December; we apologize if you are not able to attend in person, but we encourage you to join us via WebEx. SEMI World Headquarters, 673 South Milpitas Blvd, Milpitas, California, United States, Virtual: https://events.vtools.ieee.org/m/495346 |
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