We’re excited to continue the Orange County Computer Society (OCCS) Global Emerging Technologies (GET) Series—a monthly platform dedicated to spotlighting groundbreaking innovations in computer science and technology. Hosted by the IEEE Orange County Computer Society Chapter, this series brings together professionals, students, and tech enthusiasts to explore what’s next in emerging tech. Following an insightful June session focused on enterprise AI integration and large language model (LLM) development, we’re back this August after a brief summer break with another dynamic double-feature exploring AI at scale—from healthcare to production-ready ML systems. As AI adoption accelerates, so do the complexities of real-world deployment. This month’s talks tackle those complexities head-on, offering both strategic and technical perspectives on building reliable, scalable, and human-centered AI solutions. In this session: 🔹 The first talk delves into the deployment of agentic AI systems in healthcare, addressing challenges such as data heterogeneity, safety, regulation, and trust. You’ll learn about explanation-based and modular design principles, hybrid RAG-based deployment strategies, and real-world applications across triage, radiology, and dementia care. 🔹 The second talk bridges the gap between ML experimentation and production. Through a practical case study, it explores the full machine learning lifecycle—from training to CI/CD-enabled deployment—along with best practices in MLOps, model monitoring, and cross-functional collaboration. Key topics include: ✅ Designing safe, explainable agentic AI in healthcare ✅ Deployment frameworks using hybrid RAG models ✅ ML development lifecycle: from notebooks to production ✅ CI/CD pipelines, monitoring, and model versioning ✅ Scalable and collaborative MLOps strategies Whether you're building AI for regulated industries or scaling ML pipelines across teams, this session will provide the tools, frameworks, and real-world insights to drive your work forward. 📅 Join us on Tuesday, August 26 from 5:00 PM to 7:00 PM PT for an evening of learning, discussion, and community. 🎤 Interested in speaking at a future session? Reach out to [email protected] — we’re always looking for passionate voices shaping the future of technology. Let’s keep advancing innovation—together. Speaker(s): Vivek, Babul Agenda: Time (in PST) Activity 05:00pm - 05:15pm Check-in and networking 05:15pm - 05:30pm OCCS Chapter Introduction! 05:30pm - 06:00pm Speaker: Vivek Bharti 06:00pm - 06:30pm Speaker: Babul Sahu 06:30pm - 07:00pm Q/A Virtual: https://events.vtools.ieee.org/m/494867

Recent advancements in machine learning, while powerful, are often burdened by significant computational and memory requirements, limiting their deployment in resource-constrained settings. Hyper dimensional Computing (HDC) emerges as an alternative with its simplicity, lightweight operations, and robustness to errors. By encoding data into high-dimensional vectors and performing efficient algebraic computations, HDC opens a new avenue as an efficient learning paradigm. In this talk, Dr. Fatemeh Asgarinejad will introduce the fundamentals of HDC and briefly discuss existing research that has extensively explored various stages of HDC algorithm. Then, she will present three key domains of her research: First, she will discuss PIONEER, a novel approach that employs learned projection vectors to optimize the encoding process. By leveraging neural networks to learn these vectors, PIONEER enables HDC to achieve high accuracy with significant computational efficiency. Second, she will present HDXpose, an adversarial attack framework that exploits an advantage of HDC: “explainability”. By strategically analyzing and perturbing influential input points, HDXpose effectively unveils vulnerabilities within HDC models, underscoring the need for robust security measures in HDC system design. Lastly, Dr. Asgarinejad will show an application of HDC in developing a cost-effective and noise-resilient pressure mat system for human activity recognition. The HDC-based system surpasses CNNs in accuracy and efficiency. Co-sponsored by: Media Partner: Open Research Institute (ORI) Speaker(s): Fatemeh Asgarinejad Agenda: - Invited talk from Dr. Fatemeh Asgarinejad, an incoming Assistant Professor of Teaching in the Electrical and Computer Engineering Department at the University of California, Riverside. - Q/A Session Virtual: https://events.vtools.ieee.org/m/496707

The use of wearable electronic devices that can acquire vital signs from the human body noninvasively and continuously is a significant trend for healthcare. The combination of materials design and advanced microfabrication techniques enables the integration of various components and devices onto a wearable platform, resulting in functional systems with minimal limitations on the human body. Physiological signals from deep tissues are particularly valuable as they have a stronger and faster correlation with the internal events within the body compared to signals obtained from the surface of the skin. In this presentation, I will demonstrate a soft ultrasonic technology that can noninvasively and continuously acquire dynamic information about deep tissues and central organs. I will also showcase examples of this technology's use in recording blood pressure and flow waveforms in central vessels, monitoring cardiac chamber activities, and measuring core body temperatures. The soft ultrasonic technology presented represents a platform with vast potential for applications in consumer electronics, defense medicine, and clinical practices. Speaker(s): Dr. Sheng Xu Agenda: 6:50 - 7 PM: Registration 7-8 PM: Talk and Q&A Virtual: https://events.vtools.ieee.org/m/495898

Extremely Power-Dense Solar Panels for the Extremes of Space https://www.eventbrite.com/e/1539115508919?aff=oddtdtcreator Abstract: Ultrathin photovoltaic devices based on two-dimensional (2D) transition metal dichalcogenides (TMDs) have emerged as promising candidates for next-generation solar power in weight- and volume-constrained environments. In this talk, I will present flexible TMD solar cells that integrate semitransparent contacts and engineered interfacial layers to enhance charge collection, optical absorption, and environmental stability. Compared to traditional thin-film and III-V technologies, these 2D devices offer superior specific power, mechanical flexibility, and potential resilience under extreme operating conditions. I will also discuss pathways for transitioning TMD photovoltaics from laboratory demonstrations to real-world deployment in aerospace, mobile, and off-grid systems. This includes recent efforts through Arinna, a spin-out focused on advancing 2D solar technologies for mission-ready applications across space, mobility, and distributed energy sectors. Read More: (https://www.arinna.xyz/) (https://www.nature.com/articles/s41467-021-27195-7) (https://www.cell.com/device/fulltext/S2666-9986(25)00036-5) [] Bio: Dr. Koosha Nassiri Nazif is a leading expert in high-specific-power photovoltaics, with over a decade of experience in thin films and two-dimensional (2D) materials. He earned his Ph.D. in Electrical Engineering from Stanford University, where he led foundational research on flexible transition metal dichalcogenide (TMD) solar cells, resulting in multiple publications and patents. His postdoctoral work at Stanford focused on scalable manufacturing and radiation resilience of these materials. He is now co-founder and CEO of Arinna, where he is building on this foundation to commercialize breakthrough solar technologies for advanced power and mobility systems. In-Person Meeting Thursday, August 28, 2025 11:30 AM: Networking, Pizza & Drinks Noon -- 1 pm: Seminar -------- Please register on Eventbrite before 9:30 AM on Thursday August 28 Co-sponsored by: SCV/SF Jt. Section Chapter, ED15 Joint Chapter Agenda: 11:30 AM: Networking, Pizza & Drinks Noon -- 1 pm: Seminar Break & Networking 1 pm -- 1:30 pm Optional Lab Tour 1:30 pm - 2:00 pm Covalent Metrology, 923 Thompson Pl, Sunnyvale, California, United States, 94085

[]Advances in smart response-based processes have significantly improved wire bond reliability and further strengthened the use of the technology in high-volume manufacturing (HVM). Wire bonding technology remains a staple choice in vast majority of semiconductor packages due to its low cost, increased flexibility, and high yield rate. A traditional wire bond process consists of a wire loop with a ball bond on die and a wedge bond on substrate. Vertical Wires are an emerging interconnect solution formed using a unique process on the same ball bond equipment. Vertical Wires can be used as an alternative to the traditional wire bond processes or in conjunction with the traditional wire loops in SiPs. Although initially developed for interconnection applications, Vertical Wire technology was introduced in HVM for EMI shielding in SiP and RF packages. This presentation will detail new advances in Vertical Wire Technology to further reduce wire pitch, increase I/O density, and reduce package footprint. An overview of application range, capability and design rules for the technology will be discussed. Speaker(s): Basil Milton, Virtual: https://events.vtools.ieee.org/m/495344

IEEE SCV WIE AI Summit 2025 In an era where AI technologies are rapidly transforming industries and redefining possibilities, it is crucial to explore both the innovations driving this change and the responsibilities that come with it. Today, we will delve into a diverse array of topics that highlight the multifaceted nature of AI and its profound impact on our lives. Our sessions will cover the latest developments in Large Language Models and Foundation Models, exploring efficient fine-tuning, multilingual adaptation, and the role of LLMs as knowledge bases. We will also examine the evolution of AI agents, focusing on autonomous task completion, multi-agent collaboration, and the integration of external knowledge for robust decision-making. In the realm of Vision and Multimodality, we will explore the integration of text, image, and video understanding, as well as advanced techniques like zero-shot learning and self-supervised learning. Our discussions on MLOps for LLMs will provide insights into best practices for training, deploying, and evaluating large models. We will also address the critical areas of Knowledge-Grounded Reasoning, On-Device Learning, and the ethical dimensions of AI, including bias mitigation, privacy preservation, and the detection of misinformation. Talk tracks are broadly classified but not limited to, 1. Large Language Models (LLMs) & Foundation Models 2. AI Agents 3. Vision & Multimodality 4. MLOps for LLMs 5. Knowledge-Grounded & Reasoning 6. On-Device Learning for LLMs and Multi-Modal AI 7. Ethics, Bias & Fairness Speaker(s): Jagruti Mahante & Shreya Anand, Jesmin Jahan Tithi, Harika Rama Tulasi Karatapu, Pallishree Panigrahi, Rong Wang and Sushma Venkatesh Reddy, Disha Ahuja, Shubhi Asthana Agenda: 3:15-4:00 Registration 4:00-4:10 IEEE SCV WIE Welcome Message 4:15-4:45 Multi-Agentic Synthetic Data Generation for Realistic, Multi-Turn Conversations - By Disha Ahuja, Cisco 4.50-5.20 The LLM Imperative: Secure Your AI Frontier Before It Fractures Your Enterprise - By Jagruti Mahante & Shreya Anand, Workday 5:25-5:55 Designing Data Centers for Next-Gen Language Models - By Jesmin Jahan Tithi, Intel 5:55-6:30 Networking and Refreshments 6:30-6:50 ReAct Prompt Design: Enhancing LLM Reasoning & Tool Use - By Shubhi Asthana, IBM 6:55-7:15 AI Powered SaaS on GCP - By Harika Rama Tulasi Karatapu, Google 7:20-7:40 Designing for Trust: Responsible AI from Data to Deployment - By Pallishree Panigrahi, Amazon 7:45-8:05 The First Enablement of GPU On-Device LLMs on Intel Chromebook Platforms - By Rong Wang and Sushma Venkatesh Reddy, 8:05-8:10 Final Wrap-up Bldg: SC12, Intel, 2200 Mission College Blvd, Santa Clara, California, United States, 95054