The combined Santa Clara Valley, San Francisco, & Oakland/East Bay IEEE PELS is very pleased to invite you to our upcoming in-person event. We are excited and honored to have Prof. Uttam Singisetti of the University at Buffalo to speak on the topic of Potential and challenges in gallium oxide, the next generation power semiconductor technology. Here's more about the talk from the Speaker: The monoclinic -gallium oxide (Ga2O3) (bandgap 4.8 eV) is one of several ultra-widebandgap semiconductors (UWBGs) that have garnered a lot of interest as next generation power semiconductor technology. Since the first demonstration of a MESFET in 2012, Ga2O3 device research has progressed at an incredible pace with reports of MOSFETs and diodes achieving 10 kV breakdown voltages. Gallium oxide devices have also achieved impressive high power device figure of merit, high average field strengths and high-speed performance. The high critical electric field, good electron mobility, multiple shallow donors, availability of large area substrates and growth of high-quality epitaxial films; have all contributed to the rapid progress in device performance. As a result, it has emerged as a promising ultra-widebandgap semiconductor for next generation power, GHz switching and RF applications. In addition to the large Baliga’s Figure of Merit (BFoM); good electron mobility, calculated electron velocities lead to higher Johnston’s Figures of Merit (JFoM). Additionally, the large bandgap also enables high temperature operation and radiation hardness making it attractive for space applications such as Mars and Venus missions. This talk will present the most recent advances in gallium oxide devices; both from our group and others. We will present the lateral MOSFETs with improved field plate design and beyond-kV breakdown. Temperature dependent analysis and device simulation suggest an extrinsic breakdown mechanism outside the channel. A simple and yet effective SU-8 polymer passivation technology provides a significant improvement in breakdown voltages. The higher field strength of the SU-8 polymer enables a significant increase in breakdown voltage to 8.5 kV in lateral MOSFETs. However, these devices show a high Ron, which is due to the depletion caused by RIE of the channel. We will present the use of ultra-high vacuum annealing techniques to improve the on-resistance of the devices still maintaining the multi-kilo-volt rating of the devices. We will also present on-wafer individual device level switching characteristics. I will discuss the progress made on vertical Schottky barrier diodes (SBDs) which have rapidly achieved both high voltages and high-power deice figures of merit. Several groups have incorporated nickel-oxide/gallium oxide hetero-junction p-n diodes to successfully overcome the absence of p-doping in gallium oxide. High surge-current capability and unclamped inductive switching (UIS) have been demonstrated in these devices despite the low thermal conductivity. Finally, I will discuss the approaches that could address the challenges in this semiconductor system (low thermal conductivity and absence of p-doping). I will conclude by discussing the factors that could potentially lead to successful lab-to-fab transition in this exciting next generation power semiconductor technology. Speaker(s): , Dr. Uttam Singisetti Plug and Play Tech Center, 440 N Wolfe Rd, Sunnyvale, California, United States, 94085

Abstract Microchannel particle deposition (MPD) is a wafer-scale thick-film deposition process used to accurately and in a scalable way deposit nanoparticles. Unique features include: 1) full wafers patterning in 15-minutes, 2) structures can be deposited with a size ranging from 1 – 50 microns and with high aspect ratios up to 5 and 3) full 3D-control of the printed structures. In addition, I can share some of the applications we’re focusing on such as: 1) printing sensing electrodes for metal oxide gas sensors, 2) printing of getters and 3) printing of ultra-fine line glass frit bonding rims. Speaker(s): Mr. Thomas Russell , Agenda: 6:30 – 7:00 PM Registration & Networking 7:00 – 7:45 PM Invited Talk 7:45 – 8:00 PM Questions & Answers Northeastern University Welcome Center Space, 75 E Santa Clara Street, San Jose, California, United States, 95113, Virtual: https://events.vtools.ieee.org/m/437916

Abstract: While silicon scaling has reached astonishing levels over the last half century, there has not been a corresponding level of scaling in electronic packaging technology. However, Artificial Intelligence (AI) architectures are now changing the landscape, increasingly moving us towards advanced packaging technology and Heterogeneous Integration (HI). What are these unique requirements of AI which are driving the need for HI? What are some of the unique challenges in semiconductor and packaging technologies that must be overcome to make this successful? This seminar will discuss key HI methods including interposers, fan out wafer level processing, silicon bridges, and 3D integration to see how they can be leveraged to achieve AI architectures. [] Speaker(s): Dr. Mukta Farooq, Virtual: https://events.vtools.ieee.org/m/440607

Generative AI Explore how this groundbreaking technology is reshaping industries, from creative content generation to enterprise applications, and discuss the ethical considerations and responsibilities tied to its development and deployment. Conscious Technology Engage in thought-provoking discussions on how technology can be developed and applied in a manner that is mindful of societal impacts, sustainability, and human well-being. We will look at how conscious design and innovation are paving the way for more responsible tech advancements. Speakers include Chien-Sheng Wu, Director, AI Research, Salesforce; Audrey Lee, Sr. Director, Microsoft; Albert Liu, Founder & CEO, Kneron; Winnie Tsou, Senior Director, Fujitsu, and more More Details: https://www.uthf.net/ Registration: https://events.humanitix.com/2024-uthf?c=ieee Co-sponsored by: North America Taiwanese Engineering & Science Association, NATEA https://natea.org/ Speaker(s): Chien-Sheng Wu, Audrey Lee Agenda: https://www.uthf.net/ Bldg: Grand Hall, Computer History Museum, Mountain View, California, United States

[] Free Registration (with a Zoom account; you can get one for free if you don't already have it): https://sjsu.zoom.us/meeting/register/tZcvf--vrD0vG9PV_qyMcgadMIWG2eH2LrpY Synopsis: Neurological disorders are a leading cause of disability and death worldwide. Early detection and efficient management of these disorders can provide significant health benefits. By providing real-time, data-driven insights AI-driven methods meet an urgent need for early detection and management of these disorders. In this talk, Prof. Phoha will present the potential of AI-driven early diagnosis and Digital Therapeutics (DTx) for neurological disorders. Using the unique properties of data generated through neurological anomalies and disorders, one can use AI methods such as transfer learning from existing knowledge; one-shot and few-shot learning for spiking and sparse data, and hidden Markov models to find underlying relationships and causes of malignant neurological disorders. The speaker will show how the generated data can be captured through smart wearables and phones, how uncovering relationships provides insights for digital rehabilitation, and how using augmented reality and virtual reality provides tremendous potential for cognitive therapy, psychiatric assessments, and rehabilitation. Prof. Phoha will outline a proof-of-concept smart diagnostics-enabled mirror and discuss security issues in smart diagnostics. Speaker(s): Prof. Vir Phoha, Dr. Vishnu S. Pendyala Virtual: https://events.vtools.ieee.org/m/438778

Small Unmanned Aerial Systems (sUAS) must be monitored closely to identify, diagnose, and potentially mitigate flight problems as they arise. During the flight, the vast amounts of multivariate time series data typically generated by sUAS flight controllers can be complex to understand and analyze. While formal product documentation often provides example data plots with diagnostic suggestions, the sheer diversity of attributes, critical thresholds, and complex data interactions can be overwhelming to non-experts who subsequently seek help from discussion forums to interpret their data logs. Solutions based on deep learning or heuristics can be used to detect anomalies in different time-series data attributes. However, understanding and mitigating the root cause of flight problems based upon the combination of multiple detected data anomalies requires significant domain expertise. To address these challenges, this talk will present approaches that leverage deep learning and heuristic methods to detect anomalies in flight data, both for real-time and post-flight analysis. Additionally, it will explore how the combination of multiple detected anomalies can be utilized to diagnose the root cause of the flight issue. The solutions proposed aim to simplify the anomaly detection process while providing a more systematic approach for diagnosing complex flight behaviors. Co-sponsored by: Media Partner: Open Research Institute (ORI) Speaker(s): Md Nafee Al Islam Agenda: - Invited talk from Assistant Prof. Md Nafee Al Islam , from the University of San Diego. - Q/A Session Virtual: https://events.vtools.ieee.org/m/442925

This is a hybrid in-person and online event. Pre-registration is required for either. PLEASE NOTE: This talk replaces our earlier SCORE talk which needed to be cancelled. This talk will explore the evolution of traditional data warehouses into modern lakehouses, driven by advancements in AI and machine learning (ML). Included will be an examination of the limitations of first-generation data warehouses, which were optimized for structured data and batch processing, but which struggled with the unstructured, real-time data required for AI applications. These warehouses have evolved into data lakes to support the increased demands of AI/ML workloads, while addressing their challenges for business intelligence (BI). In this talk, Suresh Bysani will describe the lakehouse architecture, which integrates the best of data lakes and warehouses by offering a unified platform for real-time analytics and ML. The talk will also dive into the latest in-product analytics development, as well as how AI-driven queries are reshaping how organizations provide insights directly through their products by leveraging AI for more interactive and intelligent decision-making. Speaker(s): Suresh Bysani, 673 South Milpitas Blvd., Milpitas, California, United States, 95035, Virtual: https://events.vtools.ieee.org/m/440391

[]Predictions have always attracted interest, because seeing the future could be useful, powerful, and fun. Those who can predict are ahead of others — they have a strategic advantage. Predictions are essential in business, technology, and science. With COVID and recent wars, predictions became critical to humankind’s survival. However, predictions are also very hard because they depend on many factors, including technological, economic, social, and ecological. Technology predictions may be simplest, but technology also depends on business, i.e. economics. Teams in the IEEE Computer Society and IEEE Future Directions Committee (FDC), led by the presenter, have conducted technology predictions for more than a decade. FDC has identified three key megatrends: digital transformation, sustainability, and artificial general intelligence. Our predictions have gained a lot of interest in the community, resulting in annual press releases, five special issues of IEEE Computer, and quarterly columns. Speaker(s): Dejan Milojicic, Virtual: https://events.vtools.ieee.org/m/432927

[] The IEEE EPS (SCV, SF, OEB) is excited to be hosting a 'Meet & Greet' (an in-person event in Milpitas, CA) for those in the fields of semiconductor packaging. This is a unique opportunity for the packaging professionals in the Valley to find out more about our committees, hear about upcoming events (online and in-person), connect and network with local experts in materials, advanced packaging, production, and reliability. The organizers also plan to have quickfire presentations/discussions on some of the enabling technologies that have helped and will continue to spur the evolution of AI around us. The topics for discussion include Heterogeneous Integration, Hybrid Bonding, Build-Up Substrates and Quantum Computing. We'll also touch on some aspects of IEEE Membership, its benefits, opportunities for Member Elevation, and guidance if one were interested to pursue becoming a Senior Member. Food and drinks will be served -- come enjoy this time together! SEMI World Headquarters, 673 South Milpitas Blvd, Milpitas, California, United States, 95035

Autonomy has become ubiquitous in every aspect of daily life. Today's society is rapidly advancing towards autonomous vehicles that interact with humans; and we are witnessing significant progress in development of autonomous vehicles for many applications (unmanned aerial systems, space robots, self-driving cars, etc). The safety-critical nature of these systems requires us to provide simple, easy-to-test approaches that are not necessarily the best in terms of performance. In this talk, I will share my experiences, learned-lessons during the development of several autonomy projects ranging from full-scale autonomous Boeing helicopters, Mars rovers, Tesla self-driving cars to Airbus airplanes. These autonomous vehicles operate on a different spectrum of environmental conditions such as aerial, space, and urban cities. Also, these vehicles have different capacity and limitations of hardware resources which restrict the set of methods that can be implemented for real-time execution. I will conclude my talk with an overview of videos, results from successful demonstrations. Speaker(s): Dr. Arslan Agenda: 6:00 - 6:30 - Networking and light dinner (for in person attendees) 6:30 - 7:30 - Talk and Q & A 7:30 - 8:00 - Wrap up and Networking Room: 225, Bldg: Heafey , Santa Clara University, 500 El Camino Real , Santa Clara , California, United States, 95053, Virtual: https://events.vtools.ieee.org/m/442447

Titanium:sapphire-on-insulator photonics for on-chip lasers and amplifiers https://www.eventbrite.com/e/1045471723067?aff=oddtdtcreator Abstract: Titanium-doped sapphire (Ti:Sapphire) lasers have enabled significant breakthroughs and technologies throughout the past decades, from the development of the optical frequency comb to multiphoton microscopy of biological tissues. Ti:Sapphire lasers are unmatched in bandwidth and tuning range, and as a result, are indispensable in areas such as atomic physics and quantum optics. Despite the utility of Ti:Sapphire lasers, their use is severely restricted due to their large size, cost, and need for high optical pump powers. In this presentation, I will introduce our work on the development of a monocrystalline Titanium:Sapphire-on-insulator (Ti:SaOI) photonics platform, which enables dramatic miniaturization, cost-reduction, and scalability of Ti:Sapphire technology. [] Bio: Joshua Yang is the CEO and Co-Founder of Brightlight Photonics, a company which is commercializing integrated Ti:Sapphire laser technology. Joshua completed his BS at The University of Texas at Austin, and obtained his PhD from Stanford University, where he led the work on developing an integrated Ti:Sapphire photonics platform. In-Person Meeting Wednesday, November 20, 2024 11:30 AM: Networking, Pizza & Drinks Noon -- 1 pm: Seminar -------- Please register on Eventbrite before 9:30 AM on Wednesday, November 20 Co-sponsored by: SCV/SF Jt. Section Chapter, ED15 Joint Chapter Agenda: 11:30 AM: Networking, Pizza & Drinks Noon -- 1 pm: Seminar Covalent Metrology, 923 Thompson Pl, Sunnyvale, California, United States, 94085

Abstract The previously discrete technologies of Cyber-Physical/IoT Systems (CPS-IoT) and AI/ML have recently entered a tight, virtuous embrace. CPS-IoT technologies allow MEMS sensing and interventions in our physical, social, and urban spaces with unimaginable ubiquity. AI/ML methods allow sophisticated inferences and decisions to be made algorithmically using neural and neurosymbolic architectures, even from unstructured and high-dimensional spatiotemporal data, with uncanny performance. Together, they perform sophisticated perception-cognition-communication-action loops in diverse applications. After briefly discussing the current state of AI/ML methods for sensing in CPS-IoT systems, I will focus on the new opportunities and challenges for CPS-IoT emerging from Foundation Models, including Large Language/Multimodal Models, that have caused tremendous and broad excitement in AI. Based on preliminary research findings, the talk will provide insights into (i) the role that LLMs -- with their world knowledge, ability to process sequences, and reasoning capabilities – can play in sophisticated MEMS sensor data analytics in CPS-IoT systems, (ii) the current capabilities and unresolved challenges of emerging foundation models focused on sensory data streams in the CPS-IoT domain. Speaker(s): Prof. Mani Srivastava, Agenda: 6:30 – 7:00 PM Registration & Networking 7:00 – 7:45 PM Invited Talk 7:45 – 8:00 PM Questions & Answers Virtual: https://events.vtools.ieee.org/m/444309

- Free Exhibits (registration required still) during the event and also Happy Hour at 3:30pm Agenda - 8:30 AM Light breakfast and registration - 9:00 AM Welcome remarks and introductions Signal and Power Integrity - 9:10 AM Chander Ravva, Marvell Technology, Inc. IC Packaging for Data Centers Devices: High Speed Interconnects Powering Data Compute and Data Transfer - 9:45 AMDr. Victor Khilkevich, New Methods for High-FrequencyCharacterization of PCB Materials Missouri Univ. of Sci. and Tech. - 10:20 AM Break and vendor table-top show - 10:45 AM Dr. Hanfeng Wang, Google Inc. Introduction to Multi-Module PowerTree Simulation Flow - 11:20 AM Round Table Discussion - Future directions and challenges in SIPI - 11:50 AM Lunch (included) AI/ML in EMC+SIPI - 12:50 PM Dr. Lijun Jiang, Missouri Univ. of Sci. and Tech. An Outlook of Physical Layer Modeling Technologies for Complex Electromagnetics Environments Inspired by Machine Learning Methods - 1:25 PM Baolong Li, Cadence Design Systems AI/ML for SIPI - 2:00 PM Break and vendor table-top show - 2:25 PM Dr. Chulsoon Hwang, Missouri Univ. of Sci. and Tech. Machine Learning-Assisted PDN Design - 3:00 PM Round Table Discussion - Future directions and challenges in AI/ML in EMC+SIPI - 3:30 PM Happy Hour sponsored by Rhode and Schwarz - 4:00 PM End of program Prices range from $60.00 to $150.00 (price depends on options selected) Speaker(s): Chulsoon Hwang , Baolong Li , Dr. Lijun Jiang , Ravva Chander , Victor Khilkevich, Hanfeng Wang Agenda: - What: Silicon Valley Area Workshop on EMC (SV-EMC) – Recent advances in signal and power integrity and AI/ML - When: Friday, Nov. 22, 2024 - Where: Rhode & Schwarz, 690 McCarthy Blvd, Milpitas, CA-95035 - There will be a total of 6 invited speakers. We are still working on who all will speak, but following is our current list. The titles are tentative. - The morning and afternoon sessions will be followed by a short round table discussion on major upcoming problems in the field that should be addressed in the near future. - small table top show of companies in the EMC/SIPI area to show off their wares. - There will be a modest charge for admission (around $100-150 with a discount for IEEE and/or EMC Society membership) - A light breakfast, snacks, and lunch will be provided. - Rhode & Schwarz will host a social hour with drinks after the event. Exhibit is FREE to attend but registration is still required. Bldg: Rhode & Schwarz Conf. Center, 690 McCarthy Blvd, Milpitas, California, United States, 95035