[] Free Registration (with a Zoom account; you can get one for free if you don't already have it): https://sjsu.zoom.us/meeting/register/tZEuc-GqrTsvGdGE6yu9qQCx1z2PyRVJZaDj Synopsis: After a brief intro highlighting issues and solutions for data privacy in machine learning settings, Prof. Gautam Kamath will answer your questions related to data privacy, machine unlearning, research, academia, career advice, and anything in between. Please feel free to check out the work and thoughts of Prof. Gautam Kamath, Ph.D. from MIT, http://www.gautamkamath.com/ on Google Scholar at https://scholar.google.com/citations?user=MK6zHkYAAAAJ&view_op=list_works&sortby=pubdate, YouTube https://www.youtube.com/results?search_query=gautam+kamath and generally on the Internet. Then, please feel free to submit your questions - via Twitter by using the hashtag, #KamathAMA and tagging @vishnupendyala - emailing vspendyala(at)hotmail(dot)com with #KamathAMA in the subject - during your registration on Zoom Selected questions will be answered by Prof. Kamath during the session. Audience may be able to ask follow-up questions during the session, using the Chat feature.. Speaker(s): Dr. Gautam Kamath, Dr. Vishnu S. Pendyala Virtual: https://events.vtools.ieee.org/m/431191

GUESTS WILL NEED TO SCAN QR CODE AVAILABLE ON PARKING LOT SIGNAGE OR AT FRONT DESK, ENTER THEIR LICENSE PLATE NUMBER AND VALIDATION CODE T6TGJ TO RECEIVE COMPLIMENTARY PARKING. Santa Clara Valley IEEE Power & Energy and Industry Applications Societies Co-hosted by SF PES, OEB PES Join us October 2nd for a presentation and discussion on: PG&E & Community Microgrids Speakers: Shreya Kodnadu and []Franz Stadtmueller: Grid Innovation | Clean Energy and Sustainability Advocates, PG&E Cost: IEEE Members $15 by 9/26 Non-Members $25 by 9/26 (https://events.vtools.ieee.org/m/432373) (After 9/26, if space available, registration will be $5 more and non-refundable) Date: October 2, 2024, 6:00 to 8:30 PM Place: Delta/Marriott Hotel Santa Clara-Silicon Valley About the talk: About the talk: When severe weather or other events take the electric grid down is your community ready? If your answer is no, a community Microgrid might be the solution. A Microgrid (MG) can provide a source of localized power during a grid outage due to extreme weather, a Public Safety Power Shutoff event or other outage. In addition, they can offer efficiency, cost and environmental benefits. A community MG is a group of PG&E customers and Distributed Energy Resources (DERs) within a clearly defined electrical boundary able to disconnect and reconnect to the grid, so critical facilities can be safely energized. They are typically designed to provide energy resilience to important community facilities, such as Hospitals, Police and Fire Stations, Gas Stations and Markets. The local DERs, such as a solar photovoltaic (PV) system and battery, can be owned by third parties and can participate in wholesale markets for energy and related services. PG&E will continue to own and operate the distribution system on which the Microgrid capability is built. PG&E’s Community Microgrid Enablement Program (CMEP) and Microgrid Incentive Program (MIP) offer both financial and technical support. Creating a community MG requires collaboration between your community, a technical engineering firm, and PG&E. The CMEP and MIP can help you take your community’s energy resilience ideas from concept to reality. This presentation will offer a general definition of community MGs, including architecture, electrical design, operational modes, DER’s etc., and offer an example of an implemented solution. Also, it will describe CMEP steps including Consultation, Application, Study & Analysis, Development, Operation. The CMEP and MIP work together to fund all aspects of a community Microgrid. They support the development of clean community Microgrids in disadvantaged and vulnerable communities (DVCs). You can apply for either one individually, or for both programs together. (https://r6.ieee.org/scv-pesias/) and (https://r6.ieee.org/scv-pesias/event/pge-community-microgrids/) Speaker(s): Franz, Shreya Agenda: Agenda: 6:00 Check in, Meet and Greet 6:30 Dinner buffet 7:00 Talk 8:00 Q&A 8:30 Conclude Room: PARKING VALIDATION CODE T6TGJ, Bldg: Delta/Marriott Hotel Santa Clara-Silicon Valley, 2151 Laurelwood Road, Santa Clara, California, United States, 95054

Abstract Tropical butterflies are a bright display of photonic engineering in nature. Their iridescence originates from the interference and diffraction of light within tree-like nanostructures on their scales, inspiring technological innovations in solar cells, displays, fabrics, and other areas. We are inspired by the design principles of these photonic nanostructures to boost performance of gas sensors because existing gas sensors often degrade their performance in complex environments. Thus, new sensing concepts are required to improve sensor selectivity and stability. In this lecture, we analyze capabilities of natural photonic nanostructures as sensors for detection of different gases and the origins of these capabilities. Our acquired knowledge from studies of these natural nanostructures allows us to develop our design rules to fabricate sensing nanostructures for needed gas selectivity for numerous gas monitoring scenarios at room and high temperatures for industrial, environmental, homeland protection, medical, and other applications. Our design rules for selective gas sensors bring a multivariable perspective for sensing, where selectivity is achieved within a single nanostructured sensing unit, rather than from an array of separate sensors. By utilizing individual nanostructured sensors rather than sensor arrays we also improved sensor stability by eliminating independent aging factors in separate sensors in their arrays. Our existing and new machine learning tools further advanced our sensor designs and performance in multi-gas detection. These new multi-gas sensing capabilities provide an affordable technical solution for monitoring of emissions of greenhouse and other gases in urban and industrial environments. Such technical solution is mathematically not feasible using conventional single-output sensor designs. The societal impact of these results is in opening opportunities for more proactive developments of several types of multivariable gas sensors in diverse emerging monitoring applications, ranging from urban pollution and industrial safety to medical diagnostics and homeland protection. Speaker(s): Dr. Radislav A. Potyrailo , Agenda: 6:30 – 7:00 PM Registration & Networking 7:00 – 7:45 PM Invited Talk 7:45 – 8:00 PM Questions & Answers Room: Conference Center (ECC1), Bldg: Building E, 2900 Semiconductor Drive, Texas Instruments, Santa Clara, California, United States, 95051, Virtual: https://events.vtools.ieee.org/m/435029

[] Medical devices that provide a strong clinical benefit are often in high demand, and with that comes effort to simplify, to lower cost - to disrupt. What does a good disruptive technology in medical devices look like and how do they develop? How do you think about the potential to take on a well established product and redefine the minimal viable feature set? Speaker(s): Mike Hess Agenda: Agenda: 6:00 - 6:05 pm EMBS and speaker introduction 6:05 - 6:45 pm Main presentation 6:45 - 7:00 pm Q & A Virtual: https://events.vtools.ieee.org/m/431240

This event is the leadership perspective on the challenges and strategies needed to build the necessary infrastructure for AI to flourish. It is not a smooth road. Sam Altman, CEO of OpenAI, tweeted that for AI to really happen, infrastructure must be there. Infrastructure includes computing and communications technologies, systems to power and cool devices, standards, security, and regulations. While having many technical aspects, it is a major technical management challenge. This presentation examines how and why the World Technology Summit was created as an IEEE event, its topics, speakers, and the management challenges of making AI work. Speaker(s): Michael Condry Room: 225, Bldg: Heafey, Santa Clara University, Santa Clara, California, United States, Virtual: https://events.vtools.ieee.org/m/432907

The past year has seen both peak hype and significant issues for the automated vehicle industry. In this talk we recap general trends and summarize the current situation for autonomous vehicles such as robotaxis, as well as conventional vehicles that have automated steering features. Many of the issues the industry faces are self-inflicted, stemming from a combination of inflated promises, attempts to scale immature technology too aggressively, and an overly narrow view of safety. Overall, the companies deploying the technology have failed to address legitimate concerns of a wide variety of stakeholders. There are several distinct aspects that still need to be addressed including: legislation, regulation, liability, insurance, driver skills, traffic enforcement, emergency services, vulnerable road users, engineering standards, business models, public messaging, investor pressure, cultural change, ethical/equity concerns, and local oversight. We concentrate on how all these pieces need to fit together to create sustainable automated vehicle technology approaches. Registration Link: https://us02web.zoom.us/webinar/register/WN_1EXIonUFRLug8XMbEcLCIQ Virtual: https://events.vtools.ieee.org/m/433716

This event will be ONLINE ONLY via Zoom. All attendees MUST register using the Zoom form (see link). Does lack of confidence hold you back in your tech career? Do you ever wish you had the confidence to go after what you truly want? The good news is that confidence is a skill you can build using science-based strategies. Gain actionable insights and practical tools to develop your emotional intelligence, reduce your negative self-talk, and learn to fail fast. With more confidence, you will make more money, have a better job, speak up at meetings, and advocate for your ideas. Attend this workshop on Zoom to gain clarity on your blind spots, boost your communication skills, and learn new ways to advance in your tech career. Speaker(s): Anna Gradie, Virtual: https://events.vtools.ieee.org/m/433704

Please join us and learn about the IEEE History Center, the staff arm of the IEEE History Committee. Founded in 1980, the History Center preserves, researches, and promotes the history of information and electrical technology. Its programs include the IEEE Archives, IEEE Milestones, Oral History, REACH (Raising Engineering Awareness Through the Conduit of History), the Global Museum, the IEEE Life Members’ Fellowship in Electrical History, the Pugh Young Scholar in Residents as well as lectures, conferences, and publications. Most of the Center’s resources are available online at the (http://ethw.org/). Co-sponsored by: Consultants' Network of Silicon Valley Speaker(s): Mary Ann, Virtual: https://events.vtools.ieee.org/m/432105

[] Abstract: The interconnection of quantum devices via the Quantum Internet – i.e., through a network enabling quantum communications among remote quantum nodes – represents a disruptive technology. The Quantum Internet can provide functionalities with no counterpart in the classical world, such as advanced quantum security services, distributed quantum computing services characterized by exponential increases in computing power, and new forms of communications. These functionalities have the potential of fundamentally changing the world in which we live, in ways we cannot imagine yet. The lecture aims to provide the participants with a wide view of quantum communications and quantum networks, and the unique challenges of transmitting quantum information. For this, some marvels of quantum mechanics such as entanglement, no-cloning theorem, and teleportation, will be gently introduced. Bio: Angela Sara Cacciapuoti is a Professor of Quantum Communications and Networks at the University of Naples Federico II (Italy). Her work has appeared in first-tier IEEE journals and she received different awards, including the “2024 IEEE ComSoc Award for Advances in Communication”, the “2022 IEEE ComSoc Best Tutorial Paper Award”, the “2022 WICE Outstanding Achievement Award” for her contributions in quantum communication and network fields, and “2021 N2Women: Stars in Networking and Communications”. She also received the IEEE ComSoc Distinguished Service Award for EMEA 2023, assigned for outstanding service to IEEE ComSoc in the EMEA Region. Currently, she is an IEEE ComSoc Distinguished Lecturer with lecture topics on Quantum Internet design and Quantum Communications. She serves also as a Member of the TC on SPCOM within the IEEE Signal Processing Society. Moreover, she serves as Area Editor for IEEE Trans. on Communications and as Editor/Associate Editor for the journals: IEEE Trans. on Quantum Engineering, IEEE Network, and IEEE Communications Surveys & Tutorials. She served as Area Editor for IEEE Communications Letters(2019 - 2023), and she was the recipient of the 2017 Exemplary Editor Award of the IEEE Communications Letters. In 2023, she also served as Lead Guest Editor for IEEE JSAC special issue "The Quantum Internet: Principles, Protocols, and Architectures". From 2020 to 2021, Angela Sara was the Vice-Chair of the IEEE ComSoc Women in Communications Engineering. Previously, she has been appointed as Publicity Chair of WICE. From 2017 to 2020, she was the Treasurer of the IEEE Women in Engineering (WIE) Affinity Group of the IEEE Italy Section. Her research interests are in Quantum Information Processing, Quantum Communications, and Quantum Networks. At the time of the event click here to join:https://simnet.zoom.us/j/91561717255?pwd=Zazy5obYErURgjAyrtF88N9gcwaeqa.1 Or on the Zoom App Meeting ID: 915 6171 7255 Passcode: 472317 Co-sponsored by: Pradeep Kumar Virtual: https://events.vtools.ieee.org/m/436047

[]As the demand for high-performance computing continues to surge, driven largely by advances in artificial intelligence and other data-intensive applications, the semiconductor industry faces growing challenges in meeting these requirements. Traditional approaches, constrained by the slowing of Moore’s Law and the end of Dennard Scaling, are proving inadequate in addressing the exponential increase in compute and bandwidth needs. Silicon Photonics is emerging as a key technology to overcome these limitations. By leveraging the unique properties of silicon for optical communication, Silicon Photonics can offer significant improvements in data transmission speeds and energy efficiency compared to conventional electrical interconnects. This technology has the potential to reduce latency and power consumption, making it a compelling solution for next-generation data centers and high-performance computing systems. Advanced Packaging Technologies are equally critical in this evolving landscape. As chips become more complex and power-hungry, innovative packaging solutions such as chiplets and advanced integration methods are essential to manage power consumption and thermal issues while enhancing performance. These technologies enable more efficient use of silicon area, improved thermal management, and higher bandwidth connections between components. In this talk, we will explore how Silicon Photonics and advanced packaging technologies are not just complementary but essential to addressing the challenges of future compute demands. We will discuss the current state of these technologies, their potential to transform the semiconductor industry, and the ongoing efforts to integrate them into scalable, high-performance systems. Speaker(s): , Sandeep Sane Virtual: https://events.vtools.ieee.org/m/433434

Microgrid Reliability Approach and Modeling Abstract Microgrid refers to a localized group of electricity sources and loads that operates connected to the electric grid or grid-independently in island mode. Microgrids are used in powering communities and critical infrastructure such as datacenters to ensure continuous power during grid outage or disruption. It can include various energy sources such as solar panels, wind turbines, generators, fuel cells and batteries. Microgrids enhance the reliability and resilience of power supply, reduce transmission losses and support integration of renewable and clean energy. The reliability of a microgrid is to provide continuous and stable power supply. In this article we will discuss the resilience of microgrids to tolerate various failures, faults. Key aspects will involve looking at individual component reliability, system architecture, redundancy and implementation of control strategies to ensure uninterrupted power supply for critical load. Speaker(s): Debasmita, Room: Laurel Room, Bldg: Senior Center (to the left when entering parking lot), 550 E Remington Drive , Sunnyvale Community Center, Sunnyvale, California, United States, 94087

This talk will familiarize participants with a vision for Grid Modernization, focusing on technological advancements beyond Smart Grid. The technological advancements include discussion of key industry/societal trends, Smart Grid concepts, holistic solutions, integration of microgrids and distributed generation, and Advanced Distribution Management System (ADMS) software applications. The talk will also cover feeder automation business models, managing different types of data, big data, analytics, enterprise data management, Smart Grid standards and interoperability, and Smart Grid deployments and lessons learned. Speaker(s): John D. McDonald, P.E., Agenda: 11:30am - Noon: Middle Eastern Lunch / Network (doors will open 11am) Noon - 1pm: Grid Modernization Technical Presentation Bldg: Courtyard Room, 505 Van Ness Ave, San Francisco, California, United States, 94102, Virtual: https://events.vtools.ieee.org/m/432410

Join us for a technical talk on "Circumventing Bounds and Realizing Novel Performance Characteristics using Time- Varying Antenna Systems" and Learn about active, non-linear, and time-varying antennas, along with the modeling challenges, simulation approaches, and performance gains. [] Speaker(s): Dr. Kurt Schab Room: Rm 4021, 500 El Camnino Real, Sobrato Campus for Discovery and Innovation, Santa Clara, California, United States, 95053

This talk explores the intersection of image processing and computer vision with crucial forensics and privacy challenges, shedding light on innovative methods and inherent vulnerabilities. We begin by examining the potential of consumer-grade cameras for capturing detailed 3D surface structures at a microscopic level, enabling extracting the "fingerprint" information for the high-accuracy, low-cost authentication of important documents and product packaging. Building on the theme of information extraction, we delve into how indoor camera images can inadvertently reveal location information, offering a powerful tool for the potential capture of child exploiters. Finally, we transition to analyze the vulnerabilities within federated learning systems. We demonstrate how training images can be silently extracted by a curious but honest server or from participating clients, raising significant concerns about data privacy for the potential deployment of federated learning systems. Speaker(s): Chau-Wei Wong, Virtual: https://events.vtools.ieee.org/m/437937

Using the FFT-based measurement systems for EMI testing can reduce test time, improve the repeatability of EMI tests. With the availability of high speed high resolution ADCs and large computation power today FFT-based measurement systems exceed the performance of traditional EMI receivers, regarding noise floor, measurement speed and accuracy. Today a real-time analysis bandwidth up to 1000 MHz for Quasi-Peak in full compliance mode is available, reducing the test time from 9 hours down to 1 second. Such a Technology can be used to speed up Full compliance testing. Such a system can be used to measure extremely accurate radiation patterns. Using correlation analysis of such patterns allows identifying radiation direction of individual sources and the effect of EMI measures that have applied. EMC Debugging on a complete system can be carried out based on the identification of sources. Another topic is the EMI measurement in presence of ambient noise. During the presentation a dual channel FFT-based EMI measurement system is presented. While the first antenna receives the signal of the EUT and the ambient noise, the second antenna only receives the ambient noise. By using a wideband LMS filter algorithm it is possible to cancel the ambient noise and show the EMI of the EUT. Measurement results show that typical ambient noise signals can be suppressed and even modulated signals of an EUT that are masked by ambient noise can be recovered. The system can cancel ambient noise with a bandwidth of more than 100 MHz. During the presentation the possibility for full compliance testing and the limitations of such a system are discussed. Speaker(s): Stephan Braun, Agenda: 5:30-6:15: Food/Social 6:15-6:20 Admin, call for nomination for officers 6:20: Start of presentation 1120 Fulton Pl, Fremont, California, United States, 94539

Silver Nanowires for Transparent Electronics [] Abstract: In this presentation we will provide an overview of Activegrid™- a highly flexible and stretchable silver nanowire-based transparent conductor (TC) that rivals—and often exceeds—the optoelectronic performance of traditional brittle sputtered TCs like indium tin oxide (ITO). Activegrid ink can be deposited from solution using various high-speed low-takt-time methods and processed at much lower temperatures (as low as 25C) compared to other TCs. It has already been commercialized in some of the world’s first mass-produced flexible consumer electronic devices, primarily serving as the TC for capacitive touch sensors. Activegrid has also been prototyped, qualified and designed into applications ranging from smart windows, EMI shielding, and photovoltaics, to next-generation displays, and even biomedical devices. An advanced generation of Activegrid is now being commercialized for various automotive applications, especially in transparent heating for LiDAR and camera sensors, offering significant performance and processing advantages. Finally, we will also highlight some very unique properties of highly concentrated silver nanowire based inks and dispersions under development which exhibit remarkable electrical, and rheological properties and may also enable a variety of next generation electronics. Link to relevant article: https://www.dupont.com/news/dupont-showcases-silver-nanowire-technologies-at-sid-vehicle-dis.html [] Bio: Ajay Virkar Vice President - Advanced Circuits and Packaging DuPont Ajay Virkar is Vice President -Advanced Circuits and Packaging at DuPont where he works on business and technology development. Previously, he was a Co-founder, Board member and CTO of C3Nano - an advanced materials company acquired by DuPont in August 2024. At C3Nano, Ajay helped raise several rounds of strategic and venture capital, commercialized new technologies into some of the world’s first flexible consumer electronic devices, led technology and intellectual property development and managed several partners and relationships across the consumer electronics supply chain. He is a co-inventor on over 100 issued patents and has co-authored 13 articles in peer reviewed journals. He also advises startups and the DOE (Made in America Solar Initiative). Ajay completed his BS from the University of Illinois, and his PhD at Stanford University. AGENDA: Wednesday October 23, 2024 11:30 AM: Networking, Pizza & Drinks Noon -- 1 pm: Seminar Please register on Eventbrite before 9:30 AM on Wednesday Wednesday October 23, 2024 Frequently asked questions Add questions and answers for your event + Add question Add more sections to your event page Recommended Make your event stand out even more. These sections help attendees find information and answer their questions -which means more ticket sales and less time answering messages. Agenda See examplesAdd Bldg: ==> Use corner entrance: Kifer Road / San Lucar Court ==> Do not enter at main entrance on Kifer Road, EAG Labs, 810 Kifer Road, Sunnyvale, California, California, United States, 95051

[]Advanced Packaging enables heterogeneous integration of chiplets with die-embedding and die-stacking techniques, and provides maximum device performance with a much faster product development cycle. However, as the 2.5D and 3D packages are getting more and more complicated, it is very challenging to ramp the yield and assure the reliability of new products within this short timeline using conventional methods. Artificial Intelligence (AI)-assisted design co-optimization, manufacturing process simulation and monitoring, yield enhancement, reliability assurance, and failure mode prediction, which were developed for Si fabrication, could be employed to shorten the advanced packaging development cycle. This presentation summarizes the current status for the various applications of simulation and AI in advanced packaging. Further development trends are highlighted with the goal of providing a holistic and robust virtual representation, or digital twin, for advanced packaging. Speaker(s): Yan Li, Virtual: https://events.vtools.ieee.org/m/429467

A major hurdle in developing next-generation systems for high-performance applications and industries that require handling large, secure data - such as System-in-Package (SiP) and System-on-Chip (SoC) - is the absence of low-latency, high-bandwidth, and high-density off-chip/chiplet/core interconnects. Achieving high-bandwidth chip-to-chip (or chiplet-to-chiplet) communication using electrical interconnects faces challenges like high substrate dielectric losses, reflections, impedance discontinuities, and susceptibility to crosstalk. This underscores the motivation to adopt photonics to address these challenges and enable low-latency, high-bandwidth communication. The objective is to develop a CMOS-compatible technology to support the next-generation photonic layer within 3D SiP/SoC, moving towards converged microsystems. Co-sponsored by: Habib Hichiri Speaker(s): Tolga Tekin, Virtual: https://events.vtools.ieee.org/m/433297

The combined Santa Clara Valley, San Francisco, & Oakland/East Bay IEEE PELS is very pleased to invite you to our upcoming in-person event. We are excited and honored to have Prof. Uttam Singisetti of the University at Buffalo to speak on the topic of Potential and challenges in gallium oxide, the next generation power semiconductor technology. Here's more about the talk from the Speaker: The monoclinic -gallium oxide (Ga2O3) (bandgap 4.8 eV) is one of several ultra-widebandgap semiconductors (UWBGs) that have garnered a lot of interest as next generation power semiconductor technology. Since the first demonstration of a MESFET in 2012, Ga2O3 device research has progressed at an incredible pace with reports of MOSFETs and diodes achieving 10 kV breakdown voltages. Gallium oxide devices have also achieved impressive high power device figure of merit, high average field strengths and high-speed performance. The high critical electric field, good electron mobility, multiple shallow donors, availability of large area substrates and growth of high-quality epitaxial films; have all contributed to the rapid progress in device performance. As a result, it has emerged as a promising ultra-widebandgap semiconductor for next generation power, GHz switching and RF applications. In addition to the large Baliga’s Figure of Merit (BFoM); good electron mobility, calculated electron velocities lead to higher Johnston’s Figures of Merit (JFoM). Additionally, the large bandgap also enables high temperature operation and radiation hardness making it attractive for space applications such as Mars and Venus missions. This talk will present the most recent advances in gallium oxide devices; both from our group and others. We will present the lateral MOSFETs with improved field plate design and beyond-kV breakdown. Temperature dependent analysis and device simulation suggest an extrinsic breakdown mechanism outside the channel. A simple and yet effective SU-8 polymer passivation technology provides a significant improvement in breakdown voltages. The higher field strength of the SU-8 polymer enables a significant increase in breakdown voltage to 8.5 kV in lateral MOSFETs. However, these devices show a high Ron, which is due to the depletion caused by RIE of the channel. We will present the use of ultra-high vacuum annealing techniques to improve the on-resistance of the devices still maintaining the multi-kilo-volt rating of the devices. We will also present on-wafer individual device level switching characteristics. I will discuss the progress made on vertical Schottky barrier diodes (SBDs) which have rapidly achieved both high voltages and high-power deice figures of merit. Several groups have incorporated nickel-oxide/gallium oxide hetero-junction p-n diodes to successfully overcome the absence of p-doping in gallium oxide. High surge-current capability and unclamped inductive switching (UIS) have been demonstrated in these devices despite the low thermal conductivity. Finally, I will discuss the approaches that could address the challenges in this semiconductor system (low thermal conductivity and absence of p-doping). I will conclude by discussing the factors that could potentially lead to successful lab-to-fab transition in this exciting next generation power semiconductor technology. Speaker(s): , Dr. Uttam Singisetti Plug and Play Tech Center, 440 N Wolfe Rd, Sunnyvale, California, United States, 94085

Abstract Microchannel particle deposition (MPD) is a wafer-scale thick-film deposition process used to accurately and in a scalable way deposit nanoparticles. Unique features include: 1) full wafers patterning in 15-minutes, 2) structures can be deposited with a size ranging from 1 – 50 microns and with high aspect ratios up to 5 and 3) full 3D-control of the printed structures. In addition, I can share some of the applications we’re focusing on such as: 1) printing sensing electrodes for metal oxide gas sensors, 2) printing of getters and 3) printing of ultra-fine line glass frit bonding rims. Speaker(s): Mr. Thomas Russell , Agenda: 6:30 – 7:00 PM Registration & Networking 7:00 – 7:45 PM Invited Talk 7:45 – 8:00 PM Questions & Answers Northeastern University Welcome Center Space, 75 E Santa Clara Street, San Jose, California, United States, 95113, Virtual: https://events.vtools.ieee.org/m/437916

Abstract: While silicon scaling has reached astonishing levels over the last half century, there has not been a corresponding level of scaling in electronic packaging technology. However, Artificial Intelligence (AI) architectures are now changing the landscape, increasingly moving us towards advanced packaging technology and Heterogeneous Integration (HI). What are these unique requirements of AI which are driving the need for HI? What are some of the unique challenges in semiconductor and packaging technologies that must be overcome to make this successful? This seminar will discuss key HI methods including interposers, fan out wafer level processing, silicon bridges, and 3D integration to see how they can be leveraged to achieve AI architectures. [] Speaker(s): Dr. Mukta Farooq, Virtual: https://events.vtools.ieee.org/m/440607