This event will be available live at SEMI, as well as over Zoom. Get to SEMI by 6:30pm to network – and enjoy great pizza and refreshments! All attendees MUST register using the Eventbrite form (see link). Artificial intelligence (AI) has quickly become one of the hottest areas in the tech world, with its usefulness evident in a broad variety of commercial businesses. From data collection to model training, language processing to predictive models, and deep networks to AI frameworks, there are many categories and implementations of AI. Each area has protectable features and important business applications. Protecting cutting edge AI technology helps companies achieve business goals, support their innovation, and stay competitive and relevant in their markets. Many aspects of AI can be protected with patents, including the creation or manipulation of training data, processes of training a machine learning model, and details of a learning model. In addition, new model features and new ways to process data, as well as how to process a model’s output, can also be protected. Key fields where these techniques are used include machine learning, natural language processing, computer vision, and robotics. In this presentation, Steve Bachmann, Esq. will identify key strategies that can be used to identify which aspects of AI are actually patentable. These strategies will be supplemented with practical real-world examples of patenting different areas of the AI process. He will draw on techniques he has used with his recent clients that have enabled him to help craft patent applications that can be accepted as true inventions by patent examiners in the US Patent Office. Speaker(s): Steve Bachmann, 567 Yosemite Dr, Milpitas, California, United States, 95035, Virtual: https://events.vtools.ieee.org/m/389329

True institutional sustainability means effective technology management, including finding opportunities, gaining executives’ buy-in, and moving forward with our best ideas. It is important to avoid distractions (financial concerns, internal power struggles, finding the “big idea”) so we don’t overlook opportunities around us. We should enact the leadership capable of piloting our organization to success, to ensure that our capabilities are keeping pace with market realities and emerging opportunities. To achieve the goal of business sustainability, we need to tap into the genius of each employee for new product ideas and then provide the leadership that fosters the trust and collaboration needed to bring those ideas to fruition. Learning Objectives: - Discover the three hidden barriers to sustainability that hamper organizations. - Learn four steps for activating employees to identify emergent opportunities. - Take away five principles leaders can implement to support sustainable innovation. Speaker(s): Leslie Martinich, Karen Koepp Virtual: https://events.vtools.ieee.org/m/390915

Free Registration: https://www.eventbrite.com/e/747848493977 Synopsis: The talk will explore Eigen Decomposition, PCA, Kernel PCA, Eigen Faces, t-SNE, UMAP, Manifold Learning, a taxonomy of dimensionality reduction techniques, and discuss how the speaker used them for some of his research experiments. Speaker(s): Dr. Pendyala Virtual: https://events.vtools.ieee.org/m/381132

The Electron Devices Society Santa Clara Valley/San Francisco joint Chapter is hosting Prof. Asif Khan. The title of the lecture is ‘Ferroelectronics for next generation memory and NAND storage technology’ When/Where: 19th Jan, 2024, 12 noon. Hybrid event (Venue: Atherton Room, Plug and Play Tech Center, 440 N Wolfe Rd, Sunnyvale, CA 94085) Note: MUST RSVP to attend in-person Registration: (https://events.vtools.ieee.org/m/398697) If you face an issue with vtools registration send an email to hiuyung.wong at ieee.org to get the zoom link and indicate whether you are an IEEE member, IEEE EDS member, IEEE Student member Contact: hiuyung.wong at ieee.org Speaker: Prof. Asif Khan Abstract: The rise of artificial intelligent (AI)-driven marvels hinges on the unrelenting advances in digital memory and storage solutions. The exponential trajectory of improvements of dynamic random-access memory (DRAM) and NAND flash, which are the mainstays of main memory and storage, respectively, is however facing formidable challenges at the technology level. In this talk, we will discuss the potential of the emerging ferroelectric technologies to upend the DRAM and NAND landscapes . We will highlight how ferroelectrics can enable the transition from 2-D to 3-D in DRAM technology and facilitate vertical scaling in NAND technology to achieve the 1000-layer milestone and beyond. We will also explore how ferroelectric devices can contribute to embedded and storage class memory technologies and examine the challenges they face. Asif Islam Khan, Ali Keshavarzi, and Suman Datta. “The future of ferroelectric field-effect transistor technology.” Nature Electronics 3.10 (2020): 588-597. Dipjyoti Das, Asif Khan et al. “Experimental Demonstration and Modeling of a Ferroelectric Gate Stack with a Tunnel Dielectric Insert for NAND Applications.” Proceedings of the 2023 IEEE International Electron Devices Meeting (IEDM). Nirmal Ramaswamy et al. “NVDRAM: A 32Gb Dual Layer 3D Stacked Non-volatile Ferroelectric Memory with Near-DRAM Performance for Demanding AI Workloads.” Proceedings of the 2023 IEEE International Electron Devices Meeting (IEDM). Speaker Bio: Asif Khan is an Associate Professor in the School of Electrical and Computer Engineering with a courtesy appointment in the School of Materials Science and Engineering at Georgia Institute of Technology. Dr. Khan’s research focuses on ferroelectric materials and devices to address the challenges faced by the semiconductor technology due to the end of transistor miniaturization. His work led to the first experimental proof-of-concept demonstration of the ferroelecric negative capacitance, which can reduce the power dissipation in transistors. His recent interest is understanding and demonstrating the fundamental limits of memory technologies concerning their scalability, density, capacity, performance, and reliability. His group publishes research on topics that include both logic and memory technologies, as well as artificial intelligence and neuromorphic hardware. Dr Khan’s notable awards include the DARPA Young Faculty Award (2021), the NSF CAREER award (2021), the Intel Rising Star award (2020), the Qualcomm Innovation Fellowship (2012), TSMC Outstanding Student Research Award (2011) and University Gold Medal from Bangladesh University of Engineering and Technology (2011). Dr. Khan received the Class of 1934 CIOS Honor Roll award for excellence in teaching a graduate course on Quantum Computing Devices and Hardware in Fall 2020. He is presently serving as an editor at IEEE Electron Device Letters. In the past, he has also worked as an associate editor for IEEE Access, and as a technical program committee member for various conferences including IEEE International Electron Devices Meeting (IEDM) and Design Automation Conference (DAC), among others. ====================================================================== Speaker(s): Prof. Asif Khan Agenda: The Electron Devices Society Santa Clara Valley/San Francisco joint Chapter is hosting Prof. Asif Khan. The title of the lecture is ‘Ferroelectronics for next generation memory and NAND storage technology’ When/Where: 19th Jan, 2024, 12 noon. Hybrid event (Venue: Atherton Room, Plug and Play Tech Center, 440 N Wolfe Rd, Sunnyvale, CA 94085) Note: MUST RSVP to attend in-person Registration: (https://events.vtools.ieee.org/m/398697) If you face an issue with vtools registration send an email to hiuyung.wong at ieee.org to get the zoom link and indicate whether you are an IEEE member, IEEE EDS member, IEEE Student member Contact: hiuyung.wong at ieee.org Speaker: Prof. Asif Khan Abstract: The rise of artificial intelligent (AI)-driven marvels hinges on the unrelenting advances in digital memory and storage solutions. The exponential trajectory of improvements of dynamic random-access memory (DRAM) and NAND flash, which are the mainstays of main memory and storage, respectively, is however facing formidable challenges at the technology level. In this talk, we will discuss the potential of the emerging ferroelectric technologies to upend the DRAM and NAND landscapes . We will highlight how ferroelectrics can enable the transition from 2-D to 3-D in DRAM technology and facilitate vertical scaling in NAND technology to achieve the 1000-layer milestone and beyond. We will also explore how ferroelectric devices can contribute to embedded and storage class memory technologies and examine the challenges they face. Asif Islam Khan, Ali Keshavarzi, and Suman Datta. “The future of ferroelectric field-effect transistor technology.” Nature Electronics 3.10 (2020): 588-597. Dipjyoti Das, Asif Khan et al. “Experimental Demonstration and Modeling of a Ferroelectric Gate Stack with a Tunnel Dielectric Insert for NAND Applications.” Proceedings of the 2023 IEEE International Electron Devices Meeting (IEDM). Nirmal Ramaswamy et al. “NVDRAM: A 32Gb Dual Layer 3D Stacked Non-volatile Ferroelectric Memory with Near-DRAM Performance for Demanding AI Workloads.” Proceedings of the 2023 IEEE International Electron Devices Meeting (IEDM). Speaker Bio: Asif Khan is an Associate Professor in the School of Electrical and Computer Engineering with a courtesy appointment in the School of Materials Science and Engineering at Georgia Institute of Technology. Dr. Khan’s research focuses on ferroelectric materials and devices to address the challenges faced by the semiconductor technology due to the end of transistor miniaturization. His work led to the first experimental proof-of-concept demonstration of the ferroelecric negative capacitance, which can reduce the power dissipation in transistors. His recent interest is understanding and demonstrating the fundamental limits of memory technologies concerning their scalability, density, capacity, performance, and reliability. His group publishes research on topics that include both logic and memory technologies, as well as artificial intelligence and neuromorphic hardware. Dr Khan’s notable awards include the DARPA Young Faculty Award (2021), the NSF CAREER award (2021), the Intel Rising Star award (2020), the Qualcomm Innovation Fellowship (2012), TSMC Outstanding Student Research Award (2011) and University Gold Medal from Bangladesh University of Engineering and Technology (2011). Dr. Khan received the Class of 1934 CIOS Honor Roll award for excellence in teaching a graduate course on Quantum Computing Devices and Hardware in Fall 2020. He is presently serving as an editor at IEEE Electron Device Letters. In the past, he has also worked as an associate editor for IEEE Access, and as a technical program committee member for various conferences including IEEE International Electron Devices Meeting (IEDM) and Design Automation Conference (DAC), among others. ====================================================================== Room: Atherton Room, Bldg: Plug and Play Tech Center, 440 N Wolfe Rd, Sunnyvale, California, United States, Virtual: https://events.vtools.ieee.org/m/398697

This presentation is about the very recent James Webb Space Telescope (JWST). Its major science objectives include: 1) Detect the first stars to ever emit light, 2) Show us how galaxies and stars were formed in the early universe and 3) Study planets orbiting other stars outside our solar system. It was successfully launched in 2021. It reached its orbital parking space at L2, a million miles away, slowly cooled down per plan, and completed all its commissioning tasks. It has been in operation since July 2022. Unlike the Hubble telescope which is taking images in the visible portion of the spectrum, this one takes images in the Near Infra Red (NIR) and the Mid Infra Red (MIR) portions of the spectrum. Infrared light is important to astronomy in three major ways. First, some objects are just better observed in infrared wavelengths. Some bodies of matter that are cool and do not emit much energy or visible brightness. Visible light’s short, tight wavelengths are prone to bouncing off dust particles, making it hard for visible light to escape from a dense nebula or protoplanetary cloud of gas and dust. The longer wavelengths of infrared light slip past dust more easily, and therefore instruments that detect infrared light—like those on Webb—are able to see the objects that emitted that light inside a dusty cloud. Low-energy brown dwarfs and young protostars forming in the midst of a nebula are among the difficult-to-observe cosmic objects that Webb can study. In this way, Webb will reveal a “hidden” universe of star and planet formation that is literally not visible. Finally, infrared light holds clues to many mysteries from the beginning of everything, the first stars and galaxies in the early universe, after the big bang. Through a process called cosmological redshifting, light is stretched as the universe expands, so light from stars that is emitted in shorter ultraviolet and visible wavelengths is stretched to the longer wavelengths of infrared light. Observation of these early days in the universe’s history will shed light on perplexing questions of dark matter and energy, black holes, galaxy evolution over time, what the first stars were like, and how we arrived at the universe we experience today. Our guest speaker is Bruce Steakley, who was the NIRCam Chief Systems Engineer and Program Manager. The NIR Cam has ten mercury-cadmium-telluride (HgCdTe) detector arrays. These are analogous to the silicon sensors found in ordinary digital cameras. The NIRCam is a science instrument but also an Optical Telescope Element wavefront sensor. It must be cooled to near absolute zero (K) temperature in order to eliminate most of the background noise benerated in the detectors. Fortunately that is easy to do in space. Bruce is now retired and he will take us through major observatory and NIRCam driving requirements with a deep dive into building NIRCam. Along the way, the talented teams faced significant challenges, some expected and some not. Good plans, ingenuity, attention to detail, perseverance, bad luck, and good luck all are part of the development story that led to its exceptional success. JWST images and science data are enabling a new era in astronomy. The focus of this talk will be primarily the engineering and development of the sensor sytem and not on the finished images taken from this telescope Meanwhile, work is already underway for another leap in technology and system capability beyond JWST. If you’re interested in an authoritative site on the JWST deployment timeline, its current status, and recent images; check this out: https://webb.nasa.gov/content/webbLaunch/whereIsWebb.html ############################################################################## This event is exclusively for in-person attendance, and walk-ins cannot be accommodated due to limited room capacity. The specific address will be provided to those who have registered up to the morning of the event. We will attempt to make a simultaneous broadcast on zoom but we are not vertain it will work well. We will send the zoom link to everyone who registers. Participation in the event entails a fee of $5 for each adult (18+) who wishes to avail themselves of the dinner provided. Additionally, attendees have the option to bring up to three children (14-17 years old) to the dinner at no extra cost. Registration for the presentation-only segment is free. (Please do not bring children younger than 14). Agenda: Dinner: 6-7pm (registration required, $5 per adult. If you plan to bring children, kindly register them as well but they are free. Presentation: 7:00pm - 8:30pm (registration is required, but if no meal is needed then admission will be free) Co-sponsored by: Life Members Affinity Group of the SCV Section Speaker(s): Bruce Steakley Agenda: Dinner: Jan 19 6:00pm to 7:00pm Presentation: 7:00pm to 8:30pm Sunnyvale, California, United States, Virtual: https://events.vtools.ieee.org/m/389814

Dr. David Kuo; Founder & Executive Vice President of Engineering; Water Harvesting Inc. Water Harvesting (WaHa) is an early-stage company whose metal-organic framework (MOF) based dehumidifiers atmospheric water generators (AWG) efficiently remove humidity without subcooling the air and create pure water. This dramatically increases HVAC efficiency and reduces opex by 25-90% and HVAC capex by up-to 80%. The initial market is CEA but will scale to the overall HVAC market. This would reduce global HVAC electricity demand by 2%, or 1,900,000 GWh ($250B savings) and global GHG emissions by > 1 gigaton annually. Our AWG systems deliver a reliable quantity of pure, safe drinking water for the lowest energy cost, anywhere in the world, any time of year, under any atmospheric conditions. Water Harvesting’s technology creates a sustainable, point-of-use water source: air-derived water using Metal-Organic Frameworks (MOFs). This unique process extracts water from air, even in the driest conditions. Metal Organic Frameworks (MOFs) are a class of materials characterized by very high porosity, that can be tailored to selectively adsorb and capture a wide variety of chemical compounds. Developed at UC Berkeley, our MOF technology is tailored for harvesting water from the atmosphere in relative humidity levels as low as 15%. In contrast to conventional atmospheric water harvesting systems, our MOF-based technology captures only water molecules, and is capable of rapid adsorption/ desorption cycling. This ensures absolute water purity, with a low Dr. David Kuo is responsible for Metal Organic Framework based systems development. Prior to joining Water Harvesting Inc. in August, 2018, David worked as a Sr. Director for advanced product and technology development in Seagate. His team led the highest areal demonstration and developed the highest areal density mobile product in the market. He has years of experience in advanced material, process and equipment development. David holds 110 US and world wide patents. He graduated from UC Berkeley in 1989 with a PhD degree in Mechanical Engineering specialized in thermal science and heat transfer Bldg: Use corner entrance: Kifer Rd. / San Lucar Ct.=> Do use main entrance on Kifer Rd.,, EAG Laboratories, 810 Kifer Road, Sunnyvale, CA, 94086, California, United States, 94086

PG&E’s San Ramon Technology Center is home to Applied Technology Services (ATS), a department of about 129 engineers, specialists, technicians, and support staff dedicated to Innovation through operational technology advancement and technical problem solving. The team supports all functional areas within PG&E with core capabilities of asset condition assessment, engineering causal evaluation, inspection and equipment innovation, grid & electrification innovation, and engineering consulting. During this tour you’ll get to learn more about the ongoing work in these areas with focus on EPSS testing, Vehicle-to-Grid testing, microgrid and remote grid evaluation, and other electric distribution product testing. Wear comfortable walking shoes as you’ll also get to visit four of the SRTC electrical laboratory facilities including the high voltage dome/high current yard, modular generation test facility EV test infrastructure, microgrid and remote grid test beds, and the distribution test yard. (See agenda below.) Speaker(s): Jason Pretzlaf Agenda: 9:00-9:05 SRTC Lobby/training room sign-in 9:05-9:15 Introductions & Safety 9:15-9:45 ATS oveview/testing capabilities 9:45-10:15 Wildfire Mitigation Technology Testing - High Voltage Dome/High Current Yard 10:15-10:45 Electric Vehicles - Modular Generation Test Facility (Inside) 10:45-11:15 Microgrids and Remote Grids - Modular Generation Test Facility (Outside) 11:15-11:45 Distribution Equipment and ADMS Testing - Distribution Test Yard 11:45-12:00 Closeout Discussion San Ramon, California, United States

In recent years, the field of advanced packaging has taken center stage as the semiconductor industry pursues ever more energy efficient, high-performance, and low-cost electronic systems. While the field of advanced packaging is undergoing revolutionary technology advances today, there is little doubt that advanced packaging in the new era of Moore’s Law will offer extreme levels of die integration/bonding and begin to blur the boundary between on- and off-chip connectivity (especially in 3D architectures) due to ever denser physical I/O interfaces/bonds. This talk will address a few technical areas. First, we present a survey of recent advanced packaging technologies. Next, we discuss the emergence of panel-based glass-core packages and their potential impact on AI workloads. Further, we present a deep dive into GT’s glass-core packaging technologies, including large-area glass packages and glass-based stitch-chip technologies for digital and mm-wave electronics. Next, 3D technologies enabled by SiO2-based chiplet wafer-level reconstitution technologies for dense 3DHI technologies and selective-ALD cobalt chiplet bonding are also discussed. Speaker(s): Muhannad Bakir, Virtual: https://events.vtools.ieee.org/m/400217

5:30pm: food and drink 6:15pm: presentation In recent years, there has been a surge in the use of machine learning techniques across diverse domains, including hardware design. With the growing complexity of modern hardware systems, there arises a compelling demand for the development of more efficient and effective design methodologies. Machine learning can play a pivotal role and offer capabilities that were not possible in conventional ways. In this talk, recent progress in machine learning applications in hardware design, with a specific focus on SI/PI, will be introduced. The case studies include: 1) PDN impedance prediction, 2) pre/post-layout decap optimization, and 3) stack-up optimization for SI. Speaker(s): , Chulsoon Hwang 1120 Fulton Pl, Fremont, California, United States, 94539

Abstract: Access to nanoscale piezoelectric transducers in advanced semiconductor processes enables realization of acoustic resonators on CMOS chips. Monolithically integrated acoustic resonators facilitate the creation of on-chip clocks, local oscillators, and filters with improved performance, size, and cost. The discovery of ferroelectricity in fluorite-structured oxides, such as hafnia and zirconia, has augured the emergence of the long-coveted CMOS piezoelectric transducer. Atomic-layer-deposited hafnia-zirconia are already used, in amorphous form, as high-k dielectrics in advanced semiconductor nodes. Once subjected to proper atomic engineering, these fluorites can take polar crystalline forms with large piezoelectric coupling that enables creation of high-performance acoustic resonators. In this talk, I will present an overview on CMOS-based fluorite ferroelectrics and their properties pertained to nanoelectromechanical systems (NEMS) resonator performance merits. I will introduce our efforts on (1) developing hafnia-zirconia piezoelectric transducers for creation of super-high-frequency NEMS resonators with high electromechanical-coupling and quality-factor, and intrinsic switchability, (2) development of three-dimensional acoustic resonator technology based on integrating hafnia-zirconia on semiconductor fins, enabling massive integration of multi-band filter arrays and wideband switch-free multiplexers, and (3) development of ultra-stable oscillators using temperature-compensated hafnia-zirconia resonators. Speaker(s): Prof. Roozbeh Tabrizian, Agenda: 6:30 – 6:50 PM Zoom Registration & Networking 6:50 – 7:00 PM Announcements & Polling 7:00 – 7:45 PM Invited Talk 7:45 – 8:00 PM Questions & Answers Virtual: https://events.vtools.ieee.org/m/400594

This talk will cover major developments within additive manufacturing as applied towards electronics packaging needs generally and especially for heterogeneous integration applications, as well as overview the benefits and growth needs for these manufacturing approaches to have impact within our future electronic devices. Speaker(s): Kris, Virtual: https://events.vtools.ieee.org/m/387328

Wireless communication is fundamental to our digital society, with radio spectrum the key enabling resource. Understanding the critical role of spectrum provides deep insight into how wireless technologies function and how they will evolve. This enlightening talk delves into the ingenious advancements in Wi-Fi and cellular networks to harness spectrum, including increasing efficiency, deploying new bands, aggregating channels, and dynamically sharing spectrum. Despite huge progress, formidable challenges remain in meeting soaring demands for capacity, achieving global harmonization, and ensuring coexistence with existing services. Highlights of this session include: - The tradeoffs between different types of spectrum bands - Spectrum innovations in Wi-Fi and 5G to improve performance and reliability - Forecasts illustrating the insatiable demand for more spectrum - Balancing the scales between Wi-Fi and 5G allocations - Insights from the World Radio Communication Conference (WRC) 23 - Details on the recently announced U.S. National Spectrum Strategy - United States versus the rest of the world in spectrum assignments and associated risks - Lessons learned and the future of Citizens Broadband Radio Service (CBRS) - Pioneering approaches in dynamic spectrum sharing Biography Peter Rysavy, the president of Rysavy Research LLC, has led the consulting firm since 1993, focusing on computer networking, wireless technology, and mobile computing. His firm's wide range of projects include spectrum and capacity analysis, wireless technology evolution reports, network security assessments, strategic consultations, system design, article and report writing, course and webcast development, network performance measurements, and serving as an expert in patent litigation. Over his career, Peter has published 200 articles and reports and worked with over 100 organizations. Additionally, he served as the executive director of the Wireless Technology Association from 2000 to 2016, focusing on evaluating wireless technologies, studying mobile communications architectures, and advocating for wireless data interoperability. Peter holds BSEE and MSEE degrees from Stanford University, graduating in 1979. For more information about his contributions to wireless technology, visit https://www.rysavy.com. - Add Event to Calendar (https://events.vtools.ieee.org/event/399940/ical) (http://www.google.com/calendar/event?action=TEMPLATE&text=Navigating%20the%20Airwaves:%20The%20Critical%20Role%20of%20Spectrum%20%C2%A0in%20Cellular%20Networks%20and%20Wi-Fi&dates=20240202T010000Z/20240202T021500Z&details=Wireless%20communication%20is%20fundamental%20to%20our%20digital%20society,%20with%20radio%20spectrum%20the%20key%20enabling%20resource.%20Understanding%20the%20critical%20role%20of%20spectrum%20provides%20deep%20insight%20into%20how%20wireless%20technologies%20function%20and%20how%20they%20will%20evolve.%20This%20enlightening%20talk%20delves%20into%20the%20ingenious%20advancements%20in%20Wi-Fi%20and%20cellular%20networks%20to%20harness%20spectrum,%20including%20increasing%20efficiency,%20deploying%20new%20bands,%20aggregating%20channels,%20and%20dynamically%20sharing%20spectrum.%20Despite%20huge%20progress,%20formidable%20challenges%20remain%20in%20meeting%20soaring%20demands%20for%20capacity,%20achieving%20global%20harmonization,%20and%20ensuring%20coexistence%20with%20existing%20services.%20Highlights%20of%20this%20session%20include:%0D%0A%0D%0AThe%20tradeoffs%20between%20different%20types%20of%20spectrum%20bands%0D%0ASpectrum%20innovations%20in%20Wi-Fi%20and%205G%20to%20improve%20performance%20and%20reliability%0D%0AForecasts%20illustrating%20the%20insatiable%20demand%20for%20more%20spectrum%0D%0ABalancing%20the%20scales%20between%20Wi-Fi%20and%205G%20allocations%0D%0AInsights%20from%20the%20W%20...&location=Virtual:%20https://events.vtools.ieee.org/m/399940&trp=true) At the time of the event go to https://simnet.zoom.us/j/91579513546?pwd=dWdVVHQ2QkhkV1ZUQUNwd0tURXM3UT09 Co-sponsored by: Pradeep Kumar Virtual: https://events.vtools.ieee.org/m/399940

This is the annual IEEE SFBA Consumer Technology Society (CTSoc) event providing a summary of the latest and unique tech innovations from the 2024 Consumer Electronics Show (CES) in Las Vegas. This event has proven to be very popular as many people working in related industries do not get to attend CES. CES's focus has expanded to beyond consumer electronic devices to many (https://www.ces.tech/exhibits/product-categories.aspx) including smart homes, robotics, medical and healthcare devices, etc. IEEE President, Tom Coughlin and Region 6 Director-Elect, Joseph Wei, both are past-chairs of SFBA CTSoc will share highlights of the unique tech solutions at CES that may not have been covered by the media. This will be an in-person event, and the room has limited capacity. Register early, do not miss this event. Speakers: Tom Coughlin - President, Coughlin Associates Joseph Wei - Managing Director, Technology Ventures Group, LLC Speaker(s): Tom Coughlin, Joseph Wei Agenda: 5:30 – 6:00 pm: Check-in, networking, food and drinks 6:00 - 6:10 pm SFBA CTSoc introduction 6:10 - 7:30 pm Presentations by Tom Coughlin and Joseph Wei 7:30 - 8:00 pm Q&A and Networking Bldg: Texas Instruments Silicon Valley Auditorium, 2900 Semiconductor Dr. , Santa Clara, California, United States, 95051