Heterogeneous Integration poses several significant challenges for thermal management at multiple length scales ranging from heat extraction from hot spots, heat transfer through multiple layers of materials, different target temperatures for specific devices/materials, to heat rejection to a system cooling solution or the ambient. This applies to system-in-packages, including 2D, 2.5D, and 3D subsystems and the special needs of photonic devices. We need to consider the various thermal paths within packages to dissipate the generated heat, how to apply modeling and simulation, and advanced cooling methods including conduction, liquid cooling, heat pipes, and more exotic designs. It is important to identify and develop a detailed understanding of the capabilities and limitations of key thermal technologies that meet or exceed these demands so that they are available well in advance of need and can be implemented if they meet integration cost envelopes. We will consider three areas for thermal management: Die level; Package integration/System-in-Package (SIP)/module level; and System level. We will focus on emerging challenges and opportunities for thermal modeling of advanced 3D IC systems; challenges and characterization of hotspot modeling; thermal modeling for High Bandwidth Memory (HBM) and integrated voltage regulators; and innovative methods for manufacturing silicon microchannels. Then, we will consider an advanced design example. Sustainable and efficient operation of US data centers, currently consuming ~100 billion kWh/year, requires transformative and innovative technologies. Nearly 20% of the total power is used to run the data center refrigeration cooling infrastructure, which is extremely sensitive to climate and environmental conditions. The ever-increasing prevalence of higher-power processors aggravates cooling/energy challenges. It is expected that reducing the thermal resistance of the device junction to coolant by 10×, will pave the way for elimination of refrigeration cooling systems, resulting in considerable energy saving in the data centers. In the case of two-phase flow, flow instability and large superheat are major concerns that must be addressed: pressure drop, hotspot cooling, larger chip areas, and liquid films on heat walls. The enhanced cooling IceCool Fundamentals initiative by DARPA, and several ARPA-e recent initiatives, resulted in development of a series of remarkable thermal management solutions for very challenging performance metrics targets. Speaker(s): Tiwei Wei, Mehdi Asheghi, Virtual: https://events.vtools.ieee.org/m/375984

What do Greek myths, ancient Egyptian gods, and the weight of feathers have to do with high tech moral dilemmas, and robots? And how can thinking too narrowly about harmful technologies lead to the very harms we mean to avoid? Join us for a brief talk on the topic of killer robots and good places, and why such ideas should matter for those who care about technology’s impact on society. This will be a talk on the ethics of potentially harmful technologies, using autonomous weapons (for their inherent design to inflict damage or harm) as an example. While the talk will briefly discuss a range of ethical perspectives on war and weapons, the focus is how to wrestle with the broader questions raised by potentially harmful technologies, and the roles of both engineers, and broader society, in limiting the realization of those technological harms. Agenda: Light refreshments will be provided for in-person attendees at 5:30pm Presentation will start at 6:30pm Room: 4021, Bldg: SCDI, 500 El Camino Real, Santa Clara, California, United States, 95053, Virtual: https://events.vtools.ieee.org/m/377070

Free Registration: https://www.eventbrite.com/e/chapter-open-house-award-ceremony-and-talk-ai-and-conversational-commerce-tickets-694491210907 This is the next in our popular AMA series. The earlier AMA sessions are available on IEEE.tv. Speaker(s): Raghavendra Chuduri, Dr. Vishnu S. Pendyala Virtual: https://events.vtools.ieee.org/m/371825

The journey to bringing a medical device to market starts and ends with managing risk, with a healthy dose in the middle as well. From early development days assessing technical execution risks to planning mitigations for what may happen during clinical use, foreseeable mis-use, future label expansions and the full product lifecycle, a successful device program will take all these into account to bring a product that's safe and effective to market. This talk will cover the approach to of risk identification, analysis, mitigation and monitoring required of engineers and other technical staff for medical device design with examples of success and failure. Speaker(s): Mike Hess Agenda: Agenda 6:00 - 6:10pm EMBS-SCV and co-hosts introduction 6:10 - 6:45pm Speaker presentation 6:45 - 7:00pm Q & A Virtual: https://events.vtools.ieee.org/m/377033

Automotive Safety Standards AI Considerations Co-sponsored by: IEEE Power and Energy Society Speaker(s): Jyotika Athavale, Agenda: 12:00 pm PST IEEE Announcements 12:02 pm PST Introduction of Speaker 12:04 pm PST Presentation 12:45 pm PST Q&A Virtual: https://events.vtools.ieee.org/m/381827

(https://mailchi.mp/ed15f2c1c300/b2kgfq4486?e=c16a8358af) [] The SVEC Wants to Welcome you to our Annual Open House Social Event! Keynote Presentation Adapting Legacy IC Fab Technologies, Equipment and Processes to New Challenges for Emerging Markets Such as AR/VR Please pass this invitation along to others you think may be interested. Join us for a light refreshments and an evening of exciting information and engineering camaraderie. Colleagues and friends are invited to enjoy the festivities. Registration: (https://svecopenhouse2023.eventbrite.com/) (General admission $15, Complementary for members of AIChE, ASME, ACM, EAASV, IEEE, SAE, SAMPE, SPE, SWE and students) Date and Time Monday, November 13, 2023 - 5:00PM - 8:30PM Location SEMI Headquarters, 673 S. Milpitas Blvd, Milpitas Agenda * Open House Reception & Mixer: 5:00PM – 6:30PM * Welcoming Remarks, Announcements 6:30PM - 7:00PM * Keynote Speaker: Dr. Bernard Kress 7:00PM - 8:00PM * Acknowledgement of Sponsors * SVEC Discover “E” Outreach * Call for Applications for 2024 Scholarships and Keeper of the Flame Award * Invite to SVEC Engineers Week Banquet, Tuesday February 20, 2024 Keynote Consumer mass adoption of AR headsets is conditioned by solving all three immersive displays comfort pillars: wearable, visual and social. To do so, new micro- and nano-fabrication challenges need to be addressed, specifically more efficient waveguide combiners and smaller display engines and sensor fusion systems. Novel nanofabrication techniques are needed to improve the performance of flat optical display systems while allowing for mass production at consumer cost levels. Such novel nano-fabrication technologies push the envelope beyond what is possible today with traditional nano-imprint lithography. Speaker Biography Bernard has been involved in Optics and Photonics for the past 25 years as an author, instructor, associate professor, engineer, and hardware development manager in academia, start-ups and multinational corporations, with a focus on micro-optics, diffractive and holographic optics. He successively worked on product developments in the fields of optical computing, optical telecom, optical data storage, optical anti-counterfeiting, industrial optical sensors and more recently in immersive displays for augmented and mixed reality systems. Bernard published several books, holds close to 100 patents, and wrote a few hundred papers on these topics. He is the 2023 President of the International Society for Optics and Photonics (SPIE). He also set up and chairs various SPIE conferences including the SPIE AR/VR/MR co-located with Photonics West and the SPIE Digital Optical Technologies co-located with Laser Munich. He is also a short course instructor on micro-optics and ARVR displays and hosts the monthly online SPIE AR|VR|MR fireside chats. Bernard held engineering management positions at Google Labs since 2010 (Google Glass) and Microsoft since 2015 (HoloLens). He is since 2021 the Director for XR engineering at Google in Mountain View, CA. Speaker(s): , Dr. Bernard Kress Agenda: Agenda * Open House Reception & Mixer: 5:00PM – 6:30PM * Welcoming Remarks, Announcements 6:30PM - 7:00PM * Keynote Speaker: Dr. Bernard Kress 7:00PM - 8:00PM * Acknowledgement of Sponsors * SVEC Discover “E” Outreach * Call for Applications for 2024 Scholarships and Keeper of the Flame Award * Invite to SVEC Engineers Week Banquet, Tuesday February 20, 2024 Bldg: SEMI Headquarters, 673 South Milpitas Blvd, Milpitas , California, United States, 95035

This event will be available live at SEMI, as well as over Zoom. Get to SEMI by 6:30pm to network – and enjoy great pizza and refreshments! All attendees MUST register using the Eventbrite form (see link). For people with motor impairments, assistive robotic manipulators can help them perform daily activities such as pick-and-place tasks, opening doors, pushing buttons, eating, and even personal hygiene. As such, these robotic devices have the potential to allow such individuals to regain some independence in performing these tasks. However, human interaction with these manipulators can often be very challenging. In this talk, Maria Kyrarini will describe a robot learning framework that empowers a robotic device to automatically generate a sequence of actions from unstructured spoken language, along with the preliminary results form her recent study with 30 participants to evaluate this framework. She will also present the preliminary results from her recent grant from the National Science Foundation (NSF) on developing a personalized assistive robotic system that assesses cognitive fatigue in persons with paralysis. Speaker(s): Maria Kyrarini, 567 Yosemite Dr, Milpitas, California, United States, 95035, Virtual: https://events.vtools.ieee.org/m/374818

The European space standards on PCB design, qualification and procurement include design margin to mitigate risks of latent short-circuit and open-circuit failures, as well as novel test and inspection methods for qualification and for lot conformance, such as temperature humidity bias test, conductive anodic filament test, interconnect stress test and dark-field microscopy. To investigate the reliability of the advanced manufacturing methods, various traditional and accelerated thermal stress tests are performed on two and three layers of staggered and stacked microvia configurations, as well as the thermo-mechanical modelling of stress factors. A European IPC working group on microvia reliability is using four available accelerated coupons test methods for a robust screening of three stacked microvias, which intends to secure a European high-reliability supply chain. The presentation will provide an overview of ESA’s efforts to reinforce the European PCB supply chain, to develop high density interconnect technology and to qualify PCBs for high reliability applications. Speaker(s): Stan Heltzel Virtual: https://events.vtools.ieee.org/m/379700

Learn an RF perspective on the growth of the implantable bioelectronic devices, the technology enablers, trends and challenges. Speaker(s): Jay Virtual: https://events.vtools.ieee.org/m/380022

Nonfungible tokens (NFTs) have recently drawn considerable attention. The foundations of NFT technology date back to advances in computer science in the late 1970s. In this talk, we examine the emergence of NFTs, from their technical origins, the introduction of blockchain technologies and the first token-based collectibles that led to modern day NFT products. We categorize the current use cases for NFTs, introduce their potential future applications, and highlight the challenges managers face in incorporating them into their existing workflows. By presenting our NFT adoption framework, we offer managers strategies for evaluating the risks and benefits of NFTs. Speaker(s): Andrew Park, Hacker Dojo, 855 Maude Ave, Mountain View, California, United States, 94043, Virtual: https://events.vtools.ieee.org/m/375585

Panelists: Lakshmanan Sethu, Google, Chinmay Nerurkar, Microsoft, and Ruchi Agarwal, Netflix Moderator: Vishnu S. Pendyala, SJSU Speaker(s): Dr. Vishnu S. Pendyala, Lakshmanan Virtual: https://events.vtools.ieee.org/m/385006

PSES SCV/SF/OEB Joint Chapter Presents: "Regulatory Changes for AI/ML Devices and Cybersecurity" (Co-hosted by the EMBS SCV Chapter) November 29, 2023 06:00 PM Pacific Time (US and Canada) Are you worried about AI taking over the world - or maybe just your medical procedure? Find out how new regulatory guidance provides safeguards and affects building medical device software. * Details at our Chapter website: https://r6.ieee.org/scv-pses/ Register for the online meeting at: https://us02web.zoom.us/meeting/register/tZAud-yurTovH9Z5HWBf6d52UN0T20e1i7gm or come to the in-person meeting at: Plug and Play Tech Center, 440 N Wolfe Road, Sunnyvale, CA Speaker(s): Dr. Groves, Dr. Sharma Bldg: Plug and Play Tech Center, 440 N Wolfe Road, Sunnyvale, California, United States, Virtual: https://events.vtools.ieee.org/m/381461

Abstract Accelerating the development of a new semiconductor ecosystem requires the establishment of a new manufacturing paradigm. In an ever-more interconnected world, powered by IoT chips, new application-specific technologies are rapidly growing. A new agile manufacturing paradigm is needed to fabricate these devices with their unique requirements. InchFab has developed a modular fabrication platform which accelerates the development of new devices which will enable a new era of microfabrication innovation. Speaker(s): Dr. Mitchell Hsing, Agenda: 6:30 – 7:00 PM Registration & Networking 7:00 – 7:45 PM Invited Talk 7:45 – 8:00 PM Questions & Answers Room: Conference Center (ECC1), Bldg: Building E, 1st Floor, 2900 Semiconductor Drive, Santa Clara, California, United States, 95051, Virtual: https://events.vtools.ieee.org/m/382970

Engineers traditionally use deterministic modeling in their tasks, but challenges for developing and optimizing products and processes inspire us to venture beyond deterministic to probabilistic or stochastic modeling. The melding of engineering modeling with probabilistic thinking empowers engineers to develop confidence for ourselves, our customers and regulatory agencies that our products are likely to be successful and that we will flawlessly meet or exceed expectations over a comprehensive range of use conditions. Predictive engineering starts from measurable system level requirements, exploration and documentation of use conditions, and expanding on deterministic models with probabilistic modeling using Monte Carlo Simulation or Bayesian Networks to optimize the design and process. Probabilistic and stochastic modeling has provided competitive advantages for enterprises, for products, and for both experienced engineers and engineers early in their careers. Event is organized by IEEE Hawaii YP, IAS, and WIE and co-hosted with several other organizations. Depending on the level of interest in this event, a follow on series with Six Sigma certification is possible. Speaker(s): Eric Maass, PhD Virtual: https://events.vtools.ieee.org/m/382000