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Don't miss this upcoming talk by IEEE Computer Society Distinguished Visitor Dr. Elisa Barney Smith, Professor, Wallenberg AI, Autonomous Systems and Software Program at Luleå Technical University in Sweden, and Emerita Professor, Boise State University. We are excited to have her visiting us in Boise. This will be a hybrid online/in-person event. If you're in the Boise area, come network with us and see her presentation in person at Boise State University. We'll have light snacks and beverages available. We will be streaming her talk live for those who can't attend in person. This talk is free and open to the public. Speaker(s): Elisa Barney Smith, Boise, Idaho, United States, Virtual: https://events.vtools.ieee.org/m/368163 |
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Abstract Significant enhancements in inertial sensor performance can be obtained by combining high volume compatible mechanical structures from the micro-electro-mechanical systems (MEMS) industry with silicon photonic microresonators. Although noise floors 100-1,000x lower than typical consumer grade MEMS accelerometer and gyroscopes can be achieved, new challenges arise with integration of light sources including requirements on driving and controlling photonic elements. In this talk I will give an overview of Zero Point Motion’s approach to combining photonic integrated circuit (PIC) microresonators with MEMS. I outline how chipscale devices like LIDAR and optical transceivers approach the integration challenge, new developments in ASIC design to aid control, and how Zero Point Motion is adapting these methods for the inertial sensing market. Speaker(s): Dr. Ying Lia Li, Agenda: 11:45am – Noon: Check-In & Announcements Noon – 12:45pm: Invited Talk 12:45pm – 1pm: Questions & Answers Virtual: https://events.vtools.ieee.org/m/369097
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The story of how Wi-Fi came to be one of our most significant technologies is surprisingly dramatic. Coming out of the fierce techno/political battles at its birth, Wi-Fi exploded into tens of billions of devices around the globe, where today it supports over half of all internet traffic. This presentation will cover the backstory behind the Wi-Fi phenomenon and will look at what the future might bring. Co-sponsored by: Santa Clara University's IoT Research Lab (SIOTLAB) Speaker(s): Greg Ennis Room: SCDI 1301, Bldg: SCDI, Santa Clara University, 500 El Camino Real , Santa Clara, California, United States, 95053 |
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In advanced packaging, as newer forms of interconnects emerge to meet the demand for high density and high performance, interconnect reliability is becoming more complex and more critical. Finer pitch interconnects in advanced packaging are more susceptible to failures due to electromigration, interfacial reactions etc. Wafer level packaging, Cu direct bonding and other advanced packaging technologies, present new considerations in interconnect reliability. At the same time, the growing adoption of heterogeneous integration leads to increased diversity of interconnects (with different geometries, materials, and interfaces) in the same package, with complex (and often interactive) reliability failure modes and mechanisms. As electronic products become more pervasive in application, interconnect reliability must be considered holistically with regard to environmental conditions, from thermal, mechanical, and thermomechanical, to electrical and electrochemical. High frequency applications demand considerations of interconnect materials for signal integrity. High thermal density and high current density can have increased impact on interconnect reliability. These considerations will impact reliability engineering for semiconductor devices, from design for reliability, to accelerated testing and analysis. Meanwhile, sustainability of electronic products demands environmentally friendly materials and processes. Understanding of the failure mechanisms for different interconnect materials at various levels (wafer, chip, package, and system) of the semiconductor package is of great importance to interconnect reliability in advanced packaging and heterogeneous integration. Speaker(s): Dongkai Shangguan, , Birck Nanotechnology Center #1001, 1205 W State St, West Lafayette, Indiana, United States, Virtual: https://events.vtools.ieee.org/m/370292
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This is a weekly session of the CIT Summer Series, with Jon Peddle presenting The History of Visual Magic in Computers: How Beautiful Images are Made in CAD, 3D, VR and AR : If you have ever looked at a fantastic adventure or science fiction movie, or an amazingly complex and rich computer game, or a TV commercial where cars or gas pumps or biscuits behaved liked people and wondered, “How do they do that?”, then you’ve experienced the magic of 3D worlds generated by a computer. 3D in computers began as a way to represent automotive designs and illustrate the construction of molecules. 3D graphics use evolved to visualizations of simulated data and artistic representations of imaginary worlds. In order to overcome the processing limitations of the computer, graphics had to exploit the characteristics of the eye and brain, and develop visual tricks to simulate realism. The goal is to create graphics images that will overcome the visual cues that cause disbelief and tell the viewer this is not real. Thousands of people over thousands of years have developed the building blocks and made the discoveries in mathematics and science to make such 3D magic possible, and The History of Visual Magic in Computers is dedicated to all of them and tells a little of their story. It traces the earliest understanding of 3D and then foundational mathematics to explain and construct 3D; from mechanical computers up to today’s tablets. Several of the amazing computer graphics algorithms and tricks came of periods where eruptions of new ideas and techniques seem to occur all at once. Applications emerged as the fundamentals of how to draw lines and create realistic images were better understood, leading to hardware 3D controllers that drive the display all the way to stereovision and virtual reality. Maps the history of the techniques behind science fiction movies, complex and rich computer games, and TV commercials capable of making cars, gas pumps and biscuits behave like human beings. Speaker(s): Dr. Jon Peddie, Virtual: https://events.vtools.ieee.org/m/364008 |
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Free Registration: https://www.eventbrite.com/e/ai-and-conversational-commerce-tickets-694491210907 Synopsis: In today's fast-paced digital landscape, conversational commerce has emerged as a game-changer, and AI is at the heart of this transformative shift. Through AI-powered chatbots and virtual assistants, businesses are revolutionizing the messaging space, enabling customers to engage in seamless conversations while making purchases and completing transactions right within their favourite messaging apps. This fusion of AI and conversational commerce empowers businesses to offer personalized product recommendations, answer inquiries in real time, and facilitate effortless transactions—all within the familiar messaging interface. Join us as we delve into the world of AI-driven conversational commerce and discover how it is reshaping customer interactions, boosting engagement, and revolutionizing the future of e-commerce. Speaker(s): Raghu Suram Agenda: Technical Talk State of the Chapter Presentation Award Ceremony Bldg: H.Q., SEMI, 673 South Milpitas Boulevard, Milpitas, California, United States, 95035 |
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- Bring your robot demo and your deck! - We'll have an open mic for robotics demos or introductions. - Are you hiring? Let everyone know! Big thanks to our hosts at Circuit Launch and mechlabs Image by Stable Diffusion on OpenArt Prompt = steampunk robots dancing by otto dix, 4 k Bldg: Circuit Launch (upstairs), 8000 Edgewater Dr, Oakland, California, United States, 94621 |
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Where people work together, conflict is a common thing. Our experience shows us that if we do not do anything, the conflict will not go away and will even become progressively more severe and may end up with significant problems. All the management methodologies teach us that conflict must be handled proactively until it’s resolved. While people usually tend to regard conflict as a negative thing, the agile world considers it as an opportunity for learning and improvement. When people disagree, we can learn a great deal from the conflicting opinions. Agile encourages to take advantage of this hidden value, while resolving the conflict. In this talk, we will discuss the 5-level conflict management model. We will identify the various levels of severity for conflict and learn how to handle each one of them with two major goals: Extract the most benefit and resolve it. We will wrap up with a short fun exercise. Speaker(s): Moshe Gotesman, Virtual: https://events.vtools.ieee.org/m/371050 |
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This event will be available live at SEMI, as well as over Zoom. Get to SEMI by 6:30pm to network – and enjoy great pizza and refreshments! With the advent of HDTV in 1998, an all-digital TV interface became a necessity. This led to upstart Silicon Image partnering with six Consumer Electronics behemoths, and the introduction of HDMI (High-Definition Multimedia Interface) in 2002. It is now ubiquitous, with over 10 billion HDMI-capable devices sold worldwide. Like USB, it has simplified users’ lives, and is one of the most successful electronics standards in the history of Consumer Electronics and computers. You are quite possibly only inches away from both an HDMI and a USB connector as you read these words. In this talk, Jano Banks will tell the story of how a small company that had first made its mark with a high-speed Serial Link for laptops created an interface that the likes of Sony, Panasonic, Hitachi, Toshiba, Thomson, and Philips would trust to be foundational for the future of television – and it wasn’t without some Hollywood drama. Speaker(s): Jano Banks, 567 Yosemite Dr, Milpitas, California, United States, 95035, Virtual: https://events.vtools.ieee.org/m/368734 |
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FarmBot is a US start-up agricultural robotics manufacturer using 100% open-source hardware, software, and data platform to design a Cartesian robot for small to medium-scale automated precision food production for gardening. Marc from FarmBot will be presenting the FarmBot Genesis system and show the latest technology from FarmBot. Speaker(s): , Marc Roland Virtual: https://events.vtools.ieee.org/m/368285
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This presentation will survey the life and work of Gordon E. Moore, cofounder of Fairchild Semiconductor and Intel, and the author of a fundamental analysis of the dynamics of semiconductor manufacturing technology that has come to be known as “Moore’s Law.” In particular, the presentation will examine two contrasting themes that ran throughout Moore’s experience: tradition and revolution. The presentation will cover Moore’s family background and formation as shaped by the long history of Anglo settlement on the San Francisco Peninsula, and review his participation in and analysis of the astonishing technological revolution of the silicon integrated circuit. Speaker(s): David C. Brock, Agenda: Lecture plus a question and answer session Virtual: https://events.vtools.ieee.org/m/365734 |
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enterprise and cloud deployment. With an estimated 80% of the worlds stored data now being classified as cold or archival, secondary storage represents by far the single largest storage category. The secondary storage market is currently shared by magnetic HDDs and tape, but the current rate of the HDD and tape roadmaps has slowed. As the zettabyte era accelerates, the issues of data center energy consumption and carbon emissions have become critical. Moore will discuss the numerous improvements in tape technology that make it the optimal secondary storage choice for the foreseeable future – but can tape ever achieve that level of success? Speaker(s): Fred Moore, Bldg: Quadrant, 1120 Ringwood Ct., San Jose, California, United States, 9531, Virtual: https://events.vtools.ieee.org/m/371927 |
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Electronics, power electronics, and electric machines are becoming important for an array of mobility/transportation, renewable energy and energy efficiency applications. In this presentation, I will provide an introduction to NREL and my group’s research activities. Then, I will describe some challenges and opportunities for power electronics, electric machines and electric traction drive systems for mobility applications in particular. The first area covered in detail will be power electronics thermal management with water-ethylene glycol and dielectric fluids in the single-phase liquid regime and dielectric fluids/refrigerants in the two-phase/boiling regime. The second area will be power electronics materials and bonded interfaces including efforts on sintered silver, sintered copper, polyamide- and polyimide-based bonded interface materials, and polyimide-based electrically insulating materials. Some advanced power electronics packaging concepts will also be introduced. I will then cover our group’s efforts related to electric motor thermal management with focus on motor materials and interfaces thermal modeling and characterization, fluid-based cooling technologies development and characterization, and thermal-fluids modeling to help design and develop advanced reduced-rare-earth electric motors. Finally, I will present our efforts related to integrated electric drive system approaches and thermal management in support of these integration approaches. Speaker(s): Sreekant Narumanchi, SEMI World Hdqtrs, 673 South Milpitas Blvd, Milpitas, California, United States, 95035, Virtual: https://events.vtools.ieee.org/m/363151
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Abstract: Signal Integrity is critical to the design of high-performing and reliable semiconductor products. As the data rates increase rapidly in high-speed systems, the signal integrity has become a key factor to meet the bandwidth growth intensified by various applications. In this presentation, we will start with the review of the basics of signal integrity and examine the key electrical characteristics of interconnects: signal loss, signal crosstalk, return loss, mode conversion and other important factors necessary to meet the performance requirements of the latest electronic systems. Then, the interactions between the signaling, clocking, equalization and modulation of the various interfaces will be discussed to explain how those interactions determine the achievable data rates. Finally, the presentation will be concluded by reviewing various signal integrity modeling and simulation techniques. Biography: Dr. Wendem T. Beyene was born in Addis Ababa, Ethiopia. He received the B.S. and M.S. degrees in electrical engineering from Columbia University, New York, NY, USA, in 1988 and 1991, respectively, and the Ph.D. degree in electrical and computer engineering from the University of Illinois at Urbana-Champaign, USA, in 1997. In the past, he was employed by IBM, Hewlett-Packard, and Agilent Technologies. In 2000, he joined Rambus Inc., Los Altos, CA, USA, and was responsible for signal integrity of multi-gigabit parallel and serial interfaces. During 2017-2020 he worked at Intel and was responsible for signal and power integrity analysis of high-performance FPGA including fabric and high-speed I/O subsystems as well as I/O modeling. In 2020 he joined Facebook (Meta Platforms) as an Analog & Mixed-Signal Architect in Meta Reality Lab. Dr. Beyene has authored numerous refereed IEEE publications in various disciplines including package and interconnect modeling, interface design and analysis as well as application of machine learning and optimization techniques to signal and power integrity of complex systems. He is currently a Senior Area Editor - Electrical Performance of Integrated Systems of IEEE Trans. On CPMT and is a Senior Member of IEEE. He also has served as distinguished lecturer for IEEE EMCS (Electromagnetic Compatibility Society) and IEEE EPS (Electrical Packaging Society). Co-sponsored by: CH06184 Speaker(s): , Wendem Beyene Bldg: 1st Floor, Cupertino Public Library, Cupertino, California, United States, 95014 |
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Dr. Michael Fritze will give his independent perspectives on what the CHIPS ((Creating Helpful Incentives to Produce Semiconductors) Program means for the US particularly for the microelectronics community. He will cover the motivations behind this historic semiconductor investment and articulate the planned support level for each particular area. This includes the Department of Commerce Incentives and R&D efforts and the Department of Defense Microelectronics Commons. Particular attention will be paid to the R&D parts of this legislation. He will review the goals of this legislation in strengthening the US domestic microelectronics supply chain and R&D infrastructure. Dr. Fritze will also discuss some of the key challenges of this major USG investment. Speaker(s): Dr. Michael Fritze, Room: Meeting Room, Bldg: Patrick Henry Library, 101 Maple Ave E, Vienna, Virginia, United States, Virtual: https://events.vtools.ieee.org/m/371348 |
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Rugged Packaging Solutions for Radar Sensors in Diverse Applications and Environments Advances in mmWave technology have ushered in an era of high-resolution radar systems that are compact enough to be incorporated into our everyday lives. With the proliferation of 77GHz automotive radar and the recent extension of the unlicensed 60GHz band by the FCC, radars are poised to become a key technology in our increasingly connected and autonomous world. These sensors will permeate many industries, including automotive and autonomous vehicles to agriculture, mining, heavy machinery automation, building surveillance, indoor infrastructure management, and people tracking. Consumer devices such as smart devices, home security systems, and AR/VR applications will also see significant radar adoption. The high frequency of operation (57-81GHz) and diverse usage from rugged, safety-critical industrial environments to compact consumer electronics for low power applications brings unique challenges in radar development and packaging. The EM wave interaction between the antenna and its packaging, alongside managing thermal and size constraints, are among the many issues we have in mmWave radar packaging. This talk will first provide a brief introduction to the usage, operational theory, and components of modern mmWave radar. Then, we will dive into the considerations, challenges, and solutions surrounding radar development and packaging in modern high-performance applications. Speaker(s): Mo, David SEMI World Hdqtrs, 673 S Milpitas Blvd, Milpitas, California, United States, 95035, Virtual: https://events.vtools.ieee.org/m/364441
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Please plan to attend this meeting of the Industry Applications Society. The Speaker will be Pavi Gopinath, Application Protection Engineer at Schweitzer Engineering Laboratory. Increasing distributed energy resource (DER) interconnection on the distribution electric power system (EPS) requires more industry knowledge of how to properly protect these applications and meet requirements laid out in industry standards. In this session, participants will learn how to apply protection at the point of common coupling. Agenda: - Demonstrate need for anti-islanding at POI. - Propose protection scheme for system protection at POI. - Provide settings guidelines for advanced anti-islanding detection elements. - Examine successful scheme operation. Speaker(s): Pavi Gopinath, Application Protection Engineer at Schweitzer Engineering Laboratory, Agenda: Time: No-host social at 5:30 pm; Presentation at 6:15pm; Dinner at 7:15 pm.Presentation continues at 8:00 pm; Adjourn by 9:00 pm. Place: Zio Fraedo’s, 611 Gregory Lane, Pleasant Hill. Call 925-933-9091 if you need directions. RSVP: Please make reservations by September 20 by contacting Luis Soria via email: [email protected] or telephone: (415) 793-7909 611 Gregory Lane, Pleasant Hill, California, United States
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Abstract: Antennas are crucial components of a wireless communication system. Increasing operational frequency results in the miniaturization of the antenna size. Millimeter-wave (mmWave) and terahertz (THz) antennas can thereby be designed on-chip or in a semiconductor package. This talk outlines the key design considerations of mmWave and THz antennas. Trends in antenna integration and comparison of antenna design in applications including 5G, 6G, and radar, will be presented. The talk will conclude with design techniques for improved antenna radiation performance and overall system efficiency. Biography: Harshpreet Bakshi received the B.Tech. degree in electronics and telecommunication engineering from Bharati Vidyapeeth University, India, in 2015 followed by the M.S. and Ph.D. degrees in electrical engineering from The University of Texas at Dallas in 2018 and 2022, respectively. Between 2015 and 2022, he worked at Idea Cellular Ltd., CommScope Inc., Apple Inc., and at the Texas Analog Center of Excellence. He is presently with the Semiconductor Packaging Platform Technology R&D organization at Texas Instruments Inc. His research interests include mmWave and THz antenna design, semiconductor packaging, and system design. Dr. Bakshi is a Senior Member of the IEEE and serves as a reviewer of several journals and conferences of the IEEE AP-S, MTT-S, and EP-S, and has held leadership positions at the IEEE EP-S Dallas and SSC-S UTD chapters. Registration: Please register on vTools. Zoom videoconference: https://us02web.zoom.us/j/85122821344?pwd=TENTalZVSHJSckdPS0E4bGhzWmpNQT09 Meeting ID: 851 2282 1344 Passcode: 858482 Virtual: https://events.vtools.ieee.org/m/372033 |
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The adverse impacts of climate change are happening now, and immediate action is needed to save our planet for future generations. Advancements in robotics hold the potential to pave the way towards a more sustainable future by enabling revolutionary solutions in various emission-intensive sectors, such as agriculture, foodtech, built environment, energy, and more. Join Synapse and Silicon Valley Robotics for a half-day event to explore new opportunities at the intersection of robotics and sustainability. This event will inform and inspire you to push the boundaries of robotics to tackle environmental and societal challenges head-on. What to expect: - Engaging talks by leading entrepreneurs, investors, and product developers, sharing the latest breakthroughs in eco-conscious robotics. - Examples of revolutionary robots designed to decrease emissions, reduce resource and energy use, enable circularity, and more. - Interactive breakout sessions where participants will go in-depth on a specific application of robotics to foster a healthier and more resilient world. - Networking opportunities with like-minded professionals who share your passion for robotics and sustainability. Reserve your spot today and together, let’s shape a positive future, fueled by innovation in robotics! https://www.eventbrite.com/e/the-new-wave-of-robotics-engineering-a-sustainable-future-tickets-690463483867?aff=svrobotics Agenda: Neworking and Introduction: Keegan Kirkpatrick - CEO, RedWorks Panel: Engineering a sustainable future through robotics Aidan Madigan-Curtis - Partner, Eclipse Ventures Kira Noodleman - Partner, Bee Partners Bldg: Capgemini Applied Innovation Exchange, 425 Brannan St, San Francisco, California, United States, 94107 |
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In response to the drought intensified wildfire risk in PG&E’s service territory, PG&E has developed the Enhanced Powerline Safety Settings (EPSS) program as an additional layer of protection to reduce wildfire ignition risk. In 2021, PG&E began to pilot these new safety settings and has since seen a significant reduction in California Public Utilities Commission reportable-ignition. In 2022, the program was expanded to all circuits within the high fire risk areas of the service territory. In this presentation, we will cover the program overview, the technical background, how we continue to improve the effectiveness and highlight the opportunities we are taking to improve reliability and reduce customer impact. AGENDA: 11:30 am - Noon Lunch & Networking (In-Person) Noon - 1:00 pm PG&E EPSS Technical Presentation (Zoom Start at Noon) In-Person includes optional lunch provided by IEEE PES SF Chapter. Lunch is free for IEEE members & $5 for non-members. Pay on-site. Speaker(s): James Tuccillo, Dave Canny, Room: Courtyard Room, Bldg: CPUC, 505 Van Ness Ave, San Francisco, California, United States, 94102, Virtual: https://events.vtools.ieee.org/m/371823 |
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Abstract: Both video compression and computer vision make use of spatial and temporal patterns present in images. With the rise of the internet of video things, numerous opportunities have arisen for synergizing AI and video compression. In this presentation, we will explore two main aspects. Firstly, we'll delve into utilizing compressed data to perform AI tasks. Secondly, we'll dive into harnessing AI for video compression and image signal processing. Bio: Dr. Yen-Kuang Chen received his Ph.D. degree from Princeton University. His research areas span from emerging applications that can utilize the true potential of multimedia and Internet of Things (IoT) to computer architecture that can embrace emerging applications. He has 100+ patents and 100+ technical publications. He is recognized as an IEEE Fellow for his contributions to algorithm-architecture co-design for multimedia signal processing. Speaker(s): Yen-Kuang Chen, Room: 1301, Bldg: SCDI, Santa Clara University, Santa Clara, California, United States |
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