Unite & Ignite! Join trailblazing women, celebrate achievements, and forge lasting connections in this empowering women and non-binary networking event. IEEE RAS SCV/SF/OEB supports the Bay Area Women in Robotics Chapter Agenda: This event is intended primarily as a women's networking event. We encourage people who identify as non-binary in robotics to attend. Also appropriate for young women who are interested in exploring robotics as a career. (Allies are always appreciated but will feel a bit out of place.) Bldg: InOrbit, 293 Castro Street, Mountain View, California, United States, 94041

ROS By-The-Bay is the Bay Area's only meetup exclusively for (https://ros.org/). This month we'll have three speakers, a ROS community update, lightning talks, and plenty of time to chat with your fellow developers. Whether your just starting to learn about robotics, or a seasoned industry veteran, ROS By-The-Bay is a great event for connecting with other local roboticists. Speaker(s): KAT SCOTT, ERIC CHEN, COULD BE YOU Agenda: - Talks start promptly at 7pm, please arrive early if you would like to enjoy a slice of pizza. - This event will be hosted at the Intrinsic offices in Mountain View. The location is easily accessible by car, bus, and CalTrain (San Antonio Stop). - (https://osrf.github.io/code_of_conduct/index.html) - - Room: SPACE INVADER ROOM, Bldg: GOOGLE X | INTRINSIC, 250 MAYFIELD AVE, MOUNTAIN VIEW, California, United States

This is a weekly session of the CIT Summer Series, with David A Fisher presenting Why Software Fails and Why AI cannot Help : It was once widely believed that computers would enhance the speed, reliability, and applicability of human deductive reasoning in the physical and social sciences, much as motorized vehicles (e.g., cars, trains, airplanes) have enhanced the speed, reliability, and applicability of human manual abilities in transportation. Yet, 60 years later, computers can be used confidently only for paperwork tasks, analysis of regularly structured data, and simple process control applications. Complex software rarely satisfies user needs, is untrustworthy and difficult to maintain, and largely opaque to its users. Artificial intelligence (AI) methods including heuristics, machine learning, and statistical methods are in opposition to sound deductive reasoning. This presentation explains certain practical and logical impediments to computer enhancement of human deductive reasoning, the deductive limitations of modern programming languages, the role of AI, and provides some promising alternatives. Speaker(s): David A Fisher, Virtual: https://events.vtools.ieee.org/m/364005

This is a weekly session of the CIT Summer Series, with Yuhong Liu presenting Trust and Privacy Vulnerabilities of Today’s Online Social Networks : As we move further into the big data era, people are motivated in numerous ways to proactively generate, share and exchange diverse digital contents online every day. While the increasing amount of information greatly facilitates people’s decision makings, it also brings great challenges. For example, driven by the huge profits behind the big data economy, malicious attacks are emerging rapidly to mislead normal users’ decision-making process by providing carefully crafted false information. In addition, retrieving tremendous amount of user private information has become a popular attack target. This talk will discuss the security, trust and privacy issues in online social networks, the trend and challenges, particularly focusing on several sample attacks. Speaker(s): Dr Yuhong Liu, Virtual: https://events.vtools.ieee.org/m/364004

Free Registration: https://www.eventbrite.com/e/slowly-changing-dimensions-fast-changing-facts-the-story-of-the-classic-dw-tickets-649431084857 Synopsis: The classic or traditional data warehouse is a crucial part of the data analytics supported decision making infrastructure in many organizations. The classic data warehouse is still a key tool in generating actionable insights into an organization’s performance. This talk will detail the rationale for having a data warehouse system distinct from other OLTP based operational systems in the organization, provide insights into dimensional modeling, and conclude with some recent developments in the area. Speaker(s): Dr. Vishnu S. Pendyala Virtual: https://events.vtools.ieee.org/m/363162

Please note the start time it 6:00 PM Pacific Time. The power system industry is shifting towards a new digitization era to better manage risk within volatile energy commodities, increase customer engagement, and enhance efficiency via grid optimization. Data analytics play a vital role in this transformation and, as such, different measurement architectures have been used and implemented to facilitate data capturing process and supervisory control at the generation, transmission, and distribution levels. This seminar will briefly review the recent outcomes of some smart grid challenges addressed by novel prediction techniques. At the generation level, decomposition techniques have been applied to handle the inherent uncertainty in short-term wind power prediction. At the transmission level, dynamic thermal line rating prediction has been studied as a viable solution to reduce congestion and utilize the actual capacity of the line. Considering the high inclusion of phasor measurement units at the transmission level, cutting-edge methods have been proposed to address stability status prediction of the grid following a contingency. Finally, at the distribution level, real-life data obtained from advanced metering infrastructure have been used for load prediction and customer segmentation. You must register in advance on Eventbrite and keep your Eventbrite login. Then log in to Eventbrite 30 minutes beforehand to be linked to the zoom event. There is a limit to the number of participants. Speaker(s): Prof. C.Y. Chung, Agenda: 6:00 Welcome, Introduction to PES/IAS chapter 6:10 Introduction to Prof Chung 6:15 Presentation 7:00 Q&A Virtual: https://events.vtools.ieee.org/m/368595

Cell-based, synthesizable mixed-signal circuits such as ADPLLs, ADCs, and LDOs are gaining significant traction. This is fueled by the exponentially increasing number of DRC rules in advanced nodes, added restrictions on custom layout, and overall increase in design time for full-custom, analog designs. This talk focuses on a different technique for analog design automation that borrows from the digital design flow. I will show how we can describe ADPLLs and LDOs using a combination of standard cells, and a small number of auxiliary cells. These aux cells are no larger than a D-flipflop, and are drawn on the standard cell grid. This means they can be included in existing digital synthesis and automatic place & route (APR) flows, leveraging these very powerful commercial tools. I will present our innovations at the architecture level, and on how we drive the EDA tools, in order to improve performance. Examples and measurement results will be shown, from fabricated ADPLLs and LDOs in TSMC 65nm and GF 12nm, demonstrating the ease of porting these designs across processes. Speaker(s): , David Wentzloff Virtual: https://events.vtools.ieee.org/m/369117

This is a weekly session of the CIT Summer Series, with David Alan Grier presenting The Generations of Computing and the Coming Data Age : If you look carefully at the development of computing, you can see clear generational cycles. These cycles are marked by a sharp change of technology and a group of young leaders taking advantage of those changes. There is clearly a period of 20 years in which these leaders rise to prominence in the field before passing command to the next generation. We can point to the mainframe generation of the Fifties, the Software/PC Generation of the 70s, the Internet/Mobile Generation of the 90s. We are clearly nearing the end of the 90s cycle and need to start asking what follows and who will be the next generation. This talk considers the extent to which data will be the next driving technology and the extent to which we are already shifting towards the data generation of leaders. Speaker(s): David Alan Grier, Virtual: https://events.vtools.ieee.org/m/364007

Join our IEEE PES San Francisco and Santa Clara Valley Chapters for a Technical Meeting (Virtual - see Zoom link under location). Metallic foil balloons that are inflated with helium or a lighter-than-air gas pose a significant risk to overhead electric distribution power lines. The metallic foil can conduct electricity, which can result in a fault condition. An additional failure mechanism occurs if the helium gas ionizes under high enough voltage electric fields which can also result in faults. These faults can result in power outages and also become a fire ignition risk. In recognition of the importance of the identified issue, the IEEE Distribution Reliability Working Group supported the establishment of a Task Force to advance study and efforts undertaken by utilties (largely based in California) with support and study performed by Georgia Tech's NEETRAC. This Task Force has developed this IEEE P2845 trial-use standard which is in the process of being published by the end of 2023. This standard is applicable to celebratory balloons that are comparable in size and shape to what are commonly referred to as foil balloons, which are available in retail stores and are filled with helium or a gas that is lighter-than-air. The test procedures evaluate the dielectric performance of celebratory balloons in contact with simulated energized overhead distribution power lines with the intent of minimizing balloon caused power system outages (or electrical faults). The scope is limited to distribution system voltages of 38 kV or less and only single balloons. After the Trial-Use Standard is published and experience gained, a final IEEE 2845 standard will be developed by the Task Force. California legislation AB 847 (2022) requires, with phase-in period compliance exceptions: "A person that sells, offers to sale, or manufacturers for sale, in this state, any foil balloon shall ensure that those foil balloons pass a standard test, as determined by an accredited testing facility capable of high-voltage testing. The standard test shall be the IEEE 2845 standard when that standard is approved by the IEEE. The standard test shall be approved when the IEEE does all of the following: (i) Publishes an interim standard. (ii) Completes its trial of the interim standard. (iii) Publishes the final approved standard, following materially substantive adjustments, if any, to the interim standard." The phase-in period begins on the commencement date which is the date of IEEE final standard approval or 1/1/2027, whichever is later. Speaker(s): Christian Henderson, Dean Borchardt, Agenda: 11:30 am - Noon Virtual Social & Welcome Back to SF PES! Noon - 1:00 pm IEEE P2845 Technical Presentation 1:00 - 1:30 pm Additional Meeting & Social Time Virtual: https://events.vtools.ieee.org/m/367307

As demand for high-performance semiconductors increases, heterogeneous integration using a combination of 3D monolithic and 2.5D/3D advanced packaging technology can boost the system performance significantly. Consequently, electromigation (EM)-induced failure in micro-bumps and redistribution lines (RDL) has become a great concern. In addition, as electrical current is eventually merged into substrates, thermomigration (TM) due to Joule heating, combined with EM, is one of the potential risks in substrates. In this presentation, I will present some general guidelines about design rules and accelerated tests for electromigration (EM)-induced failure, based on fully coupled modeling. For years, the existing EM theories have succeeded only in partially predicting or explaining complicated phenomena in experiments. Recently, we sorted out many incorrect models and assumptions under the framework of the coupling theory. In addition, taking multi-scale effects into consideration, we used molecular dynamics simulation to determine the key microscopic parameters, thus establishing a complete and self-consistent multi-physics coupling model of electromigration. We further conducted extensive EM tests and collected consistent test data for the purpose of model verification. The theoretical and numerical results fully reproduced the various phenomena in the experiments, including the impact of thermomigration. We then used the validated theory to provide new insights into design rules and acceleration factors to prevent EM-induced failure. This presentation is based on the content of the following two papers, which can be downloaded from these two links. Cui, Z., Fan, X., Zhang, Y., Vollebregt, S., Fan, J., Zhang, G.Q, 2023. (https://doi.org/10.1016/j.jmps.2023.105257). Journal of the Mechanics and Physics of Solids. Volume 174, May 2023, 105257. Cui, Z., Fan, X., Zhang, Y., Vollebregt, S., Fan, J., Zhang, G.Q., 2023. (https://doi.org/10.1016/j.jmps.2023.105256). Journal of the Mechanics and Physics of Solids. Volume 174, May 2023, 105256. Speaker(s): Xuejun Fan, Virtual: https://events.vtools.ieee.org/m/366152

*Due to demand and limited spaces registration now closes Aug 24 Also - more information is here: https://roboticsstartupbootcamp.eventbrite.com This one day bootcamp is focused on robotics startups, providing you with mentors who are experienced in robotics investment and robotics manufacturing. Registration here does not guarantee a space in this small workshop (max 16) but allows you to apply, and for us to match your needs with mentors. We'll cover the basics of the IEEE Deep Tech Business and Manufacturing Checklists, then break into one on one Q&A and mentoring sessions. This event is suitable for preseed to Series A robotics startup founders. We're focused on helping you speed past your potential startup roadblocks. If you have them, bring your diligence and manufacturing documentation. This bootcamp is hosted by Silicon Valley Robotics, Circuit Launch and the IEEE RAS SCV/OEB/SF Jt. Section Chapter and IEEE Entrepreneurship. Bldg: Circuit Launch (upstairs), 8000 Edgewater Dr, Oakland, California, United States, 94621

Don't miss this upcoming talk by IEEE Computer Society Distinguished Visitor Dr. Elisa Barney Smith, Professor, Wallenberg AI, Autonomous Systems and Software Program at Luleå Technical University in Sweden, and Emerita Professor, Boise State University. We are excited to have her visiting us in Boise. This will be a hybrid online/in-person event. If you're in the Boise area, come network with us and see her presentation in person at Boise State University. We'll have light snacks and beverages available. We will be streaming her talk live for those who can't attend in person. This talk is free and open to the public. Speaker(s): Elisa Barney Smith, Boise, Idaho, United States, Virtual: https://events.vtools.ieee.org/m/368163

Abstract Significant enhancements in inertial sensor performance can be obtained by combining high volume compatible mechanical structures from the micro-electro-mechanical systems (MEMS) industry with silicon photonic microresonators. Although noise floors 100-1,000x lower than typical consumer grade MEMS accelerometer and gyroscopes can be achieved, new challenges arise with integration of light sources including requirements on driving and controlling photonic elements. In this talk I will give an overview of Zero Point Motion’s approach to combining photonic integrated circuit (PIC) microresonators with MEMS. I outline how chipscale devices like LIDAR and optical transceivers approach the integration challenge, new developments in ASIC design to aid control, and how Zero Point Motion is adapting these methods for the inertial sensing market. Speaker(s): Dr. Ying Lia Li, Agenda: 11:45am – Noon: Check-In & Announcements Noon – 12:45pm: Invited Talk 12:45pm – 1pm: Questions & Answers Virtual: https://events.vtools.ieee.org/m/369097

The story of how Wi-Fi came to be one of our most significant technologies is surprisingly dramatic. Coming out of the fierce techno/political battles at its birth, Wi-Fi exploded into tens of billions of devices around the globe, where today it supports over half of all internet traffic. This presentation will cover the backstory behind the Wi-Fi phenomenon and will look at what the future might bring. Co-sponsored by: Santa Clara University's IoT Research Lab (SIOTLAB) Speaker(s): Greg Ennis Room: SCDI 1301, Bldg: SCDI, Santa Clara University, 500 El Camino Real , Santa Clara, California, United States, 95053

In advanced packaging, as newer forms of interconnects emerge to meet the demand for high density and high performance, interconnect reliability is becoming more complex and more critical. Finer pitch interconnects in advanced packaging are more susceptible to failures due to electromigration, interfacial reactions etc. Wafer level packaging, Cu direct bonding and other advanced packaging technologies, present new considerations in interconnect reliability. At the same time, the growing adoption of heterogeneous integration leads to increased diversity of interconnects (with different geometries, materials, and interfaces) in the same package, with complex (and often interactive) reliability failure modes and mechanisms. As electronic products become more pervasive in application, interconnect reliability must be considered holistically with regard to environmental conditions, from thermal, mechanical, and thermomechanical, to electrical and electrochemical. High frequency applications demand considerations of interconnect materials for signal integrity. High thermal density and high current density can have increased impact on interconnect reliability. These considerations will impact reliability engineering for semiconductor devices, from design for reliability, to accelerated testing and analysis. Meanwhile, sustainability of electronic products demands environmentally friendly materials and processes. Understanding of the failure mechanisms for different interconnect materials at various levels (wafer, chip, package, and system) of the semiconductor package is of great importance to interconnect reliability in advanced packaging and heterogeneous integration. Speaker(s): Dongkai Shangguan, , Birck Nanotechnology Center #1001, 1205 W State St, West Lafayette, Indiana, United States, Virtual: https://events.vtools.ieee.org/m/370292

This is a weekly session of the CIT Summer Series, with Jon Peddle presenting The History of Visual Magic in Computers: How Beautiful Images are Made in CAD, 3D, VR and AR : If you have ever looked at a fantastic adventure or science fiction movie, or an amazingly complex and rich computer game, or a TV commercial where cars or gas pumps or biscuits behaved liked people and wondered, “How do they do that?”, then you’ve experienced the magic of 3D worlds generated by a computer. 3D in computers began as a way to represent automotive designs and illustrate the construction of molecules. 3D graphics use evolved to visualizations of simulated data and artistic representations of imaginary worlds. In order to overcome the processing limitations of the computer, graphics had to exploit the characteristics of the eye and brain, and develop visual tricks to simulate realism. The goal is to create graphics images that will overcome the visual cues that cause disbelief and tell the viewer this is not real. Thousands of people over thousands of years have developed the building blocks and made the discoveries in mathematics and science to make such 3D magic possible, and The History of Visual Magic in Computers is dedicated to all of them and tells a little of their story. It traces the earliest understanding of 3D and then foundational mathematics to explain and construct 3D; from mechanical computers up to today’s tablets. Several of the amazing computer graphics algorithms and tricks came of periods where eruptions of new ideas and techniques seem to occur all at once. Applications emerged as the fundamentals of how to draw lines and create realistic images were better understood, leading to hardware 3D controllers that drive the display all the way to stereovision and virtual reality. Maps the history of the techniques behind science fiction movies, complex and rich computer games, and TV commercials capable of making cars, gas pumps and biscuits behave like human beings. Speaker(s): Dr. Jon Peddie, Virtual: https://events.vtools.ieee.org/m/364008