Location: Maple Room, Mountain View Community Center, 201 S Rengstorff Ave, Mountain View, CA 94040 Speaker: Fen Chen,1Cruise LLC, San Francisco, CA, USA (mailto:[email protected]) Abstract: Visualization technologies are the most vital components of in-vehicle interactions. The shift toward autonomous vehicles and connected cars is bringing a future in which occupants would be needed to monitor the status of the vehicle and its surroundings. Meanwhile, occupants would also spend significantly more time watching displays for entertainment, information, and connectivity on the road. Therefore, the need for in-vehicles displays with better visibility, brightness, viewing angle, resolution, sharpness, and reliability together with larger sizes and free-form that offer unobtrusive visual information during journeys is on the rise. Superior display with touch technologies can enable a safe, informative, and comfortable driving or riding experience. The applied in-vehicle display products include a center infotainment display, rear seat entertainment display, head-up display, side mirror display, and instrument cluster display. In this talk, motivations as well as various architectures of display including LED, LCD, OLED, Mini/Micro-LED, TFT, flexible, heads-up, and the touchscreen will be introduced. The development trend of in-vehicle display technology will be discussed. The mature TFT LCD technology is still the mainstay for in-vehicle in the short term. OLED and Mini LED/Micro LED array technology has a relatively large advantage in the medium and long term. Due to the unique requirements and opportunities such as aggressive adoptions of EVs, digitalization, and autonomous vehicle, the in-vehicle display technology development will be moved from a “follower” to a “front runner”. Designing displays for vehicles imposes very different challenges than designing them for consumer applications. This is due to some unique factors associated with vehicle usage, such as the required product life cycles, the extremely harsh environment, frequent mechanical impacts, the stringent EMI/EMC compliance, the required high-level ESD protection, and functional safety requirements. Requirements and challenges of display in-vehicle application, including optical performance, appearance, fabrication, characterization, mura/defect inspection, Demura technique, visibility in bright and complete darkness, touch functionality, quality, reliability, EMI/EMC/ESD, and functional safety will be reviewed. Some common LED LCD display reliability failure modes and effects include FOS spot lighting failure mechanism and risk assessment, BLU film buckling and wrinkle failure mechanism and modeling, metal oxide TFT panel level VGH and VGL reliability modeling, LCD panel UV aging reliability modeling, Polarizer bleaching failure mode and reliability modeling, free fall object impact test and LCD glass crack failure risk assessment, and LED luminance degradation reliability modeling will be presented. Automotive display technology will continue to evolve as there are still many emerging technologies, as well as the refinements of existing technologies, which are still under development. This continued growth will overwhelm the driver and occupants with maximum comfort and convenience on the road. Co-sponsored by: IEEE-VTS (Vehicular Technology Society) Speaker(s): Fen Chen, Agenda: Check-in and pizza at 6:15PM – 6:45 PM. 6:45 to 8:00 – Conclusion with Q&A Room: Maple room, Bldg: Mountain View Community Center, 201 S Rengstorff Ave, mountain view, California, United States, 94040

AI/ML is an all-pervasive technology that has the potential to transform our lives. It has use cases from Internet of Things (IoT) to edge devices to automotive to cloud. This presentation discusses how AI is disrupting traditional embedded edge market including surveillance, robotics, industrial automation, aerospace and defense applications. We will cover market requirements, customer use cases and key challenges. In addition, we will also discuss how next generation of purpose-built products are addressing the needs of this market. Speaker(s): Gopal Hegde, Virtual: https://events.vtools.ieee.org/m/362147

This event will be available live at SEMI, as well as over Zoom. Get to SEMI by 6:30pm to network – and enjoy great pizza and refreshments! Some of the most common cybersecurity threats to Industrial Control Systems (ICS) include: malware, ransomware, phishing, distributed denial of service attacks, and physical attacks. ICS controls and monitors industrial processes in a wide range of industries, including energy, manufacturing, transportation, and water/wastewater. Examples include programmable logic controllers and Supervisory Control and Data Acquisition (SCADA) systems. As ICS is often connected to the Internet, it is vulnerable to cyberattacks. (https://www.dragos.com/), a cybersecurity firm that specializes in securing ICS systems, issued a recent report noting that there were over 500 ransomware attacks on industrial systems in the United States in 2022. In 2021, a ransomware attack on a water treatment plant in Florida caused the plant to temporarily shut down, leaving residents without water for several hours. The Stuxnet attack on uranium enrichment equipment in Iran is probably the most well-known direct attack on ICS. (https://www.cisa.gov/news-events/alerts/2017/06/12/crashoverride-malware) was reportedly used in 2016 against critical infrastructure in Ukraine. The U.S. Department of Homeland Security’s (https://www.cisa.gov/) leads the national effort to understand, manage, and reduce risk to the cyber and physical infrastructure on which Americans depend on a daily basis. Among the 16 critical infrastructure sectors are Communications, Energy, Food and Agriculture, Financial Services, and Healthcare and Public Health. In this talk, Mario Garcia will discuss current trends in cybersecurity threats, and how CISA works to reduce risk and improve the resilience of the nation’s critical infrastructure. CNSV member (https://californiaconsultants.org/members/david-m-snyder/) will present additional details on Industrial Control Systems cybersecurity. Speaker(s): Mario Garcia, David Snyder 567 Yosemite Dr, Milpitas, California, United States, 95035, Virtual: https://events.vtools.ieee.org/m/362944

Massive demands are being placed on computing due to skyrocketing increases in data consumption. Penetration of AI and ML into more and more fields requires real-time fast processing at the edge as well as fast data transfer to datacenters for analysis. 5G and 6G technologies demand ever increasing frequency for wireless communications. Autonomous driving and other harsh environments demand high reliability. The semiconductor industry needs to continuously deliver better performance from a smaller footprint with higher frequency response, higher reliability, lower power consumption, and all with a lower barrier for entry than advances at the transistor level. How are these rigorous market demands influencing innovations in chip manufacturing and advanced interconnect such as hybrid bonding? This presentation will give a brief introduction of the hybrid bonding technology, how it enables disaggregation and heterogeneous integration and helps increase efficiency and performance while shrinking footprint, and how it enables high reliability. Speaker(s): Guilian Gao, SEMI World Hdqtrs, 673 S Milpitas Blvd, Milpitas, California, United States, 95035, Virtual: https://events.vtools.ieee.org/m/360650

Free Registration: https://www.eventbrite.com/e/a-vision-of-intelligent-train-control-tickets-641698887647 Synopsis: The progressive adoption of Artificial Intelligence (AI) and advanced communication technologies within railway control and automation gave rise to a huge potential in terms of optimization, learning and adaptation, due to the so-called “self-x” capabilities. However, it has also raised several dependability concerns due to the lack of measurable trust that is needed for certification purposes. In this talk, a vision will be provided about future train control that builds upon existing automatic train operation, protection, and supervision paradigms. The basic concepts for autonomous driving in digital railways will be provided, and feasibility will be addressed in terms of challenges and opportunities, including explainability, autonomic computing, and digital twins. Due to the clear architectural distinction, traditional train protection (ATP) can act as a safety envelope for intelligent operation to optimize energy, comfort, and capacity, while intelligent protection based on signal recognition and obstacle detection can improve safety through advanced driving assistance. Speaker(s): Prof. Francesco Flammini , Vishnu S. Pendyala Virtual: https://events.vtools.ieee.org/m/362162

Join Kurt Petersen (Guest Speaker) and Roger Grace (Moderator) on a Fireside Chat at Sensors Converge in Santa Clara (CA) on Wednesday, June 21, from 7 to 8pm (PT). Kurt Petersen (a.k.a. the Father of MEMS) is an American Inventor and Enterpreneour. Dr. Petersen received his BS degree cum laude in EE from UC Berkeley in 1970. In 1975, he received a PhD in EE from the Massachusetts Institute of Technology. Dr. Petersen established a micromachining research group at IBM from 1975 to 1982, during which he wrote the review paper “Silicon as a Mechanical Material,” published in the IEEE Proceedings (May 1982). This paper is still the most frequently referenced work in the field of micromachining and micro-electro-mechanical systems (MEMS). Since 1982, Dr. Petersen has co-founded six successful companies in MEMS technology, Transensory Devices Inc. in 1982, NovaSensor in 1985 (acquired by GE), Cepheid in 1996 (was a public company on NASDAQ: CPHD; acquired by Danaher in 2016), SiTime in 2004 (acquired by MegaChips in 2014, IPO in 2019), Profusa in 2008 (still private), and Verreon in 2008 (acquired by Qualcomm in 2010). In 2011, Dr. Petersen joined the Silicon Valley Band of Angels. The Band is an angel investment group which mentors and invests in early stage, high-tech, start-up companies. Today, he spends most of his time helping and mentoring such companies. Dr. Petersen has published over 100 papers, and has been granted over 35 patents in the field of MEMS. In 2001 he was awarded the prestigious IEEE Simon Ramo Medal for his contributions to MEMS. Dr. Petersen is a member of the National Academy of Engineering and is a Life Fellow of the IEEE in recognition of his contributions to “the commercialization of MEMS technology”. In 2019, he was awarded the IEEE's highest honor, the IEEE Medal of Honor. Roger H. Grace is president of Roger Grace Associates, a Bonita Springs, Florida-based marketing consultancy he founded in 1982 that provides market research, strategic marketing communications and business development services to the MEMS, sensors and capital equipment industry. He can be reached via email at [email protected]. His background includes over 40 years in high frequency analog circuit design engineering, application engineering, project management, product marketing and technology consulting. He was a founding member of MANCEF and currently is its VP of the Americas. Specializing in microelectromechanical systems (MEMS) and sensors for over 40 years, he is considered a pioneer in this field. He has authored over 40 technical feature articles, organized, chaired, and spoken at over 30 international technical sessions and is frequently quoted as an industry expert in major international technical and business publications. He is a recipient of the Outstanding Engineering Alumni of the Year in 2004 by Northeastern University and was bestowed the inaugural Sensor Industry Impact Award by Sensors Magazine in 2016. Mr. Grace held the position of visiting lecturer at the University of California at Berkeley from 1990 to 2003. His educational background includes a B.S.E.E. and M.S.E.E. (as a Raytheon Company fellow) from Northeastern University, and the MBA program at Haas Graduate School of Business at U.C. Berkeley. Agenda: 6:30 – 7:00 PM Networking 7:00 – 8:00 PM Fireside Chat Santa Clara Convention Center, 5001 Great America Pkwy, Santa Clara, California, United States, 95054

Seminar Title: Miniaturized Power Management that Disappears and Merges with the Environment and Systems Abstract: The need for an efficient power management solution has never been more critical across virtually all electronic devices and systems from low power to high power, smartphones to data centers, battery-powered components to renewable-energy-powered grids, and from stationary systems to aircraft. Particularly for ultra-low power systems such as untethered sensors and IoT systems, the key challenge is to maintain high delivery efficiency while satisfying increasingly demanding input/output requirements, space constraints, reliability, and cost, simultaneously. Aiming to address this grand and increasingly difficult challenge, the speaker will present multiple approaches centered around physical, architectural, and functional integration of advanced power management units with the systems that allow them to efficiently and essentially disappear/merge with the environment. Design examples and results from the iPower3Es group at UCSD and state-of-the-arts will also be covered as demonstration. About the speaker: Dr. Hanh-Phuc Le is an Assistant Professor of ECE at the University of California San Diego and a co-Director of the Power Management Integration Center, an NSF IUCRC center. He received the Ph.D. degree from UC Berkeley (2013), M.S. from KAIST, Korea (2006), and B.S. from Hanoi University of Science and Technology in Vietnam (2003), all in Electrical Engineering. In 2012, he co-founded and served as the CTO at Lion Semiconductor until October 2015. The company was acquired by Cirrus Logic in 2021. He was with the University of Colorado Boulder from 2016 to 2019, before joining the ECE department at UC San Diego. He held R&D and consulting positions at Oracle, Intel, Rambus, JDA Tech in Korea and the Vietnam Academy of Science and Technology (VAST) in Vietnam. His current research interests include miniaturized/on-die power conversions, large conversion ratios, smart power delivery and control for high performance IT systems, data centers, telecommunication, robots, automotive, mobile, wearable, and IoT applications. Dr. Le received a 2021 NSF CAREER Award, a 2012-2013 IEEE Solid-State Circuits Society Pre-doctoral Achievement Award, and UC Berkeley's 2013 Sevin Rosen Funds Award for Innovation. He authored three book chapters, over fifty journal and conference papers with one best paper award in various topics in the area of integrated power electronics. He is an inventor with 22 U.S. patents (11 granted and 11 pending). He serves as an associate editor of the IEEE Journal of Emerging and Selected Topics in Power Electronics (JESTPE), TPC Chair/co-chair for the International Workshop on Power Supply On Chip (PwrSoC 2018, 2020), Chair of the Power Management and Outreach Subcommittees at the IEEE Custom Integrated Circuits Conference (2020, 2021), Vice Chair of the Energy Conversion Congress and Exposition (ECCE) in 2021-2023, and Chair of the IEEE Power Electronics Society Technical Committee on Power Components, Integration, and Power ICs (IEEE PELS TC2) in 2019-2023. Dr. Le is an IEEE Senior Member. About Sensors Converge 2023: Discover the future at the only event where the building blocks of IoT converge - sensors, processing, and connectivity. Join the sensors and electronics community this June 20-22 at the ONLY event covering the biggest design engineering trends. From enabling innovation, to process design & control development, to transforming markets, Sensors Converge (https://www.sensorsconverge.com/) covers technologies and applications that can help you design smarter systems/IoT devices in a sustainable economy. Santa Clara , California, United States

Cameras have become key sensors in many products, e.g., cellphones, automotive, and AR/VR. Though cameras were traditionally invented to mimic human perception, the recent development of artificial intelligence (AI) enabled cameras in an increasing number of computer vision applications (e.g., gesture control, object detection), which also brings additional challenges in camera development and packaging. This talk will first provide a brief introduction to the camera system, including both camera module hardware and the image processing pipeline, and then discuss how different applications affect camera development and packaging. Speaker(s): Zack Lai, SEMI World Hdqtrs, 673 S Milpitas Blvd, Milpitas, California, United States, 95035, Virtual: https://events.vtools.ieee.org/m/361749

Join the Silicon Valley, San Francisco and Oakland/East Bay Chapter of the IEEE Robotics and Automation Society and The Commonwealth Club for a showcase of robots with guest speakers from Boston Dynamics, Intrinsic.io, RAND and Silicon Valley Robotics. Our speakers will start the discussion on some real world issues facing the roll out of robots, while we provide a hands-on showcase of some of the robots of tomorrow. ***CANCELED*** Bldg: The Commonwealth Club, 110 The Embarcadero, San Francisco, California, United States, 94105

At a time when computing is so much a part of all of our lives, has incredible job opportunities, and is so empowering, most students graduate high school without having had any introduction to computer science. A decade ago in the United States, the CSforALL movement was launched to broaden participation in computing to those traditionally underrepresented. This talk will reflect on the current state of that initiative, and introduce the "Beauty and Joy of Computing (BJC)" course, which has received worldwide attention and currently has 65% female enrollment at UC Berkeley, among the highest in the nation. Speaker(s): , Dan Garcia Virtual: https://events.vtools.ieee.org/m/360195

WBG semiconductors (i.e. SiC and GaN) outperform silicon in terms of breakdown field (10X in the case of SiC) and thermal conductivity (2X in the case of SiC), hence, ensuring smaller conduction losses and better heat dissipation combined with faster switching frequency. All this results in saving energy (i.e. smaller battery) and costs (i.e. smaller passive components and volume of the power module). However, to take fully advantage of WBG semiconductors it is of paramount importance to: (i) develop new packaging technologies, (ii) optimize the packaging design in terms of thermo-electric and electromagnetic (i.e. stray inductance and mutual coupling) behavior to ensure clean and fast switching of the MOSFETs and avoid oscillations. This talk will start from basic concepts of power module design by taking a half-bridge topology as reference and will show some of the tools and methodologies that are currently used for the optimization. Moreover, the talk will briefly describe some of the new advanced technologies (embedding, chip scale packaging, sintering) for the packaging of GaN and SiC power modules. Speaker(s): Dr. Giovanni Salvatore, Virtual: https://events.vtools.ieee.org/m/361989