IEEE/SCU SoE Virtual Panel Session Open Networking was promised to be a new paradigm for the telecom, cloud and enterprise networking industries when it was introduced in 2011 by the Open Networking Foundation (ONF). This "new epoch" in networking was based on Software Defined Networking (SDN), which dictated a strict separation of the Control and Data planes with OpenFlow as the API/protocol between them. A SDN controller running on a compute server was responsible for hierarchical routing within a given physical network domain, with “packet forwarding engines” replacing hop by hop IP routers in the wide area network. Virtual networks via an overlay model were not permitted and were referred to as “SDN Washing” by Guru Parulkar, who ran the Open Networking Summit’s for many years. Panelists: - Roy Chua, AvidThink - Arpit Joshipura, LF Networking - Run Almog, DriveNets Moderator: Alan J Weissberger, IEEE Techblog, SCU SoE Co-sponsored by: Santa Clara University Agenda: Agenda: - Opening remarks by Moderator and IEEE Future Networks – 8 to 10 minutes - Panelist’s Position Presentations – 55 minutes - Pre-determined issues/questions for the 3 panelists to discuss and debate -30 minutes - Issues/questions that arise from the presentations/discussion-from Moderator & Host -8 to 10 minutes - Audience Q &A via ZOOM Chat box or Question box (TBD) -15 minutes - Wrap-up and Thanks (Moderator) – 2 minutes Virtual: https://events.vtools.ieee.org/m/356552

This event will be a conversation with Stan Mazor as led by Brian Berg. Stan will discuss his work at Fairchild Semiconductor and Intel under Gordon Moore, and Moore’s impact on these companies and the industry itself. Mazor will also discuss work he did at these companies, including his role in development of Fairchild’s Symbol high-level language for the (https://fermatslibrary.com/s/fairchild-symbol-computer). This computer’s implementation of virtual memory led to an early patent for Stan and two others on his team. The conversation will include Stan’s role in development of Intel’s 4004, the first commercially-available single-chip microprocessor, as well as the 8008 and the very successful 8080. Mazor will also discuss the work he did as an early employee of Silicon Compiler Systems and Synopsys. He will also provide his perspective of the impact of Moore’s Law as he saw technology progress over his career. Co-sponsored by: IEEE-SCV Life Member Affinity Group (LMAG) Speaker(s): Stan Mazor, Brian Berg 567 Yosemite Dr, Milpitas, California, United States, 95035, Virtual: https://events.vtools.ieee.org/m/357215

This will be a hybrid live and Zoom "Town Hall" for SSIT members and those interested in joining SSIT to meet and discuss interests and future topics for 2023. Light refreshments will be served for the in-person member attendees. Our officer team will be present for the inperson session and is looking forward to meeting you! Agenda: Officer Introductions SSIT Overview Attendee Round Table - Orientations and Ideas Topics of Community Interest Room: 129, Bldg: Heafey, 500 El Camino Real, Santa Clara University, Santa Clara, California, United States, 95053, Virtual: https://events.vtools.ieee.org/m/357421

Understanding other perspectives and finding common ground is a key leadership skill. It is correct to say that your perspective is your reality. Yet, when you validate other perspectives of a situation or problem, the closer to reality you get. The value of using this skill is listening to people who may have a different point of view than you and discovering potential blind spots or new things to consider that will contribute to your understanding of the situation and help in your decision making. A leader’s ability to navigate diverse viewpoints to consensus builds trust and engagement, increases ownership, and grows project or solution commitment. What could be different in your personal leadership style if you could better navigate diverse perceptions and find common ground? Speaker(s): Gwen Wagner, Virtual: https://events.vtools.ieee.org/m/359393

The annual 24th NFIC jointly organized by the chapter and NATEA will be back in Stanford University on May 8. Learn about #QuantumComputing (QC) ecosystem, QC for Sensor & Imaging, how QC can disrupt many sectors of the #industry, #Y2Q, #PQC, spin #qubit, superconducting qubit, and more from leading subject matter experts like Dr. Hiu Yung (Hugh) Wong, Dr. Kuan-Tsae Huang, and others. Check details and register at https://www.eventbrite.com/e/nfic-2023-quantum-computing-is-coming-what-can-it-do-tickets-571894982287 Co-sponsored by: NATEA Stanford University, Stanford, California, United States

System-in-Package (SiP) technology provides a great opportunity for consumer electronics companies to make products with smaller form factor, more functions, and better reliability performance. One key reason for SiP’s success is the encapsulated structure using molding compound, which can provide protection to all the components inside and allows reduced component-to-component spacing. However, if the design or the manufacturing process have flaws, failures can also happen inside of SiP, and engineers have to spend much more efforts and time to conduct fault isolation, understand the root cause, and make related corrective actions. In this regard, risks are borne not only by the SiP manufacturers, but also the system integrators and Original Equipment Manufacturers (OEMs) who needs to assemble SiP into the final product. Therefore, a comprehensive design and manufacturing assessment plan and an effective validation method at an early stage of the SiP development will be extremely critical so that the risk can be identified in advance, and the impact to the product launch can be minimized. This paper focuses on two types of encapsulant related failures, molding void and component internal delamination. By presenting several cases that are encountered during SiP development, their failure mechanisms are studied, and the methodology to detect the failure and assess the risk are also discussed. Speaker(s): Dr Yuan Zhang, Bldg: Mountain View Community Center, 201S. Rengstorff Avenue, mountain view, California, United States, 94040

With electric vehicles becoming more common, the electromagnetic noise they generate is an issue that more designers must face. Ms. Burnham brings lessons learned from several years of troubleshooting electric vehicles, both hybrid and plug in, to discuss some of the most important EV noise factors. Speaker(s): Karen Burnham, Bldg: Bureau Veritas, 775 Montague Expressway, milpitas, California, United States, 95035

Learn about Portable Radar systems at the human-microwave frontier including Life Activity Sensing and Human Tracking Speaker(s): Changzhi Li Virtual: https://events.vtools.ieee.org/m/359657

Lifespan is how long we live. Healthspan is how long we live well. The aging process takes a significant toll on our bodies limiting our functional capacity and diminishing the quality of our lives. We lose up to 3% of our muscle mass per year, 1% of our bone density per year, and our cellular physiology changes leading to metabolic syndrome, diabetes, hypertension, heart attacks, and strokes, plus our brains shrink by about 1% per year with attendant memory issues and dementia. Lack of exercise costs the healthcare system $117 billion per year. This does not include the untold suffering from falls, loss of independence, and the burdens placed on our families. We cannot stop the aging process, but we can slow it down. Exercise creates biochemical changes that can mitigate all these changes. We can add new muscle, strengthen our bones, reduce our blood pressure, improve body composition and a host of other physiologic changes. We can improve our healthspan to more nearly match our lifespans. We are developing an easy-to-use app, “GetMoovin,” to make exercise fun and create community through a free photo sharing platform. In addition, it provides a sophisticated subscription side to help people plan their healthspans by guiding them through a process of identifying what is important to them and providing a program to make sure they can do the things that are important to them as they age. Speaker(s): Jack Keene, MD, FACEP, Anne L. Friedlander, PhD Virtual: https://events.vtools.ieee.org/m/359276

Glass, with its manifold compositional tweaking, offers the widest possible range of attributes and properties relevant to carrier performance in wafer thinning as well as in advanced packaging. In this presentation, we will first focus on the topic of wafer ultra-thinning of semiconducting as well as piezo materials. We will demonstrate that the desire for thinner substrates can be realized with 1) carriers that exhibit extremely low total thickness variation (TTV), and 2) an associated temporary bonding method that presents extremely low thickness variation as well. The combination of Corning’s recently announced ultra-low TTV carriers with near-zero TTV bonding methods has proven to be a powerful tool to guarantee high precision thinning of various wafer types. On the topic of carrier properties, the coefficient of thermal expansion (CTE) plays a major role in the control of in-process warpage in buildup structures such as fan-out wafer level packaging and multi-layer laminates. We will present several use cases when specifically-tuned CTE is advantageous to reduce stress within a given process environment. Corning’s Advanced Packaging Carrier (APC) product family offers glass wafers with CTE that varies from 4.9-12.6 ppm/C with fine granularity of 0.2 ppm/C, in addition to silicon-matched glasses with a CTE of 3.4 and other glass types that go all the way down to 0 ppm/C. This portfolio enables the right choice of glass for each and every application to optimize processability. Speaker(s): Julia Brueckner, Virtual: https://events.vtools.ieee.org/m/353525

Road transportation, which accounts for 22 percent of greenhouse gas emissions, is undergoing a major transformation with the advent of ridesharing, autonomous driving, and vehicle electrification. Collectively these technologies, in conjunction with renewable sources of electricity, have the potential to dramatically reduce the negative impact of road transportation on the health of the planet. The successful convergence of these technologies will require electric vehicles that are low cost and fully autonomous. These attributes can be realized through dynamic wireless charging. However, this will require wireless charging technology that is well beyond current capabilities and opens new areas of research related to power and transportation infrastructure. Using examples from research on capacitive wireless charging (as opposed to the more common inductive techniques), which leverage very high frequency power electronics, this talk will highlight the opportunities and challenges in dynamic wireless charging of electric vehicles. Speaker(s): Dr Khurram Afridi 440 N Wolfe Rd, Sunnyvale, California, United States, 94085, Virtual: https://events.vtools.ieee.org/m/356408

The Electron Devices Society Santa Clara Valley/San Francisco joint Chapter is hosting an EDS Distinguished Lecturer Dr. Adam Skorek. The titled of the lecture is ‘Artificial Intelligence and Brain Biofields Quantum Computing. When: Friday, May 19, 2023 – 12 Noon to 1 pm (PDT) Where: This is an online event and attendees can participate via Zoom. Registration Link: (https://bit.ly/3KY0mUa) Contact: hiuyung.wong at ieee.org Speaker: Prof. Adam Skorek (EDS Distinguished Lecturer) Abstract: Artificial intelligence (AI) is present in electrical, electronics, and computer engineering for years. In particular, the biofields defined as electromagnetics and thermal fields in living matter are naturally related to AI studies and applications, including brain analysis with numerical modeling and simulations. Brain functionalities inspire all developments in AI from theoretical investigations to machine learning, humanoids robots, Digital Twins (DT), and brains interface devices implementation. The brain biofields’ interactions with external excitations such as 5G/6G telecommunications devices, transcranial magnetic stimulation, and even other brains biofields are currently explored more than ever before. The computation demand in modeling and simulation is still growing and it is particularly high in both AI and brain biofields applications. Hopefully, the High-Performance Computing (HPC) and High-Performance Quantum Computing (HPQC) infrastructures become more easily accessible and offer researchers some new opportunities based on the open and shared resources including not only computing facilities with quantum units but also knowledge with currently observed openings in the field of intellectual property issues. A presentation from a worldwide perspective of some modern research works with their results applications is completed by the lecturer’s experiences and guidelines for the future. Some practical examples and instructions for researchers, engineers, and students are presented, stimulating the audience to various scientific as well R&D activities in those so promising areas. Speaker Bio: Prof. Adam Waldemar Skorek (M’87, SM’90, F’09, LF’23) completed Bachelor and Master of Electrical Engineering Program at Białystok University of Technology (Poland) receiving both Master and Engineer degrees in 1980. Participant of the Electrical Engineering Faculty Doctoral Studies, he received a Doctor of Technical Sciences degree in Electrical Engineering at Warsaw University of Technology (Poland) in 1983. From 1983 to 1987 he was a Visiting Lecturer at the Institute of Telecommunications in Oran (Algeria). In 1987, he joined the University of Quebec at Trois-Rivières (UQTR), Canada, where currently, he is a Full Professor and Director of the UQTR’s Electro-Thermal Management Laboratory which succeeded both the Nano-Heat Laboratory and Industrial Electro-Heat Laboratory, all founded and directed by himself since 1989. He is conducting electrical engineering courses for bachelor, master, and Ph.D. students. His research works were granted by NSERC, CFI, FRQNT, MITACS, and Industry. He was made contributions to the numerical analysis of electro-thermal and biofields phenomena exploring and applying various techniques to electrical apparatus, electronic devices, and living organisms. His publications and communications record include works on High-Performance Computing, Artificial Intelligence, Digital Twins (DT) and Quantum Computing applications, in electro-thermal and biofields analysis. A number of those publications are available in IEEE Xplore. The IEEE Life Fellow, as well as Fellow of the Engineering Institute of Canada, Prof. Adam W. Skorek is a Member of the Engineering Academy in Poland and recipient of the 2021 IEEE Industry Applications Society Distinguished Service Award. Speaker(s): Prof. Adam Skorek Agenda: The Electron Devices Society Santa Clara Valley/San Francisco joint Chapter is hosting an EDS Distinguished Lecturer Dr. Adam Skorek. The titled of the lecture is ‘Artificial Intelligence and Brain Biofields Quantum Computing. When: Friday, May 19, 2023 – 12 Noon to 1 pm (PDT) Where: This is an online event and attendees can participate via Zoom. Registration Link: (https://bit.ly/3KY0mUa) Contact: hiuyung.wong at ieee.org Speaker: Prof. Adam Skorek (EDS Distinguished Lecturer) Abstract: Artificial intelligence (AI) is present in electrical, electronics, and computer engineering for years. In particular, the biofields defined as electromagnetics and thermal fields in living matter are naturally related to AI studies and applications, including brain analysis with numerical modeling and simulations. Brain functionalities inspire all developments in AI from theoretical investigations to machine learning, humanoids robots, Digital Twins (DT), and brains interface devices implementation. The brain biofields’ interactions with external excitations such as 5G/6G telecommunications devices, transcranial magnetic stimulation, and even other brains biofields are currently explored more than ever before. The computation demand in modeling and simulation is still growing and it is particularly high in both AI and brain biofields applications. Hopefully, the High-Performance Computing (HPC) and High-Performance Quantum Computing (HPQC) infrastructures become more easily accessible and offer researchers some new opportunities based on the open and shared resources including not only computing facilities with quantum units but also knowledge with currently observed openings in the field of intellectual property issues. A presentation from a worldwide perspective of some modern research works with their results applications is completed by the lecturer’s experiences and guidelines for the future. Some practical examples and instructions for researchers, engineers, and students are presented, stimulating the audience to various scientific as well R&D activities in those so promising areas. Speaker Bio: Prof. Adam Waldemar Skorek (M’87, SM’90, F’09, LF’23) completed Bachelor and Master of Electrical Engineering Program at Białystok University of Technology (Poland) receiving both Master and Engineer degrees in 1980. Participant of the Electrical Engineering Faculty Doctoral Studies, he received a Doctor of Technical Sciences degree in Electrical Engineering at Warsaw University of Technology (Poland) in 1983. From 1983 to 1987 he was a Visiting Lecturer at the Institute of Telecommunications in Oran (Algeria). In 1987, he joined the University of Quebec at Trois-Rivières (UQTR), Canada, where currently, he is a Full Professor and Director of the UQTR’s Electro-Thermal Management Laboratory which succeeded both the Nano-Heat Laboratory and Industrial Electro-Heat Laboratory, all founded and directed by himself since 1989. He is conducting electrical engineering courses for bachelor, master, and Ph.D. students. His research works were granted by NSERC, CFI, FRQNT, MITACS, and Industry. He was made contributions to the numerical analysis of electro-thermal and biofields phenomena exploring and applying various techniques to electrical apparatus, electronic devices, and living organisms. His publications and communications record include works on High-Performance Computing, Artificial Intelligence, Digital Twins (DT) and Quantum Computing applications, in electro-thermal and biofields analysis. A number of those publications are available in IEEE Xplore. The IEEE Life Fellow, as well as Fellow of the Engineering Institute of Canada, Prof. Adam W. Skorek is a Member of the Engineering Academy in Poland and recipient of the 2021 IEEE Industry Applications Society Distinguished Service Award. Virtual: https://events.vtools.ieee.org/m/359050

Register: https://www.eventbrite.com/e/circuits-challenges-in-a-high-resolution-artificial-retina-tickets-630361065917?aff=ebdssbdestsearch Event information: https://site.ieee.org/scv-cas/ Abstract: Brain-machine interfaces (BMIs) of the future will be used to treat diverse neurological disorders and augment human capabilities. However, to realize this futuristic promise will require a major leap forward in how electronic devices interact with the nervous system. Current BMIs provide coarse communication with the target neural circuitry because they fail to respect its cellular and cell-type specificity. Instead, they indiscriminately activate or record many cells at the same time and provide only partial restoration of lost abilities. A future BMI that may pave the path forward is an artificial retina -- a device that can restore vision to people blinded by retinal degeneration. Because the retina is relatively well understood and easily accessible, it is an ideal neural circuit in which to develop a BMI that can approach or exceed the performance of the biological circuitry. I will summarize the basic neuroscience of vision, identify the requirements for an effective retinal interface, and describe some of the necessary circuits and systems and their challenges. Bio: Dante Muratore received the B.Sc. and M.Sc. degrees from Politecnico of Turin in 2012 and 2013, respectively. He received the Ph.D. degree from the University of Pavia, Italy in 2017 working on integrated sensor interfaces. From 2015 to 2016 he was a Visiting Scholar at the Massachusetts Institute of Technology. From 2016 to 2020 he was a Postdoctoral Fellow at Stanford University, USA. As of October 2020, he is an assistant professor at Delft University of Technology. His research focuses on investigating hardware and system solutions for high-bandwidth brain-machine interfaces that can interact with the nervous system at natural resolution. Currently, he is developing neural interfaces to treat blindness, depression, and epilepsy. Agenda: 5:30pm to 6pm --> Welcome, Registration, and Refreshments 6pm to 7pm --> Seminar Room: 201, Bldg: Cupertino Library, 10800 Torre Avenue Cupertino, CA 95014, Cupertino, California, United States, 95014

Register here: https://www.eventbrite.com/e/the-emerging-ecosystem-of-open-source-ic-design-tickets-633041212307 More info: https://site.ieee.org/scv-cas/iscas-2023/ Abstract: Since the launch of the Open MPW program by Google, SkyWater, and Efabless in 2020, we have witnessed a steady expansion of the open-source IC design ecosystem. There are more than 5,500 users on the open-silicon Slack space and nearly 1,000 design projects have been initiated on Efabless’ project portal. In addition to SkyWater’s 90 and 130 nm offerings, designers can now also target open PDKs by GlobalFoundries (180 nm) and IHP (130 nm BiCMOS). This presentation will review the latest developments in this space including the IEEE SSCS Chipathon and Code-a-Chip competitions (please see this webpage for further information: https://sscs-ose.github.io/). Bio: Boris Murmann is a Professor of Electrical Engineering at Stanford University. He joined Stanford in 2004 after completing his Ph.D. degree in electrical engineering at the University of California, Berkeley in 2003. From 1994 to 1997, he was with Neutron Microelectronics, Germany, where he developed low-power and smart-power ASICs. Since 2004, he has worked as a consultant with numerous Silicon Valley companies. Dr. Murmann’s research interests are in mixed-signal integrated circuit design, including sensor interfaces, data conversion, high-speed communication, and embedded machine learning. He was a co-recipient of the Best Student Paper Award at the 2008 and 2021 VLSI Circuits Symposia, as well as a recipient of the Best Invited Paper Award at the 2008 IEEE Custom Integrated Circuits Conference (CICC). He received the 2009 Agilent Early Career Professor Award, the 2012 Friedrich Wilhelm Bessel Research Award by the Humboldt Foundation, and the 2021 SIA-SRC University Researcher Award for lifetime research contributions to the U.S. semiconductor industry. He has served as an Associate Editor of the IEEE Journal of Solid-State Circuits, an AdCom member and Distinguished Lecturer of the IEEE Solid-State Circuits Society (SSCS), the Data Converter Subcommittee Chair and Technical Program Chair of the IEEE International Solid-State Circuits Conference (ISSCC), as well as the Technical Program Co-Chair of the tinyML Research Symposium. He currently serves as the chair of the IEEE SSCS Technical Committee on Open-Source Ecosystem and the General Co-Chair of the 2023 IEEE International Symposium on Circuits and Systems (ISCAS). He is a Fellow of the IEEE. Room: Redwood Room (Portola), Monterey Conference Center, 1 Portola Plaza Monterey, CA 93940 , Monterey, California, United States, 93940

Power converters designed for higher frequency operation than conventional designs can be smaller and lighter. However, to gain these benefits and maintain high reliability the converters also need to be more efficient, as smaller converters offer less surface area for heat removal. The development of efficient, small and light weight power converters can benefit from converter architectures that leverage novel topologies and control techniques. Using examples from my group’s research on compact and high-efficiency power converters, this talk will highlight the opportunities and challenges at the frontiers of high-frequency power electronics. One focus of the talk will be on new power electronic converter architectures that target high power densities and high efficiencies for wide operating range applications. Another focus of the talk will be on emerging power electronic enabled applications, including wireless power transfer systems suitable for powering in-motion mobile platforms and radio-frequency power amplifiers for compact particle accelerators. The talk will also identify directions for future work in the area of high performance power electronic converters Speaker(s): Khurram Afridi, Room: Silicon Valley Conference Room, Bldg: Plug and Play Tech Center, 440 North Wolfe Road, Sunnyvale, California, United States, 94085

Bimonthly meeting for the Silicon Valley, San Francisco and Oakland/East Bay Chapter of the IEEE Robotics and Automation Society. This meeting is for everyone interested in being involved in the chapter, organizing events, coordinating with other robotics speaker series and conferences or contributing news and events for RAS members' benefit. This is a great meeting to attend IF: You want to know what's happening in robotics in the Bay Area, OR, you want to reinvigorate the local RAS community (largest in the world!) We'll be planning for our events or events we're participating in: The Future of Robotics at The Commonwealth Club in May, the inaugural IEEE Conference on AI in June and the IEEE Industry Hub's Autonomous Vehicle event in autumn, as well as planning for more debates and technical symposiums. Agenda: Chapter Reports: President Treasurer Partnerships: tbd Event Planning: The Future of Robotics at The Commonwealth Club in San Francisco on June 27th at 3pm (https://cai.ieee.org/2023/) in Santa Clara on June 5-6 IEEE Industry Hub Autonomous Vehicle Symposium in Q3 tbc Virtual: https://events.vtools.ieee.org/m/355836

Register: https://www.eventbrite.com/e/end-to-end-learned-image-and-video-compression-tickets-630476250437?aff=ebdssbdestsearch Event information: https://site.ieee.org/scv-cas/ Speaker: Dr. Wen-Hsiao Peng Abstract: The DCT-based image and video coding technique was adopted by the international standards (ISO JPEG, ITU H.261/264/265/266, ISO MPEG-2/4/H, and many others) for nearly 30 years. Although researchers are still trying to improve its efficiency by fine-tuning its components and parameters, the basic structure has not changed in the past two decades. The arrival of deep learning recently spurred a new wave of developments in end-to-end learned image and video compression. This fast growing research area has attracted more than 100+ publications in the literature, with the state-of-the-art end-to-end learned image compression showing comparable compression performance to H.266/VVC intra coding in terms of PSNR- RGB and much better MS-SSIM results. End-to-end learned video coding is also catching up quickly. Some preliminary studies report comparable PSNR-RGB results to H.265/HEVC or even H.266/VVC under the low-delay setting. These interesting results have led to intensive activities in international standards organizations (e.g. JPEG AI) and various Challenges (e.g. CLIC at CVPR and Grand Challenge on Neural Network-based Video Coding at ISCAS). In this talk, I shall overview (1) the recent advances of this area, (2) review some notable end-to-end learned image/video compression systems, and (3) address recent efforts in creating hardware- friendly, low-complexity models, and (4) look at the application of end-to-end learned image/video compression to computer vision tasks, an emerging research area also known as visual coding for machine perception. The talk will be concluded with potential research opportunities and an outlook for learned compression systems. Hosts: Professor Nam Ling, Wilmot J. Nicholson Family Chair Professor and Chair, Dept of Computer Science & Engineering, Santa Clara University, USA Dr. Nandish Mehta, Chair, IEEE Circuits and Systems Society Santa Clara Valley Chapter, USA Speaker's bio: Dr. Wen-Hsiao Peng (M’09-SM’13) received his Ph.D. degree from National Chiao Tung University (NCTU), Taiwan, in 2005. He was with the Intel Microprocessor Research Laboratory, USA, from 2000 to 2001, where he was involved in the development of ISO/IEC MPEG-4 fine granularity scalability. Since 2003, he has actively participated in the ISO/IEC and ITU-T video coding standardization process and contributed to the development of SVC, HEVC, and SCC standards. He was a Visiting Scholar with the IBM Thomas J. Watson Research Center, USA, from 2015 to 2016. He is currently a Professor with the Computer Science Department, National Yang Ming Chiao Tung University, Taiwan. He has authored over 75+ journal/conference papers and over 60 ISO/IEC and ITU-T standards contributions. His research interests include learning-based video/image compression, deep/machine learning, multimedia analytics, and computer vision. Dr. Peng was Chair of the IEEE Circuits and Systems Society (CASS) Visual Signal Processing (VSPC) Technical Committee from 2020-2022. He was Technical Program Co-chair for 2021 IEEE VCIP, 2011 IEEE VCIP, 2017 IEEE ISPACS, and 2018 APSIPA ASC; Publication Chair for 2019 IEEE ICIP; Area Chair/Session Chair/Tutorial Speaker/Special Session Organizer for IEEE ICME, IEEE VCIP, and APSIPA ASC; and Track/Session Chair and Review Committee Member for IEEE ISCAS. He served as AEiC for Digital Communications for IEEE JETCAS and Associate Editor for IEEE TCSVT. He was Lead Guest Editor, Guest Editor and SEB Member for IEEE JETCAS, and Guest Editor for IEEE TCAS-II. He was Distinguished Lecturer of APSIPA and the IEEE CASS. This event can be attended in-person or via the following zoom link: Join Zoom Meeting https://scu.zoom.us/j/98160784214?pwd=TXJZeE9ERGt1RW9lRnhPSGZrTFQwdz09 Meeting ID: 981 6078 4214 Password: 193987 Join by phone: +1 (669) 900-6833 Meeting ID: 981 6078 4214 One tap mobile +16699006833,,98160784214# Room: 1301, Bldg: Sobrato Campus for Discovery and Innovation, SCU, Santa Clara, CA 95053, Santa Clara, California, United States, 95053