This free course presents an overview of the physics of failures in electronics packaging. The course discusses key fundamental concepts of reliability physics associated with various stress conditions, including thermal degradation, thermo-mechanical stress, dynamic and vibrational loading, moisture and humidity, as well as electrical current stress. Failure mechanisms studied include chip-package interactions, micro-bump reliability, electromigration performance, inter-layer dielectric (ILD) damage under bumps and Cu pillars, solder joint reliability, drop and vibrational damage, interfacial delamination, and the impact of moisture and environmental humidity. Acceleration factor models for different failure mechanisms are introduced. Stress analysis methods using finite element analysis (FEA) with specific applications to packaging are described. Speaker(s): Xuejun Fan, Virtual: https://events.vtools.ieee.org/m/328502

Free Registration: https://www.eventbrite.com/e/quantifying-configuration-health-of-software-systems-tickets-428096777987 Synopsis: Misconfigurations have been Achilles heel in complex software systems and are often responsible for the downtimes and enablers of the cyber-attacks. With the recent rise of the devOps paradigm, configuration changes have become even more frequent, sometimes, multiple times a day, thereby underscoring the importance of correct configuration. In this talk, the speaker will discuss the notion of configuration health index to provide an assessment of how well the system is configured with respect to various objectives and how it can be quantified based on a combination of domain knowledge and available data. Prof. Kant will also discuss the challenges in extracting and quantifying the domain knowledge and the selection of tests for diagnosing configuration problems. Speaker(s): Dr Kant, Vishnu S. Pendyala Virtual: https://events.vtools.ieee.org/m/325452

FREE Event, In-person and online; Learn RF design solutions that reveal how to develop passive miniaturized IoT nodes that operate robustly in harsh application environments. Speaker(s): Professor Jasmin Grosinger, Room: First floor training room, Globalfoundries and online, 2600 Great America Way, Santa Clara, California, United States, 95054

Data communications between Earth and devices on spacecraft, such as satellites, have traditionally been carried out through dedicated links. Shared links using Internet Protocol-based communication offers a number of advantages over dedicated links. The movement of devices on spacecrafts however gives rise to mobility management issues. This talk will discuss various mobility management solutions for extending the Internet connection to devices on the spacecraft. The talk will provide an overview of the network layer based solution being developed by the Internet Engineering Task Force and compare it with the transport layer-based solution that has been developed at the University of Oklahoma in conjunction with the National Aeronautics and Space Administration. Network in motion is an extension of the host mobility protocols for managing the mobility of networks which are in motion, such as those in airplanes and trains. The application of networks in motion will be illustrated for terrestrial and space environments. Speaker(s): Mohammed Atiquzzaman, Ph.D, Virtual: https://events.vtools.ieee.org/m/328500

Assistive robotic manipulators have the potential to support individuals with impairments to regain some of their independence in performing Activities of Daily Living. For individuals with impairments, interaction with assistive robotic manipulators is a very challenging task. In this talk, I will present several interactive approaches to enable people with impairments to collaborate with assistive robots. The first approach focuses on enabling people with tetraplegia to teach the robot how to assist them with drinking. The second approach focuses on an autonomous multi-sensory robotic system, which assists with straw-less drinking. The third approach focuses on robots can learn from human speech. Experimental results for the three approaches will be presented. Furthermore, I will conclude the talk with a brief discussion of future research challenges. Speaker(s): Dr. Maria Kyrarini, Agenda: 6:30 PM Introduction and RAS Chapter News 6:40 PM Presentation 7:30 PM Q&A 8:00 PM End Bldg: SCDI 3301, Santa Clara University, 500 El Camino Real, Santa Clara, California, United States, Virtual: https://events.vtools.ieee.org/m/329376

Join the Buffalo Computer Society Chapter and Santa Clara Valley Computer Society Chapter in welcoming Distinguished Visitor, Yuhong Liu, on Thursday November 17, at 6 PM ET, when she gives a virtual presentation which completes our Blockchain Technical Series for 2022. Topic Summary: A blockchain consists of a list of blocks that are linked based on cryptography hash and maintained by distributed network nodes, so that the information recorded in these blocks is non-repudiated. After its first conceptualization by Nakamoto in 2008, blockchain has attracted broad attention and been considered as a promising solution to establish a decentralized architecture with security. In this talk, we will discuss some key characteristics of blockchain and a few promising applications of blockchain that can facilitate security and trust among multiple parties. Some examples include applying blockchain to secure software updates for resource-constrained IoT networks; designing a secure and efficient multi-signature scheme to facilitate multi-party approval process on Fabric, an enterprise blockchain platform; and facilitating fair trading of digital-goods via a blockchain based proxy re-encryption scheme. Speaker: Yuhong Liu Santa Clara University Photo courtesy (https://blockchain.ieee.org/). Speaker(s): Yuhong Liu, Virtual: https://events.vtools.ieee.org/m/327962

This presentation will discuss the main challenges in the physical implementation, design, hierarchical modelling and simulation of the scalable qubit array and of the cryogenic control and readout electronics for future Quantum Processors with millions of qubits manufactured in commercial FDSOI and FinFET foundry technologies. Impact of process manufacturing rules restrictions and process variation on qubit design and modelling, circuit heat dissipation and layout miniaturization to fit the qubit array pitch, qubit-to-qubit crosstalk, and the need for atomistic, classical, and behavioural qubit simulation and modelling will be covered in detail. Co-sponsored by: Circuits and Systems Society - CASS-SCV Speaker(s): Dr. Sorin P. Voinigescu, Agenda: This presentation will discuss the main challenges in the physical implementation, design, hierarchical modelling and simulation of the scalable qubit array and of the cryogenic control and readout electronics for future Quantum Processors with millions of qubits manufactured in commercial FDSOI and FinFET foundry technologies. Impact of process manufacturing rules restrictions and process variation on qubit design and modelling, circuit heat dissipation and layout miniaturization to fit the qubit array pitch, qubit-to-qubit crosstalk, and the need for atomistic, classical, and behavioural qubit simulation and modelling will be covered in detail. Virtual: https://events.vtools.ieee.org/m/328892

This webinar will discuss how people facing intermittent and unreliable grid conditions in tough environments can use solar generators to power critical infrastructure. Speaker: Paul Shmotolokha is an IEEE member in Seattle. He presented and exhibited at GHTC 2022. Paul is the CEO of (https://www.newuseenergy.com/) (NUE). NUE's solar power systems are being deployed in (https://www.uschamber.com/small-business/how-one-small-business-helped-ukraine-power-up-in-a-time-of-need). REGISTER NOW @ https://www.newuseenergy.com/webinar-solar-generators-in-ukraine-a-case-study-on-resilience/ Co-sponsored by: Paul Shmotolokha, CEO of New Use Energy (NUE) Virtual: https://events.vtools.ieee.org/m/334285

Abstract: First published in 1998, Roger Grace Associates has created and conducted the MEMS Industry Commercialization Report Card (Report Card) Study which has annually monitored the “health” of the worldwide MEMS industry vis-à-vis 14 subjects (a.k.a. critical success factors) and supplemented by verbatims from the respondents. The Report Card market study uses the “Delphi Method” which is based on the inputs of a limited number of highly experienced and acknowledged worldwide MEMS industry experts. The 2021 Report Card overall grade was a C+ which declined from the previous five years grade of B- and with virtually all of the 14 subjects receiving decreasing grades. The hundreds of verbatim responses received along with the letter grades emphatically showed the culprit of the grade decreases to be inextricably linked to the results of the effects of Covid. This was especially true in the subject of “Established Infrastructure” where the grade decreased from B+ to B- and was primarily due to supply chain disruptions. Recommendations of the study include actionable strategies to mitigate and overcome the highly expected resulting negative effects to the MEMS commercialization process due to expected continuance of Covid into 2022. Speaker(s): Mr. Roger H. Grace, Agenda: 6:30 – 6:45 PM Zoom Registration & Networking 6:50 – 7:00 PM Announcements & Polling 7:00 – 7:45 PM Invited Talk 7:45 – 8:00 PM Questions & Answers Virtual: https://events.vtools.ieee.org/m/332120