This meeting includes two talks by top industry technologists. The first talk will provide an introduction to blockchain and Distributed Ledger Technology (DLT), with an overview of blockchain applications in startups, enterprises, and government services. It will highlight various novel emerging use cases such as Decentralized Finance (DeFi), Non-Fungible Tokens (NFTs), Decentralized Autonomous Organizations (DAOs), and Play-to-Earn (P2E) games. The second talk will expand on metaverses and the promised profound impact on our daily work, play, and life, across all industries and sectors, reshaping the economy and society for all humankind. Speaker(s): Ramesh Ramadoss, Yu Yuan Bldg: ActionSpot, 453 W San Carlos St, San Jose, California, United States, 95110

This month, Prof. (https://www.linkedin.com/in/willy-shih-765816/) of Harvard Business School will share his insider’s perspective on Kodak’s journey in digital photography, based on his experience as senior vice president at Eastman Kodak Company from 1997 to 2005, where he was president of Digital & Applied Imaging (Consumer Digital), president of Display & Components, and head of Corporate Intellectual Property Strategy. For more background information, please review this article: “(https://r6.ieee.org/scv-tems/wp-content/uploads/sites/90/2022/08/The-Real-Lessons-From-Kodaks-Decline_Willy-Shih.pdf)” by Willy Shih (MIT Sloan Management Review, Summer 2016). And review this (https://www.youtube.com/watch?v=s9SotpE7nes): “The Kodak Moment: Why it Didn’t Last” featuring Willy Shih and Allen Webb (recorded at the Road to Reinvention: Leadership in the Digital Age conference on March 23, 2017). In this on-line meeting, we will watch excerpts of the (https://www.youtube.com/watch?v=s9SotpE7nes) “The Kodak Moment: Why it Didn’t Last”, and then we will interact with Willy Shih in a Q&A session. Please send questions for Willy to (mailto:[email protected]) prior to the meeting. For more details: See (https://r6.ieee.org/scv-tems/kodaks-journey-in-digital-photography-an-insiders-perspectives/) Facilitator: The facilitator of this meeting will be (https://www.linkedin.com/in/edmund-cheng-93657315/), Chair of TEMS Silicon Valley Chapter. Ed started his career as a chip designer at Intel, and then moved into the computer-aided design and electronic design automation software field, where he founded several start-up companies. Over 40 years, he has held various engineering, marketing and executive positions in several large and medium-size Silicon Valley companies. He has served on the board of the Electronic Design Automation Consortium. Ed is a Life Senior Member of the IEEE. Speaker(s): Prof. Willy Shih, Agenda: 7:00 PM - 8:00 PM (New York Time): Introduction and Chat/Q&A Virtual: https://events.vtools.ieee.org/m/321143

Abstract: Wi-Fi sensing is the use of Wi-Fi to enable everyday electronic devices to acquire information and become aware of their surroundings. Interest and research in the area has grown steadily over the past two decades, and Wi-Fi sensing is now used in a wide range of applications, including user presence detection, space occupancy analytics, and home security systems. Due to the significant and growing market interest in the area, a new IEEE 802.11 Task Group (IEEE 802.11bf) was recently formed to develop an amendment to the 802.11 standard that will enhance its ability to support Wi-Fi sensing applications. This talk will begin with an introduction to wireless sensing systems and to Wi-Fi sensing. We will then discuss the main definitions and features of the IEEE 802.11bf draft standard. Bio: Dr. Claudio da Silva is a Wireless Systems Engineer in the Reality Labs group of Meta Platforms (formerly Facebook) and is responsible for the standardization of wireless connectivity technologies and for advancing Meta Platforms’ spectrum policy strategy. He also serves as the Technical Editor of IEEE 802.11bf (WLAN Sensing), a task group currently developing an IEEE 802.11 amendment that enhances Wi-Fi sensing technology, and as an IEEE Communications Society Distinguished Lecturer for the 2022-2023 term.Before joining Meta Platforms, Dr. da Silva was with the Next Generation & Standards group of Intel Corporation, where he was responsible for driving technology and product innovation by leading and contributing to various standardization, certification, and regulatory activities. During his tenure at Intel, he served as the Technical Editor of Wi-Fi Alliance's 60 GHz TTG from 2019 to 2021. Before Intel, he worked on cellular modem implementation and applied research at Samsung Mobile Solutions Lab. The first years of his professional career were spent at Virginia Tech, where he was an Assistant Professor in the Bradley Department of Electrical and Computer Engineering. Dr. da Silva received the B.S. and M.S. degrees from the State University of Campinas, Brazil, in 1999 and 2001, respectively, and the Ph.D. degree from the University of California, San Diego in 2005, all in electrical engineering. He was an Editor for Modulation and Signal Design for the IEEE Transactions on Communications from 2012 to 2015, and is currently serving as a Guest Editor for the IEEE Communications Magazine. He has served on the technical program committee of numerous IEEE conferences in the communications area. He is a Senior Member of the IEEE. Co-sponsored by: Pradeep Kumar Virtual: https://events.vtools.ieee.org/m/322171

Safety of Autonomous Vehicles Abstract: The IEEE P2851 standard defines a dependability lifecycle of products with focus on interoperable activities related to functional safety and its interactions with reliability, cybersecurity, SOTIF (Safety of the intended functionality) and real time. The standard also describes methods, description languages, data models, and databases that have been identified as necessary or critical, to enable the exchange/interoperability of data across all steps of the lifecycle encompassing activities executed at IP, SoC, system and item levels, in a technology independent way across application domains such as automotive, industrial, medical and avionics safety critical systems. The speaker, who is the chair of the working group on the standard will provide more insights into the topic. Co-sponsored by: SCV/OEB/SF Jt section Chapter VT06 Speaker(s): Jyotika Athavale, Room: Room 1302 and 1308, Bldg: Room 1302 and 1308 in Sobrato Campus for Discovery and Innovation (SCDI), 500 El Camino Real, Santa Clara, California, United States, 95053, Virtual: https://events.vtools.ieee.org/m/323283

Abstract: Silicon Valley is commonly acknowledged as the tech capital of the world. How did Silicon Valley come into being, and what can we learn for our Columbus hub? The story goes back to local Hams trying to break RCA's tube patents, Stanford "angel" investors, the sinking of the Titanic, WW II and radar, and the SF Bay Area infrastructure that developed – these factors pretty much determined that the semiconductor and IC industries would be located in the Santa Clara Valley, and that the Valley would remain the world’s innovation center as new technologies emerge, and be the model for innovation worldwide. This talk will give an exciting and colorful history of development and innovation that began in Palo Alto in 1909. You'll meet some of the colorful characters – Cyril Elwell, Lee De Forest, Bill Eitel, Charles Litton, Fred Terman, David Packard, Bill Hewlett, Bill Shockley and others – who came to define our worldwide electronics industries through their inventions and process development. You'll understand some of the novel management approaches that have become the hallmarks of its tech startups. Many of these attributes can be found in other technology hubs; however, the SF Bay Area has five generations of experience, as well as a "critical mass" of talent, making it difficult for others to catch up. In this talk, the key attributes will be illustrated and analyzed, for consideration by other tech hubs, and for entrepreneurs interested in creating their own start-ups or understanding them. Co-sponsored by: Silicon Valley/SF Bay Area Electronics Packaging Chapter Room: 260, Bldg: Dreese, 2015 Neil Avenue, Columbus, Ohio, United States, 43210, Virtual: https://events.vtools.ieee.org/m/320063

With a small diverse team of engineers, Magna-Power Electronics can offer over 160,000 different configurations of programmable power supplies and electronic loads, spanning current levels up to 10,000 Adc, voltage levels up to 10,000 Vdc, and power levels up to 3,000 kW. While Magna-Power has nearly fully in-sourced manufacturing operations under one roof, the strategies presented can also be implemented through close manufacturing partners by understanding the constraints imposed by various production processes and machinery. The presentation shares an overview of some of Magna-Power's prototyping techniques, design automation software, team management tools that were developed iteratively over its 40-year history. Topics include printed circuit board (PCB) design and vendor selection, production and design controls, and electro-mechanical integration. New content, beyond the original article, now includes recent progress in programmatically defined assembly models. Speaker(s): Dr. Grant Pitel, Virtual: https://events.vtools.ieee.org/m/317538

Bioelectronic implants rely on wireless power and data telemetry for detecting physiological signals and communicating them to an external reader or an implanted module for close-loop therapeutic solutions. Sensor fusion and wireless connectivity with external electronic readers through simplified circuit topologies, advanced telemetry components for better signal sensitivity at low power, and 3D package integration for miniaturization and reliability are the main barriers for wireless neural recording. On the other hand, power telemetry and capacitor integration, high-density electrode arrays with high charge-injection and low impedance are critical for neurostimulation. This talk will highlight advances in the component and embedding technologies to realize performance, long-term stability and reliability while meeting the critical system scaling trends in bioelectronic implants. Speaker(s): PM Raj, Virtual: https://events.vtools.ieee.org/m/322573

Abstract: Machines are a natural progression of human development. It is often by creating machines, that man is able to accomplish some of the most extraordinary things. The physical world around us is a manifestation of our dreams and desires and machines have always fulfilled the role of making them a reality. In my portraits of technology, I treat each machine as an individual. I consider my subjects to be noble and beautiful. They are manifestations of their parsimonious engineering: form following function. However, I do not look at a machine only in terms of the task for which it was made, but also consider its role as an actor on a broader technological stage. In this framing, all machines are important, they are all related and their most profound impact on society is collective. As a portrait painter, I aspire to reveal the truth. My task is to capture the essence of the subject, not the superficial. In this presentation I will explore the essence of robot technology and discuss how people and machines can work together as authentic beings, to create the future. Speaker(s): Agnieszka Pilat, Agenda: 12:00 PM Introduction (Tom Coughlin) 12:10 PM Talk by Agnieszka Pilat 12:55 PM Questions 1:30 PM Finish Virtual: https://events.vtools.ieee.org/m/322410

AI is notoriously resource-heavy, requiring significant compute, memory, and power, which makes it very difficult to deploy in highly constrained environments such as IoT and consumer endpoints. Practical deployment of sophisticated AI requires solving for all three constraints. This talk covers recent algorithmic, architectural, and technological innovations that are converging to enable truly useful AI everywhere. ABOUT SPEAKER Carlos Morales - VP of Aritificial Intelligence Virtual: https://events.vtools.ieee.org/m/319486

Given that one can download finished images from JPL, why do amateur astronomers build complex imaging systems? It is very fulfilling to process color images of galaxies and nebulae even in Santa Clara Valley skies. Speaker(s): Francesco Meschia, Agenda: Here is a preliminary outline of the topics that will be covered: Brief introduction to Astronomy - viewing the galaxy from a place on the earth stars appear to rotate the equatorial coordinate system to compensate for this The birth of astrophysics spectral signatures spectral lines - what are they historical observations modern explanations implications of which places might have earthlike elements that are needed for life. Stellar Evolution Why narrowband imaging instead of RGB? narrowband filters vs RGB What kinds of imaging sensors to use Where do you need to go to see very distant deep space objects? Cutting through city lights with a combination of narrowband filters, notch filters for sodium, and averaging hundreds of images over several hours. Selectivity, Contrast, and Detail The entire concept is the same as Signal to Noise ratio in communications How to guide the telescope to track it precisely over several hours How to capture the image data filters and exposures Brief Introduction to image processing Virtual: https://events.vtools.ieee.org/m/322506

The steady increase in internet data traffic and 5G adoption is driving significant increases in interconnect bandwidth, channel speed and channel density, especially across hyperscale data centers and cloud service providers. This, in turn, is driving advances in ASIC and optical interconnect technologies, resulting in doubling of aggregate bandwidth per device roughly every two years. Silicon photonics-based optical interconnects are increasingly playing a critical role in enabling each next generation of higher bandwidth, higher density interconnects while enabling power and cost efficiency with small form factors. As the industry is developing 1.6Tb/s and beyond optical pluggable devices, significant challenges need to be overcome, especially relating to electrical and optical IC integration, large channel count optical fiber coupling, high-power laser integration, as well as managing thermal dissipation and overall cost. This talk will focus on some of these challenges associated with building next-generation high-bandwidth optical devices, including co-packaging optics with ASICs, as well as discussing possible paths for mitigating some of these challenges using innovations in advanced packaging processes and materials. Optimizing advanced packaging architectures for optical devices can help scale the next generation of optical interconnects while reducing cost per bit and power per bit metrics that are critical for adoption of these devices in volume across the hyperscale networking ecosystem. Speaker(s): Sandeep Razdan, Virtual: https://events.vtools.ieee.org/m/325012