IEEE EMC Chapter is sponsoring the event but no monetary gain is gained or funded by the chapter. Location: Cadence Design Systems, Bldg 5, 2655 Seely Ave., San Jose, CA Registration link will bring you to the options of the Paid workshop but also to the Free Exhibit/TC events 2025 Silicon Valley Area Workshop on EMC Design of High-Speed Systems workshop with Free Exhibit and Free IEEE EMC Technical Committee 10 on Signal and Power Integrity meeting. For more details on the specific agenda including abstract and speakers' bio, go to https://drive.google.com/file/d/1oHHiBJtyebP1JgqafZF65pR9A0y145uA/view?usp=sharing Agenda: Agenda Table-top Vendor Exhibit in Lobby from 10:20 AM – 2:25 PM (FREE) Vendors are still signing up and already include Rohde and Schwarz, PCB Automation, Nexperia, Cadence Design Systems, PacketMicro, and Clear Signal Solutions 8:30 AM Light breakfast and registration 9:00 AM Welcome remarks and introductions Electromagnetic Compatibility 9:10 AM EMC Applications of 3D Printable Materials Dr. Victor Khilkevich, Missouri Univ. of Sci. and Tech. 9:45 AM Model-based EMC Analysis and Diagnosis towards Design-for-EMC Dr. Dipanjan Gope, SimYog Technology and Indian Institute of Science 10:20 AM Break and vendor table-top show (FREE) 10:45 AM Modeling ESD Protection for High-Speed Applications Dr. Daryl Beetner, Missouri Univ. of Sci. and Tech. 11:20 AM Round Table Discussion - Future directions and challenges in EMC 11:50 AM Lunch 12:50 PM Challenges and Opportunity for Data Center Generation and Distributions Dr. Zhiping Yang, PCB Automation 1:25 PM Machine Learning-Assisted Power Delivery Network Design Dr. Chulsoon Hwang, Missouri Univ. of Sci. and Tech. 2:00 PM Break and vendor table-top show (FREE) 2:25 PM Challenges with next generation interconnect solutions Stephen Scearce, Amphenol 3:00 PM Round Table Discussion - Future directions and challenges in SIPI for High- Speed Systems 3:30 PM Happy Hour sponsored by Cadence Design Systems (FREE) IEEE EMC Mini Seminar-Paper Series Sponsored by IEEE EMC Society Technical Committee 10 on Signal and Power Integrity (FREE) 3:30PM~4PM: Machine Learn fro EMC/SI/PI-Blackbox, Physics Recovery and Decision Making. by Lijun Jiang. Professor of MST 4PM~4:30PM: CVRM with Feedback for Platform PDN PI Design. by Kinger Cai of Arm 4:30PM~5PM: Developing an open S-parameter visualizer with assistance from AI. by Giorgi Maghlakelidze of nVidia. 5PM~5:30PM: Machine learning model for a trace referenced to meshed ground planes. by Xiaoyan Xiong of Cadence. 4:00 PM End of program Bldg: 5, 2655 Seely Ave., San Jose, California, United States, 95134

Abstract: Semiconductor Tool maintenance is a complex task due to process complexity, process integration challenges, and customer requirements. Historically, maintenance strategies have been reactive due to these complexities. Applied Materials has been focused on moving from a generally reactive method of reacting to tool issues to prescriptive methods of maintaining process equipment. This migration is through a combination of advanced anomaly detection techniques which provide low false positives, methods of translating fail modes into Reactive Useful Life estimates and ultimately prescribing solutions to issues in advance using Generative Artificial Intelligence. This discussion will cover some of the challenges and solutions to this framework. Speaker(s): Mike, Agenda: 6:00 - 6:30 - Networking and light dinner (for in person attendees) 6:30 - 7:30 - Talk and Q & A 7:30 - 8:00 - Wrap up and Networking Room: SCDI 4010, Bldg: Sobrato Campus for Discovery and Innovation, Santa Clara University, 500 El Camino Real, Santa Clara, California, United States, 95053, Virtual: https://events.vtools.ieee.org/m/506966