Extremely Power-Dense Solar Panels for the Extremes of Space https://www.eventbrite.com/e/1539115508919?aff=oddtdtcreator Abstract: Ultrathin photovoltaic devices based on two-dimensional (2D) transition metal dichalcogenides (TMDs) have emerged as promising candidates for next-generation solar power in weight- and volume-constrained environments. In this talk, I will present flexible TMD solar cells that integrate semitransparent contacts and engineered interfacial layers to enhance charge collection, optical absorption, and environmental stability. Compared to traditional thin-film and III-V technologies, these 2D devices offer superior specific power, mechanical flexibility, and potential resilience under extreme operating conditions. I will also discuss pathways for transitioning TMD photovoltaics from laboratory demonstrations to real-world deployment in aerospace, mobile, and off-grid systems. This includes recent efforts through Arinna, a spin-out focused on advancing 2D solar technologies for mission-ready applications across space, mobility, and distributed energy sectors. Read More: (https://www.arinna.xyz/) (https://www.nature.com/articles/s41467-021-27195-7) (https://www.cell.com/device/fulltext/S2666-9986(25)00036-5) [] Bio: Dr. Koosha Nassiri Nazif is a leading expert in high-specific-power photovoltaics, with over a decade of experience in thin films and two-dimensional (2D) materials. He earned his Ph.D. in Electrical Engineering from Stanford University, where he led foundational research on flexible transition metal dichalcogenide (TMD) solar cells, resulting in multiple publications and patents. His postdoctoral work at Stanford focused on scalable manufacturing and radiation resilience of these materials. He is now co-founder and CEO of Arinna, where he is building on this foundation to commercialize breakthrough solar technologies for advanced power and mobility systems. In-Person Meeting Thursday, August 28, 2025 11:30 AM: Networking, Pizza & Drinks Noon -- 1 pm: Seminar -------- Please register on Eventbrite before 9:30 AM on Thursday August 28 Co-sponsored by: SCV/SF Jt. Section Chapter, ED15 Joint Chapter Agenda: 11:30 AM: Networking, Pizza & Drinks Noon -- 1 pm: Seminar Break & Networking 1 pm -- 1:30 pm Optional Lab Tour 1:30 pm - 2:00 pm Covalent Metrology, 923 Thompson Pl, Sunnyvale, California, United States, 94085

[]Advances in smart response-based processes have significantly improved wire bond reliability and further strengthened the use of the technology in high-volume manufacturing (HVM). Wire bonding technology remains a staple choice in vast majority of semiconductor packages due to its low cost, increased flexibility, and high yield rate. A traditional wire bond process consists of a wire loop with a ball bond on die and a wedge bond on substrate. Vertical Wires are an emerging interconnect solution formed using a unique process on the same ball bond equipment. Vertical Wires can be used as an alternative to the traditional wire bond processes or in conjunction with the traditional wire loops in SiPs. Although initially developed for interconnection applications, Vertical Wire technology was introduced in HVM for EMI shielding in SiP and RF packages. This presentation will detail new advances in Vertical Wire Technology to further reduce wire pitch, increase I/O density, and reduce package footprint. An overview of application range, capability and design rules for the technology will be discussed. Speaker(s): Basil Milton, Virtual: https://events.vtools.ieee.org/m/495344