Ongoing

Exciting Scholarship Opportunity: AI Infra Summit 2025 (Expo Pass Only)!

Santa Clara 6000 California City Blvd, California City

IEEE Women in Engineering (WIE) Santa Clara Valley is thrilled to announce complimentary tickets to the upcoming AI Infra Summit 2025 (Expo Pass Only) through our scholarship program. What We're Offering? Complimentary tickets (Expo Pass Only) to one of the year's most impactful AI infrastructure conferences, Networking opportunities with 2,500+ industry professionals and 200+ expert speakers, Access to cutting-edge sessions on AI hardware, edge computing, data centers, and enterprise AI, Professional development in the fastest-growing sector of technology Event Details (https://enotice.mmsend.com/link.cfm?r=w88U22rr5U0C68kcv3Ff8g~~&pe=TDbpWJgHzNy92pwnGpn6DVJULynuaUwmMx2aA55v2Az19Zz5QyFgYXTRHfaa2MG4PuWpQdJmxs-QyO7lMh07yQ~~&t=sokOKAWdahFLgZcuJjJI9g~~) Date: September 9-11, 2025 Location: Santa Clara Convention Center Focus: Full-stack AI infrastructure, hardware systems, edge AI, and enterprise solutions Who Can Apply? - Students pursuing STEM degrees (undergraduate & graduate) - IEEE members (WIE members preferred) looking to advance their careers in AI infrastructure - Career professionals passionate about AI technology and infrastructure Why This Matters? The AI infrastructure market is experiencing unprecedented growth, with organizations projected to invest over $1 trillion in the next five years. This summit provides unparalleled access to industry leaders, emerging technologies, and career-defining connections. Ready to Apply? Applications are now OPEN! Complete our scholarship application form and tell us how this opportunity aligns with your career goals and passion for AI infrastructure. Apply Now: (https://enotice.mmsend.com/link.cfm?r=w88U22rr5U0C68kcv3Ff8g~~&pe=QdWvfYmw6O5PGs883UUgf-Cv5NHb2pZFt-3Z_lZ23pp8zEmDpi0ZBHP5AncOfmrWv5jWfmNcy3akQK9dlQQuUw~~&t=sokOKAWdahFLgZcuJjJI9g~~) Application Deadline: July 10th, 2025 Scholarship Recipients Announced: July 20th, 2025 Contact IEEE WIE SCV team at [email protected] Co-sponsored by: YP60369 Santa Clara, California, United States

Thriving in an AI & Emerging Tech World: Opportunities and Challenges for Women Engineers

Virtual: https://events.vtools.ieee.org/m/486034

In celebration of IEEE Women in Engineering (WIE) Day, the IEEE WIE Affinity Groups from Oregon, Hawaii, Utah, Spokane, Santa Clara Valley, San Diego, Richland, Phoenix, and Foothill of IEEE Region 6 and IEEE WIE AG SB DU of IEEE R10 proudly invite you to an empowering and timely panel discussion: “Thriving in an AI & Emerging Tech World: Opportunities and Challenges for Women Engineers” Join us for an inspiring conversation exploring how AI, automation, and digital transformation are reshaping the engineering landscape and redefining the future of work. This dynamic event will bring together globally recognized engineers, researchers, and industry leaders who will share: - The evolving role of engineers in an AI-driven world - Opportunities and challenges uniquely faced by women in emerging technologies - Strategies for upskilling, career advancement, and impactful leadership in a fast-paced tech environment Speaker(s): Prof. Saifur Rahman, Dr. Winnie Ye , Celia Shahnaz, John D. McDonald, P.E, Jill Gostin, David Koehler Virtual: https://events.vtools.ieee.org/m/486034

Machine Learning-assisted Physics-based Simulation & Control of Flexible Structures, Sensors and Soft Robots

Virtual: https://events.vtools.ieee.org/m/489214

Advances in flexible, deployable, and deformable structures and sensors require efficient simulation tools that capture nonlinear geometry and material behavior. We propose a machine learning (ML) approach using neural networks (NN) to simplify simulations, enabling the creation of digital twins and facilitating sim-to-real transfer in structural mechanics. This talk presents a case study using neural networks (NN) to create a reduced-order model for the dynamic simulation of a slinky, a popular children’s toy made of a pre-compressed helical spring that can stretch and deform. Instead of simulating the entire 3D structure of the slinky, we use a reduced representation based on the deformation of its helix axis, significantly reducing the degrees of freedom (DOFs). The mechanics of this simplified representation are captured using a neural ordinary differential equation (neural ODE), trained with data from high-resolution 3D simulations. This approach enables faster dynamic simulations while maintaining physical accuracy, and thanks to the physics-based nature of our model trained with neural ODEs, it is highly generalizable—adapting to changes in boundary conditions or external forces without the need for retraining. The second part of the talk introduces DiSMech, an open-source software platform for fast simulations of flexible structures, which was used in the slinky study. DiSMech aims to enable researchers at all levels to explore the mechanics of soft robots and flexible structures/sensors, driving innovation in robotics research and education. Built on a discrete differential geometry (DDG) approach, it offers a practical alternative to computationally intensive conventional simulation tools. Speaker(s): Dr. M. Khalid Jawed Agenda: 6:50 - 7 PM: Registration 7-8 PM: Talk and Q&A Virtual: https://events.vtools.ieee.org/m/489214