[]We thank you for your interest. BUSS is fully subscribed, and can accept no more registrations. Visit our website (attend.ieee.org/buss) to subscribe to our ListServ Dlist, to hear about future Build-Up Substrate events. We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced with 3D heterogeneous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based in Asia, leaving a desert in the US. Volume build-up substrates used by major IDMs are manufactured in Asian countries including Taiwan, Japan and China. However, there are multiple activities starting up in the US, and this is why a gathering of the US players is important. This symposium is geared for all those involved in the supply chain of build-up substrates in the US, as well as users. This Symposium is an opportunity for all build-up substrate players to meet, network and cohesively work with funding agencies who will be invited to this symposium to focus on onshoring build-up substrate production and utilization. Agenda: Sessions: — Substrate Manufacturing and Onshoring — Materials for Substrates — Emerging Substrate Technologies — Panel Equipment and Technologies for Substrates — Inspection and Testing … plus two panels: — Substrate End Users — Onshoring and Startups SEMI World Headquarters, 673 South Milpitas Blvd, Milpitas, California, United States, 95035

This is not the main BUSS registration site. To register, please visithttps://attend.ieee.org/buss/registration/ [] SEMI World Headquarters, 673 South Milpitas Blvd, Milpitas, California, United States, 95035