Building Enterprise IoT to scale out to millions of devices worldwide is a challenging problem. Enterprise IoT has various use cases all of which require creative ways of scaling. Join Abhishek Bhattacharyya, senior Technical Leader at Cisco to find out how the industry is adapting to some of the scaling challenges in terms of device ecosystem, device lifetime, and IoT infrastructure. Speaker(s): , Abhishek Bhattacharyya Agenda: 5:40 – 6:00 PM Arrival, Networking & Pizza 6:00 – 6:45 PM Presentation 6:45 – 7:00 PM Q&A Session 7:00 – 7:20 PM Closing Networking Room: 1308, Bldg: SCDI, 500 El Camino Real, Santa Clara , California, United States, 95053

Chiplets are now the standard way to design chips at leading-edge nodes for applications such as AI and high-performance computing. Obvious challenges include the new stage of heterogeneous integration, the new bus that connects the chiplets, and the new advanced packages that hold it all together. No more afterthoughts; packaging, test, integration, and manufacturing must all start right with the design. And design teams and foundry teams must work closely together to achieve the best result. Power, thermal, and other analyses must evaluate both individual chiplets and the system-as-a-whole (including the package). The foundry will play a larger role than ever before because it will generally provide a choice of packages and perform the integration, and it will need fully tested (known good) dies to avoid wasting time and money on chips that fail inspection. Speaker(s): Jawad Nasrullah, Room: 125, Bldg: Heafey, Santa Clara University, Santa Clara, California, United States, Virtual: https://events.vtools.ieee.org/m/477704