The IEEE SF & OEB Power & Energy Society (PES) Chapters invite you to join us on April 24, 2025 11:45 AM PDT, for a virtual Lunch-and-Learn PES Day event to hear Richard Hunt from Quanta Technology provide an Introduction to IEC 61850. Introduction to IEC 61850 IEC 61850 is a core standard for a smart grid, enabling data modeling of power system functions and sharing this data between applications using digital communications. IEC 61850 data can be used for dynamic equipment ratings to permit more load out of existing infrastructure, integrate renewable energy, detect falling conductors to reduce wildfire risks, even lower greenhouse gases by reducing the amount of copper wiring used in substations. This session will discuss the fundamentals of IEC 61850, including data model, communication methods, services, and configuration. Topics: - Why do we care about IEC 61850? - What does IEC 61850 do? - How does IEC 61850 work? At the end of the session, attendees should have a general understanding of IEC 61850. This session can be the starting point for further investigation into system and network architecture, testing, and implementing specific system functionality. Speaker(s): Rich Hunt, PE, Executive Advisor - Quanta Technology, Virtual: https://events.vtools.ieee.org/m/478617

The Analytical & Diagnostics Laboratory (ADL), an initiative under Binghamton University’s S3IP Center of Excellence, is a centralized, interdisciplinary research facility. Partnering with the Integrated Electronics Engineering Center (IEEC), a New York State Center for Advanced Technology, the ADL advances electronics packaging, reliability, and manufacturing research. Together, they drive innovation in systems integration, flexible electronics, renewable energy, and medical devices. Many industry partners collaborate with us for our advanced instrumentation, stress testing capability, and failure analysis expertise. In this talk, we will review several case studies that center around these topics in microelectronics. For example, in modern high-powered applications, electromigration which has been predominately a chip level phenomenon is now a concern for circuit boards with BGA sized features. We will show the progression from test vehicle design through stress evaluation into failure characterization. Another example centers around identification of an open circuit in a functional printed circuit board. We will further elaborate on techniques used to isolate failures and identify failure mechanisms as well as the relationship between these mechanisms and typical environmental stresses. See LOCATION tab for WebEx info Speaker(s): Jennifer Sammakia, Stephen Cain Agenda: See LOCATION tab for WebEx info Virtual: https://events.vtools.ieee.org/m/479386