[]The advent of 3D Heterogeneous Integration (3DHI) in advanced packaging and wafer-level IC packaging introduces significant challenges for inline defect inspection and offline failure analysis. The 3D stacking and wafer bonding processes create optically opaque structures, necessitating techniques like x-rays to penetrate multiple buried layers for defect detection. However, as device features in 3DHI continue to shrink (e.g., microbumps shrinking to <10 µm in diameter and TSV interconnects scaling to single-digit micrometers), existing non-destructive techniques face substantial technological barriers. Current 3D X-ray methods require higher resolutions to meet these evolving demands, and acquiring sub-micron imaging data using conventional x-ray tomography can take hours or be impractical for large 300 mm wafers. To bridge these metrology gaps, we have developed two innovative 3D x-ray inspection tools: 1. High Throughput (3D Data in Minutes): This tool is designed for the rapid inspection of 300 mm wafers during wafer-level packaging and bonding. It can automatically resolve various 3D defects down to 0.5 µm resolution within minutes. It is also capable of addressing high-resolution multi-chiplet inspections, large advanced packages or board-level failure analysis, such as for PCBs. 2. High Resolution (300 nm spatial Resolution): This complementary tool aims to surpass the resolution limits of current leading high-resolution 3D x-ray and x-ray microscopes (XRM) for the failure analysis of advanced heterogeneous packages. It delivers true 300 nm spatial resolution (<50 nm voxel) for characterizing submicron defects in microbumps, delamination, voids, interfacial cracks, and RDL that are beyond the capabilities of existing XRMs. Speaker(s): Wenbing Yun, Virtual: https://events.vtools.ieee.org/m/423135

IEEE Bay Area Summer Social Come join us for a fun Thursday evening at Ludwigs Biergarten Mountain View! Network with local IEEE young professionals and students in the area for internships, while enjoying delicious food and drinks. This in-person event is the perfect opportunity to relax, unwind, and connect with like-minded professionals in a casual setting. Don't miss out on this chance to make new friends and build connections to help you navigate the transition from student to working professional. First drink is on us, and we will provide appetizers to share. Price of admission (including drink and food) is $5 for young professionals and $3 for students/interns. See you there! Why Connect with Young Professionals? Getting involved with your local IEEE Young Professional (YP) organization is a great way to bridge the transition between academic life and a full-fledged professional career. A few key benefits of being involved in your local YP section include: - Networking Opportunities: IEEE YP events bring together like-minded individuals from diverse technical backgrounds. It's a perfect platform to expand your professional network, potentially connecting you with future collaborators, mentors, or employers. - Professional Development: Gain valuable insights and skills through workshops, seminars, and panel discussions tailored to enhance your professional growth. These events often cover topics ranging from technical advancements to career advancement strategies. - Transition from Student to Professional: For students/interns transitioning into full-time roles, IEEE YP provides a supportive environment helping navigate this crucial career phase successfully. - Friendship and Camaraderie: Beyond professional benefits, IEEE YP fosters friendships and camaraderie among its members. Building a strong network of peers who share your interests can make your professional journey more fulfilling and enjoyable. Public Transportaion and Parking There are multiple city parking lots and parking garages nearby. Moutain View Cal Train Station is with in walking distance to the venue. 383 Castro Street, Mountain View, California, United States, 94041