Quantum Dots for micro-LEDs: Direct nanoparticle lithography for next-gen energy efficient displays [] Abstract: NanoPattern Technologies is developing inorganic nanoparticle photoresists to enable the next generation of energy efficient electronics and displays. Using our photosensitive ligand technology, we have developed formulations to directly coat and pattern inorganic materials such as InP, CdSe, TiO2, and ZrO2 with no added vacuum or high temperature annealing steps. Because the nanoparticles are not diluted in a polymer matrix, our inorganic photoresists achieve close to 70% volume loading and retain properties close to the pure, fully dense material. As a result, properties like high optical absorption or high refractive index can be achieved while avoiding the multiple costly fabrication steps of vacuum deposition processes. We will describe a focused application on the advantages of our InP quantum dot color converter photoresists to enable next generation energy efficient displays. [] Bio: Dr. Danielle Chamberlin, CTO at NanoPattern Technologies, is an expert in optics and optoelectronics ranging from THz to the UV. Danielle has deep knowledge in the fields of LEDs and nanotechnology, having led down-converter R&D at Lumileds from 2009-2019. She holds over 15 patents on topics ranging from biosensors to microLEDs. Danielle holds a PhD and MS in Materials Science from UC Berkeley and an S.B. Degree in Materials Science from MIT. Bldg: ==> Use corner entrance: Kifer Road / San Lucar Court ==> Do not enter at main entrance on Kifer Road, EAG Labs, 810 Kifer Road, Sunnyvale, California, California, United States, 95051

[]In the field of silicon photonics, advanced packaging integration is key to achieving product performance. Flip chip attach of Silicon Photonics devices poses new challenges and limitations not encountered for flip chip attach and underfill of mainstream silicon devices. The first challenge in 2.5D silicon photonics die integration is its susceptibility to cracking during downstream reflow processing. The second challenge is to keep the edge-coupling waveguide facet of the silicon photonics die uncontaminated after all MCM assembly processes, for optical coupling. The third challenge is the post-reflow flip chip standoff variation and the underfill coverage under the silicon photonics die that affect optical coupling sensitivity between the edge-coupling waveguide and the planar lightwave circuit (PLC). We have successfully demonstrated flip chip attach of silicon photonics optical light engine (OLE) on an organic substrate using both thermocompression bonding and mass reflow processes with custom tooling to achieve defect-free and uniform standoff bonding of Pb-free flip chip bumps. Various underfill control methods were explored to achieve maximum coverage and avoid underfill creeping onto the waveguide facet. Furthermore, we achieved stable optical coupling post-stress testing. More investigation would be necessary to further improve coupling efficiency stability. Speaker(s): Pushkraj Tumne, Virtual: https://events.vtools.ieee.org/m/421351