Future Vision for Heterogeneous Integration from Global Perspectives, 2 days, 8 keynote talks, working groups ... When you get to the Visitor Parking area, staff will guide you to available section, and to the South Tower to check in and get ypour badge. Speaker(s): , , , Agenda: Wednesday February 21, 2024 1:00 pm to 4:00 pm Learning from the National Advanced Packaging Manufacturing Program (NAPMP) Keynote Presentation from Professor Subramanian S. Iyer, Director, National Advanced Packaging Manufacturing Program (NAPMP) Panel / Fireside Chat with three guest panelists Ajit Manocha - SEMI President Nicky Lu – CEO/ Founder ETRON Tim Lee – IEEE USA President Elect & Boeing Fellow Q&A from the floor Moderators: Ravi Mahajan & William Chen Thursday February 22, 2024 9:00 am to 12:00 noon Conference Opening Welcome HIR Technology Focus and Future Vision Keynote Speakers Dr Vincent (Woopoung) Kim (Samsung) “Advanced Packaging in the Era of HPC and AI” Alan Smith (AMD) “AMD InstinctTM MI300 Series Modular Chiplet Package – HPC and AI Accelerator for Exa-Class Systems” Carl McCants (Darpa) “Challenges and Opportunities in Manufacturing 3 dimentional Heterogeneously Integrated (3DHI) Microsystem” John Schreck & S.V. Sreenivasan (TIE UT Austin) “Creating a Wafer-level 3DHI R&D and Prototyping Facility” Lunch 1:15 pm to 4:30 pm HIR TWG Presentations Wine Tasting Friday February 23, 2024 Wei-Chung Lo/ Shih-Chieh Chang (EOSL-ITRI, Taiwan) “Collaboration in Advancing Advanced Packaging and Manufacturing in Heterogeneous Integration in ITRI” Bob Wisniewski (Samsung) “The Importance of Tight Coupling for Performance and Productivity” Josh Fryman (Intel) “Future architecture demands for more aggressive packaging” Erik Jung/ Albert Heuberger (Fraunhofer Institute Germany) "Advanced Heterogenous Integration as a core activity in the European ChipsJU Initiative" Lunch 1:15 pm to 4:30 pm HIR TWG Presentations HIR Town Hall * TWG Panel/ Teams Team 1 Thursday February 22, 2024 - - Aerospace & Defense: Tim Lee , Dan Blass - 5G Communications & Beyond: Tim Lee , Herbert Bennett - Thermal Management: Yin Hang, Madhu Iyengar, Azmat Malik, Weihua Tang - Co-Design: Jose E. Schutt-Aine - Test: Jeorge Hurtarte, Ken Butler - Integrated Power Electronics: Patrick McCluskey, Douglas Hopkins Team 2 Thursday February 22, 2024 - - High Performance Computing & Data Centers: Kanad Ghose, John Shalf - 2D-3D Interconnect: Ravi Mahajan - Modelling & Simulation: Chris Bailey , Xuejun Fan - Wafer Level Packaging: Rozalia Beica , - Automotive: Veer Dhandapani, Vikas Gupta - Additive Electronics Manufacturing: Kris Erickson Team 3 Friday February 23, 2024 - SiP & Module: Erik Jung, Rolf Aschenbrenner , Klaus Pressel - MEMS & Sensors Integration: Benson Chan, Mary-Ann Maher, Shafi Saiyed - Advanced Manufacturing & Multi Chip Integration Mark Gerber, Annette Teng & William Chen - Supply Chain: Kitty Pearsall, Melissa Grupen Shemansky Paul Trio , Siva Sivasankar - Integrated Photonics, Amr Helmy, Bill Bottoms - Cyber Security: Sohrab Aftabjahani Team 4 Friday February 23, 2024 - Medical, Health & Wearables: Mark Poliks , Jan Vardaman - IoT: Robert Lo Rockwell Hsu - Mobile: Benson Chan , William Chen - Reliability Abhijit Dasgupta, Richard Rao & Shubha Sahasrabudhe - Emerging Research Devices: Meyya Meyyapan Parking available onsite: follow signs WiFi available Samsung Electronics Campus, 3655 N First Street,, San Jose, California, United States, 95134