Future Vision for Heterogeneous Integration from Global Perspectives, 2 days, 8 keynote talks, working groups ... When you get to the Visitor Parking area, staff will guide you to available section, and to the South Tower to check in and get ypour badge. Speaker(s): , , , Agenda: Wednesday February 21, 2024 1:00 pm to 4:00 pm Learning from the National Advanced Packaging Manufacturing Program (NAPMP) Keynote Presentation from Professor Subramanian S. Iyer, Director, National Advanced Packaging Manufacturing Program (NAPMP) Panel / Fireside Chat with three guest panelists Ajit Manocha - SEMI President Nicky Lu – CEO/ Founder ETRON Tim Lee – IEEE USA President Elect & Boeing Fellow Q&A from the floor Moderators: Ravi Mahajan & William Chen Thursday February 22, 2024 9:00 am to 12:00 noon Conference Opening Welcome HIR Technology Focus and Future Vision Keynote Speakers Dr Vincent (Woopoung) Kim (Samsung) “Advanced Packaging in the Era of HPC and AI” Alan Smith (AMD) “AMD InstinctTM MI300 Series Modular Chiplet Package – HPC and AI Accelerator for Exa-Class Systems” Carl McCants (Darpa) “Challenges and Opportunities in Manufacturing 3 dimentional Heterogeneously Integrated (3DHI) Microsystem” John Schreck & S.V. Sreenivasan (TIE UT Austin) “Creating a Wafer-level 3DHI R&D and Prototyping Facility” Lunch 1:15 pm to 4:30 pm HIR TWG Presentations Wine Tasting Friday February 23, 2024 Wei-Chung Lo/ Shih-Chieh Chang (EOSL-ITRI, Taiwan) “Collaboration in Advancing Advanced Packaging and Manufacturing in Heterogeneous Integration in ITRI” Bob Wisniewski (Samsung) “The Importance of Tight Coupling for Performance and Productivity” Josh Fryman (Intel) “Future architecture demands for more aggressive packaging” Erik Jung/ Albert Heuberger (Fraunhofer Institute Germany) "Advanced Heterogenous Integration as a core activity in the European ChipsJU Initiative" Lunch 1:15 pm to 4:30 pm HIR TWG Presentations HIR Town Hall * TWG Panel/ Teams Team 1 Thursday February 22, 2024 - - Aerospace & Defense: Tim Lee , Dan Blass - 5G Communications & Beyond: Tim Lee , Herbert Bennett - Thermal Management: Yin Hang, Madhu Iyengar, Azmat Malik, Weihua Tang - Co-Design: Jose E. Schutt-Aine - Test: Jeorge Hurtarte, Ken Butler - Integrated Power Electronics: Patrick McCluskey, Douglas Hopkins Team 2 Thursday February 22, 2024 - - High Performance Computing & Data Centers: Kanad Ghose, John Shalf - 2D-3D Interconnect: Ravi Mahajan - Modelling & Simulation: Chris Bailey , Xuejun Fan - Wafer Level Packaging: Rozalia Beica , - Automotive: Veer Dhandapani, Vikas Gupta - Additive Electronics Manufacturing: Kris Erickson Team 3 Friday February 23, 2024 - SiP & Module: Erik Jung, Rolf Aschenbrenner , Klaus Pressel - MEMS & Sensors Integration: Benson Chan, Mary-Ann Maher, Shafi Saiyed - Advanced Manufacturing & Multi Chip Integration Mark Gerber, Annette Teng & William Chen - Supply Chain: Kitty Pearsall, Melissa Grupen Shemansky Paul Trio , Siva Sivasankar - Integrated Photonics, Amr Helmy, Bill Bottoms - Cyber Security: Sohrab Aftabjahani Team 4 Friday February 23, 2024 - Medical, Health & Wearables: Mark Poliks , Jan Vardaman - IoT: Robert Lo Rockwell Hsu - Mobile: Benson Chan , William Chen - Reliability Abhijit Dasgupta, Richard Rao & Shubha Sahasrabudhe - Emerging Research Devices: Meyya Meyyapan Parking available onsite: follow signs WiFi available Samsung Electronics Campus, 3655 N First Street,, San Jose, California, United States, 95134

Nanomaterial-Based Neural Implants with Stem Cells for the Treatment of Stroke ConductiveBio is developing advanced therapeutics for the treatment of stroke, the leading cause of death and disability worldwide. ________________________________ Nanomaterial-Based Neural Implants Combining Stem Cell Delivery with Electrical Stimulation for the Treatment of Stroke Dr. Michael Spaid, Founder and CEO, ConductiveBio Inc. In-Person Meeting. Register: (https://ieee.us6.list-manage.com/track/click?u=4f23d76911d28dcc51bf71bce&id=402af34b1f&e=64f32f76c7) Thurs Feb 22 11:30am: Networking & Pizza Noon-1PM: Seminar Cost: $4 to $6 Location: EAG Laboratories - 810 Kifer Road, Sunnyvale ==> Use corner entrance: Kifer Road / San Lucar Court ==> Do not enter at main entrance on Kifer Road ConductiveBio is developing advanced therapeutics for the treatment of stroke, the leading cause of death and disability worldwide. Currently, medical interventions for stroke are limited to within the first 24 hours, leaving many patients without viable treatment options. Our innovative stroke therapy approach combines stem cell transplantation with electrical stimulation, opening the possibility of extended treatment windows beyond the current 24-hour limitation. Stem cells are delivered near the stroke center on a nanomaterial-based conductive bioscaffold that enables in-vivo electrical stimulation, and provides an ideal neural environment for cell growth and proliferation. ConductiveBio’s bioscaffolding platform integrates a mesh of metal nanowires with a tissue-mimicking nanostructured biopolymer on flexible and transparent support. Stem cells seeded on the bioscaffold attach to the biopolymer and are electrically stimulated, inducing the production of key cell signaling and neurotrophic factors that promote healing. ConductiveBio has designed an in-vitro bioscaffolding platform tailored to identify and optimize cell stimulation conditions. The design, structure, and properties of this platform will be discussed in detail. Read more: (https://ieee.us6.list-manage.com/track/click?u=4f23d76911d28dcc51bf71bce&id=aa9a718da4&e=64f32f76c7) (https://ieee.us6.list-manage.com/track/click?u=4f23d76911d28dcc51bf71bce&id=b5c26b83dd&e=64f32f76c7) Michael Spaid, Ph.D., is the founder and CEO of ConductiveBio Incorporated, an early-stage start-up focused on developing novel combination medical devices for the treatment of stroke. ConductiveBio’s flexible circuit technology was in-licensed from his previous company Cambrios where he served as CTO. Cambrios commercialized the world’s first transparent conductor based on silver nanowires, now ubiquitous in smart phones, tablets, and large-area displays for touch sensing applications. Prior to his venture at Cambrios, Michael served as the Director of Microfluidics Engineering at Caliper Life Sciences, managing the team responsible for conceiving and designing the company’s microfluidic chips. His professional journey also includes a stint as a project engineer at Corning, Inc. and as an NRC Postdoctoral Fellow at the National Institute of Standards and Technology where he developed modeling techniques for simulating complex multi-component immiscible flows using the Lattice Boltzmann Method. He received his BS from Tulane University, and his MS and Ph.D. degrees from Stanford University in chemical engineering. Bldg: Use corner entrance: Kifer Rd. / San Lucar Ct.=> Do use main entrance on Kifer Rd.,, EAG Laboratories, 810 Kifer Road, Sunnyvale, California, United States, 94086