Rugged Packaging Solutions for Radar Sensors in Diverse Applications and Environments Advances in mmWave technology have ushered in an era of high-resolution radar systems that are compact enough to be incorporated into our everyday lives. With the proliferation of 77GHz automotive radar and the recent extension of the unlicensed 60GHz band by the FCC, radars are poised to become a key technology in our increasingly connected and autonomous world. These sensors will permeate many industries, including automotive and autonomous vehicles to agriculture, mining, heavy machinery automation, building surveillance, indoor infrastructure management, and people tracking. Consumer devices such as smart devices, home security systems, and AR/VR applications will also see significant radar adoption. The high frequency of operation (57-81GHz) and diverse usage from rugged, safety-critical industrial environments to compact consumer electronics for low power applications brings unique challenges in radar development and packaging. The EM wave interaction between the antenna and its packaging, alongside managing thermal and size constraints, are among the many issues we have in mmWave radar packaging. This talk will first provide a brief introduction to the usage, operational theory, and components of modern mmWave radar. Then, we will dive into the considerations, challenges, and solutions surrounding radar development and packaging in modern high-performance applications. Speaker(s): Mo, David SEMI World Hdqtrs, 673 S Milpitas Blvd, Milpitas, California, United States, 95035, Virtual: https://events.vtools.ieee.org/m/364441

Please plan to attend this meeting of the Industry Applications Society. The Speaker will be Pavi Gopinath, Application Protection Engineer at Schweitzer Engineering Laboratory. Increasing distributed energy resource (DER) interconnection on the distribution electric power system (EPS) requires more industry knowledge of how to properly protect these applications and meet requirements laid out in industry standards. In this session, participants will learn how to apply protection at the point of common coupling. Agenda: - Demonstrate need for anti-islanding at POI. - Propose protection scheme for system protection at POI. - Provide settings guidelines for advanced anti-islanding detection elements. - Examine successful scheme operation. Speaker(s): Pavi Gopinath, Application Protection Engineer at Schweitzer Engineering Laboratory, Agenda: Time: No-host social at 5:30 pm; Presentation at 6:15pm; Dinner at 7:15 pm.Presentation continues at 8:00 pm; Adjourn by 9:00 pm. Place: Zio Fraedo’s, 611 Gregory Lane, Pleasant Hill. Call 925-933-9091 if you need directions. RSVP: Please make reservations by September 20 by contacting Luis Soria via email: [email protected] or telephone: (415) 793-7909 611 Gregory Lane, Pleasant Hill, California, United States

Abstract: Antennas are crucial components of a wireless communication system. Increasing operational frequency results in the miniaturization of the antenna size. Millimeter-wave (mmWave) and terahertz (THz) antennas can thereby be designed on-chip or in a semiconductor package. This talk outlines the key design considerations of mmWave and THz antennas. Trends in antenna integration and comparison of antenna design in applications including 5G, 6G, and radar, will be presented. The talk will conclude with design techniques for improved antenna radiation performance and overall system efficiency. Biography: Harshpreet Bakshi received the B.Tech. degree in electronics and telecommunication engineering from Bharati Vidyapeeth University, India, in 2015 followed by the M.S. and Ph.D. degrees in electrical engineering from The University of Texas at Dallas in 2018 and 2022, respectively. Between 2015 and 2022, he worked at Idea Cellular Ltd., CommScope Inc., Apple Inc., and at the Texas Analog Center of Excellence. He is presently with the Semiconductor Packaging Platform Technology R&D organization at Texas Instruments Inc. His research interests include mmWave and THz antenna design, semiconductor packaging, and system design. Dr. Bakshi is a Senior Member of the IEEE and serves as a reviewer of several journals and conferences of the IEEE AP-S, MTT-S, and EP-S, and has held leadership positions at the IEEE EP-S Dallas and SSC-S UTD chapters. Registration: Please register on vTools. Zoom videoconference: https://us02web.zoom.us/j/85122821344?pwd=TENTalZVSHJSckdPS0E4bGhzWmpNQT09 Meeting ID: 851 2282 1344 Passcode: 858482 Virtual: https://events.vtools.ieee.org/m/372033