Electronics, power electronics, and electric machines are becoming important for an array of mobility/transportation, renewable energy and energy efficiency applications. In this presentation, I will provide an introduction to NREL and my group’s research activities. Then, I will describe some challenges and opportunities for power electronics, electric machines and electric traction drive systems for mobility applications in particular. The first area covered in detail will be power electronics thermal management with water-ethylene glycol and dielectric fluids in the single-phase liquid regime and dielectric fluids/refrigerants in the two-phase/boiling regime. The second area will be power electronics materials and bonded interfaces including efforts on sintered silver, sintered copper, polyamide- and polyimide-based bonded interface materials, and polyimide-based electrically insulating materials. Some advanced power electronics packaging concepts will also be introduced. I will then cover our group’s efforts related to electric motor thermal management with focus on motor materials and interfaces thermal modeling and characterization, fluid-based cooling technologies development and characterization, and thermal-fluids modeling to help design and develop advanced reduced-rare-earth electric motors. Finally, I will present our efforts related to integrated electric drive system approaches and thermal management in support of these integration approaches. Speaker(s): Sreekant Narumanchi, SEMI World Hdqtrs, 673 South Milpitas Blvd, Milpitas, California, United States, 95035, Virtual: https://events.vtools.ieee.org/m/363151

Abstract: Signal Integrity is critical to the design of high-performing and reliable semiconductor products. As the data rates increase rapidly in high-speed systems, the signal integrity has become a key factor to meet the bandwidth growth intensified by various applications. In this presentation, we will start with the review of the basics of signal integrity and examine the key electrical characteristics of interconnects: signal loss, signal crosstalk, return loss, mode conversion and other important factors necessary to meet the performance requirements of the latest electronic systems. Then, the interactions between the signaling, clocking, equalization and modulation of the various interfaces will be discussed to explain how those interactions determine the achievable data rates. Finally, the presentation will be concluded by reviewing various signal integrity modeling and simulation techniques. Biography: Dr. Wendem T. Beyene was born in Addis Ababa, Ethiopia. He received the B.S. and M.S. degrees in electrical engineering from Columbia University, New York, NY, USA, in 1988 and 1991, respectively, and the Ph.D. degree in electrical and computer engineering from the University of Illinois at Urbana-Champaign, USA, in 1997. In the past, he was employed by IBM, Hewlett-Packard, and Agilent Technologies. In 2000, he joined Rambus Inc., Los Altos, CA, USA, and was responsible for signal integrity of multi-gigabit parallel and serial interfaces. During 2017-2020 he worked at Intel and was responsible for signal and power integrity analysis of high-performance FPGA including fabric and high-speed I/O subsystems as well as I/O modeling. In 2020 he joined Facebook (Meta Platforms) as an Analog & Mixed-Signal Architect in Meta Reality Lab. Dr. Beyene has authored numerous refereed IEEE publications in various disciplines including package and interconnect modeling, interface design and analysis as well as application of machine learning and optimization techniques to signal and power integrity of complex systems. He is currently a Senior Area Editor - Electrical Performance of Integrated Systems of IEEE Trans. On CPMT and is a Senior Member of IEEE. He also has served as distinguished lecturer for IEEE EMCS (Electromagnetic Compatibility Society) and IEEE EPS (Electrical Packaging Society). Co-sponsored by: CH06184 Speaker(s): , Wendem Beyene Bldg: 1st Floor, Cupertino Public Library, Cupertino, California, United States, 95014