Interconnect Reliability in Advanced Packaging and Heterogeneous Integration (no fee)

Birck Nanotechnology Center #1001, 1205 W State St, West Lafayette, Indiana, United States, Virtual: https://events.vtools.ieee.org/m/370292

In advanced packaging, as newer forms of interconnects emerge to meet the demand for high density and high performance, interconnect reliability is becoming more complex and more critical. Finer pitch interconnects in advanced packaging are more susceptible to failures due to electromigration, interfacial reactions etc. Wafer level packaging, Cu direct bonding and other advanced packaging technologies, present new considerations in interconnect reliability. At the same time, the growing adoption of heterogeneous integration leads to increased diversity of interconnects (with different geometries, materials, and interfaces) in the same package, with complex (and often interactive) reliability failure modes and mechanisms. As electronic products become more pervasive in application, interconnect reliability must be considered holistically with regard to environmental conditions, from thermal, mechanical, and thermomechanical, to electrical and electrochemical. High frequency applications demand considerations of interconnect materials for signal integrity. High thermal density and high current density can have increased impact on interconnect reliability. These considerations will impact reliability engineering for semiconductor devices, from design for reliability, to accelerated testing and analysis. Meanwhile, sustainability of electronic products demands environmentally friendly materials and processes. Understanding of the failure mechanisms for different interconnect materials at various levels (wafer, chip, package, and system) of the semiconductor package is of great importance to interconnect reliability in advanced packaging and heterogeneous integration. Speaker(s): Dongkai Shangguan, , Birck Nanotechnology Center #1001, 1205 W State St, West Lafayette, Indiana, United States, Virtual: https://events.vtools.ieee.org/m/370292

CIT Summer Series – Jon Peddie – The History of Visual Magic in Computers: How Beautiful Images are Made in CAD, 3D, VR and AR

Virtual: https://events.vtools.ieee.org/m/364008

This is a weekly session of the CIT Summer Series, with Jon Peddle presenting The History of Visual Magic in Computers: How Beautiful Images are Made in CAD, 3D, VR and AR : If you have ever looked at a fantastic adventure or science fiction movie, or an amazingly complex and rich computer game, or a TV commercial where cars or gas pumps or biscuits behaved liked people and wondered, “How do they do that?”, then you’ve experienced the magic of 3D worlds generated by a computer. 3D in computers began as a way to represent automotive designs and illustrate the construction of molecules. 3D graphics use evolved to visualizations of simulated data and artistic representations of imaginary worlds. In order to overcome the processing limitations of the computer, graphics had to exploit the characteristics of the eye and brain, and develop visual tricks to simulate realism. The goal is to create graphics images that will overcome the visual cues that cause disbelief and tell the viewer this is not real. Thousands of people over thousands of years have developed the building blocks and made the discoveries in mathematics and science to make such 3D magic possible, and The History of Visual Magic in Computers is dedicated to all of them and tells a little of their story. It traces the earliest understanding of 3D and then foundational mathematics to explain and construct 3D; from mechanical computers up to today’s tablets. Several of the amazing computer graphics algorithms and tricks came of periods where eruptions of new ideas and techniques seem to occur all at once. Applications emerged as the fundamentals of how to draw lines and create realistic images were better understood, leading to hardware 3D controllers that drive the display all the way to stereovision and virtual reality. Maps the history of the techniques behind science fiction movies, complex and rich computer games, and TV commercials capable of making cars, gas pumps and biscuits behave like human beings. Speaker(s): Dr. Jon Peddie, Virtual: https://events.vtools.ieee.org/m/364008