Glass, with its manifold compositional tweaking, offers the widest possible range of attributes and properties relevant to carrier performance in wafer thinning as well as in advanced packaging. In this presentation, we will first focus on the topic of wafer ultra-thinning of semiconducting as well as piezo materials. We will demonstrate that the desire for thinner substrates can be realized with 1) carriers that exhibit extremely low total thickness variation (TTV), and 2) an associated temporary bonding method that presents extremely low thickness variation as well. The combination of Corning’s recently announced ultra-low TTV carriers with near-zero TTV bonding methods has proven to be a powerful tool to guarantee high precision thinning of various wafer types. On the topic of carrier properties, the coefficient of thermal expansion (CTE) plays a major role in the control of in-process warpage in buildup structures such as fan-out wafer level packaging and multi-layer laminates. We will present several use cases when specifically-tuned CTE is advantageous to reduce stress within a given process environment. Corning’s Advanced Packaging Carrier (APC) product family offers glass wafers with CTE that varies from 4.9-12.6 ppm/C with fine granularity of 0.2 ppm/C, in addition to silicon-matched glasses with a CTE of 3.4 and other glass types that go all the way down to 0 ppm/C. This portfolio enables the right choice of glass for each and every application to optimize processability. Speaker(s): Julia Brueckner, Virtual: https://events.vtools.ieee.org/m/353525

Road transportation, which accounts for 22 percent of greenhouse gas emissions, is undergoing a major transformation with the advent of ridesharing, autonomous driving, and vehicle electrification. Collectively these technologies, in conjunction with renewable sources of electricity, have the potential to dramatically reduce the negative impact of road transportation on the health of the planet. The successful convergence of these technologies will require electric vehicles that are low cost and fully autonomous. These attributes can be realized through dynamic wireless charging. However, this will require wireless charging technology that is well beyond current capabilities and opens new areas of research related to power and transportation infrastructure. Using examples from research on capacitive wireless charging (as opposed to the more common inductive techniques), which leverage very high frequency power electronics, this talk will highlight the opportunities and challenges in dynamic wireless charging of electric vehicles. Speaker(s): Dr Khurram Afridi 440 N Wolfe Rd, Sunnyvale, California, United States, 94085, Virtual: https://events.vtools.ieee.org/m/356408