Fan-out Wafer and Panel Level Packaging are gaining relevance as high-volume-compatible advanced packaging technologies. Providing technical advantages and optimized cost for manifold applications, FOWLP and PLP are fundamentally changing the packaging infrastructure. In the past, OSATs dominated high-volume manufacturing, but recently new players in packaging such as semiconductor foundries, PCB or LCD manufacturing companies entered this business area and are changing not only supply chains but also form factors towards larger areas. However, materials are playing an important role especially for future applications such as RF, power or advanced computing applications. In addition, materials are also a key factor for cost and sustainability. In summary, the presentation will discuss recent technical developments as well as the changing ecosystem and actual advantages and challenges when moving to large-panel-level manufacturing. Speaker(s): Tanja Braun, Virtual: https://events.vtools.ieee.org/m/353528

Plastic production has outgrown most other manmade materials, with more than 99% of them being petroleum-based and nonbiodegradable. Conventional plastics are difficult to recycle and persist in the environment for hundreds of years, causing great environmental concerns. In addition, the dependence on crude oil makes the plastics industry unsustainable and renders the plastics market vulnerable to oil price volatility. Therefore, there is a growing interest in developing sustainable alternatives to conventional plastics. Particularly, the electronics industry is making a switch to greener alternatives to reduce greenhouse gas emissions, lower product environmental footprints, and build positive marketing image. Here, we present a perspective on the advancement of bioplastic sustainable alternatives and the challenges and advantages associated with their potential use in electronics. Speaker(s): Yael Vodovotz, Virtual: https://events.vtools.ieee.org/m/353539